SSI73K322L-28IC datasheet, PDF

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SSI73K322L-28IC: DescriptionModem, CMOS, CDIP28; CategoryWireless rf/communication Telecom circuit; File Size2MB，27 Pages; ManufacturerSilicon Systems Inc.

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SSI73K322L-28IC Overview

Modem, CMOS, CDIP28

SSI73K322L-28IC Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Silicon Systems Inc.
package instruction	DIP, DIP28,.6
Reach Compliance Code	unknown
JESD-30 code	R-XDIP-T28
JESD-609 code	e0
Number of terminals	28
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Package body material	CERAMIC
encapsulated code	DIP
Encapsulate equivalent code	DIP28,.6
Package shape	RECTANGULAR
Package form	IN-LINE
power supply	5 V
Certification status	Not Qualified
Maximum slew rate	10 mA
Nominal supply voltage	5 V
surface mount	NO
technology	CMOS
Telecom integrated circuit types	MODEM
Temperature level	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL

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SSI73K322L-28IC Related Products

	SSI73K322L-28IC	73K322LS-IP	SSI73K322L-22IC	SSI73K322L-22IP	SSI73K322L-28IH	SSI73K322L-28IP
Description	Modem, CMOS, CDIP28	Modem, CMOS, PDIP22	Modem, CMOS, CDIP22	Modem, CMOS, PDIP22	Modem, CMOS, PQCC28	Modem, CMOS, PDIP28
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Maker	Silicon Systems Inc.	Silicon Systems Inc.	Silicon Systems Inc.	Silicon Systems Inc.	Silicon Systems Inc.	Silicon Systems Inc.
package instruction	DIP, DIP28,.6	DIP, DIP22,.4	DIP, DIP22,.4	DIP, DIP22,.4	QCCJ, LDCC28,.5SQ	DIP, DIP28,.6
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown
JESD-30 code	R-XDIP-T28	R-PDIP-T22	R-XDIP-T22	R-PDIP-T22	S-PQCC-J28	R-PDIP-T28
JESD-609 code	e0	e0	e0	e0	e0	e0
Number of terminals	28	22	22	22	28	28
Maximum operating temperature	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
Package body material	CERAMIC	PLASTIC/EPOXY	CERAMIC	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	DIP	DIP	DIP	DIP	QCCJ	DIP
Encapsulate equivalent code	DIP28,.6	DIP22,.4	DIP22,.4	DIP22,.4	LDCC28,.5SQ	DIP28,.6
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	SQUARE	RECTANGULAR
Package form	IN-LINE	IN-LINE	IN-LINE	IN-LINE	CHIP CARRIER	IN-LINE
power supply	5 V	5 V	5 V	5 V	5 V	5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum slew rate	10 mA	10 mA	10 mA	10 mA	10 mA	10 mA
Nominal supply voltage	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	NO	NO	NO	NO	YES	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Telecom integrated circuit types	MODEM	MODEM	MODEM	MODEM	MODEM	MODEM
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	J BEND	THROUGH-HOLE
Terminal pitch	2.54 mm	2.54 mm	2.54 mm	2.54 mm	1.27 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	QUAD	DUAL

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