|
CA91C078-33MG |
CA91C078-33CG |
CA91C078-40CQ |
CA91C078-40CG |
CA91C078-25IQ |
CA91C078-25MG |
| Description |
Bus Controller, CPGA299, |
VME Bus Controller, CMOS, CPGA299, CAVITY-DOWN, CERAMIC, PGA-299 |
VME Bus Controller, CMOS, PQFP304, PLASTIC, QFP-304 |
VME Bus Controller, CMOS, CPGA299, CAVITY-DOWN, CERAMIC, PGA-299 |
VME Bus Controller, CMOS, PQFP304, PLASTIC, QFP-304 |
Bus Controller, CPGA299, |
| Is it Rohs certified? |
incompatible |
incompatible |
incompatible |
incompatible |
incompatible |
incompatible |
| Maker |
Tundra Semiconductor Corp |
Tundra Semiconductor Corp |
Tundra Semiconductor Corp |
Tundra Semiconductor Corp |
Tundra Semiconductor Corp |
Tundra Semiconductor Corp |
| Reach Compliance Code |
unknown |
unknown |
unknown |
unknown |
unknown |
unknown |
| JESD-30 code |
S-XPGA-P299 |
S-CPGA-P299 |
S-PQFP-G304 |
S-CPGA-P299 |
S-PQFP-G304 |
S-XPGA-P299 |
| Number of terminals |
299 |
299 |
304 |
299 |
304 |
299 |
| Maximum operating temperature |
125 °C |
70 °C |
70 °C |
70 °C |
85 °C |
125 °C |
| Package body material |
CERAMIC |
CERAMIC, METAL-SEALED COFIRED |
PLASTIC/EPOXY |
CERAMIC, METAL-SEALED COFIRED |
PLASTIC/EPOXY |
CERAMIC |
| encapsulated code |
PGA |
PGA |
FQFP |
PGA |
FQFP |
PGA |
| Encapsulate equivalent code |
PGA299,20X20 |
PGA299,20X20 |
QFP304,1.7SQ,20 |
PGA299,20X20 |
QFP304,1.7SQ,20 |
PGA299,20X20 |
| Package shape |
SQUARE |
SQUARE |
SQUARE |
SQUARE |
SQUARE |
SQUARE |
| Package form |
GRID ARRAY |
GRID ARRAY |
FLATPACK, FINE PITCH |
GRID ARRAY |
FLATPACK, FINE PITCH |
GRID ARRAY |
| power supply |
5 V |
5 V |
5 V |
5 V |
5 V |
5 V |
| Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
| Nominal supply voltage |
5 V |
5 V |
5 V |
5 V |
5 V |
5 V |
| surface mount |
NO |
NO |
YES |
NO |
YES |
NO |
| Temperature level |
MILITARY |
COMMERCIAL |
COMMERCIAL |
COMMERCIAL |
INDUSTRIAL |
MILITARY |
| Terminal form |
PIN/PEG |
PIN/PEG |
GULL WING |
PIN/PEG |
GULL WING |
PIN/PEG |
| Terminal pitch |
2.54 mm |
2.54 mm |
0.5 mm |
2.54 mm |
0.5 mm |
2.54 mm |
| Terminal location |
PERPENDICULAR |
PERPENDICULAR |
QUAD |
PERPENDICULAR |
QUAD |
PERPENDICULAR |
| package instruction |
- |
CAVITY-DOWN, CERAMIC, PGA-299 |
PLASTIC, QFP-304 |
CAVITY-DOWN, CERAMIC, PGA-299 |
PLASTIC, QFP-304 |
- |
| Address bus width |
- |
32 |
32 |
32 |
32 |
- |
| Bus compatibility |
- |
68030; 68040 |
68030; 68040 |
68030; 68040 |
68030; 68040 |
- |
| maximum clock frequency |
- |
33 MHz |
40 MHz |
40 MHz |
25 MHz |
- |
| External data bus width |
- |
32 |
32 |
32 |
32 |
- |
| JESD-609 code |
- |
e0 |
e0 |
e0 |
e0 |
e0 |
| length |
- |
52.324 mm |
40 mm |
52.324 mm |
40 mm |
- |
| Peak Reflow Temperature (Celsius) |
- |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
- |
| Maximum seat height |
- |
5.0546 mm |
4.5 mm |
5.0546 mm |
4.5 mm |
- |
| Maximum supply voltage |
- |
5.25 V |
5.25 V |
5.25 V |
5.25 V |
- |
| Minimum supply voltage |
- |
4.75 V |
4.75 V |
4.75 V |
4.75 V |
- |
| technology |
- |
CMOS |
CMOS |
CMOS |
CMOS |
- |
| Terminal surface |
- |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
| Maximum time at peak reflow temperature |
- |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
- |
| width |
- |
52.324 mm |
40 mm |
52.324 mm |
40 mm |
- |
| uPs/uCs/peripheral integrated circuit type |
- |
BUS CONTROLLER, VME |
BUS CONTROLLER, VME |
BUS CONTROLLER, VME |
BUS CONTROLLER, VME |
- |
| Base Number Matches |
- |
1 |
1 |
1 |
1 |
- |