Maximum Instantaneous Forward Voltage Drop (Note 2)
(i
F
= 3 Amps, T
C
= 25°C)
(i
F
= 3 Amps, T
C
= 125°C)
(i
F
= 6 Amps, T
C
= 25°C)
(i
F
= 6 Amps, T
C
= 125°C)
Maximum Instantaneous Reverse Current (Note 2)
(T
J
= 25°C, Rated dc Voltage)
(T
J
= 125°C, Rated dc Voltage)
Maximum Reverse Recovery Time
(I
F
= 1 Amp, di/dt = 50 Amps/ms, V
R
= 30 V, T
J
= 25°C)
(I
F
= 0.5 Amp, i
R
= 1 Amp, I
REC
= 0.25 A, V
R
= 30 V, T
J
= 25°C)
2. Pulse Test: Pulse Width = 300
ms,
Duty Cycle
≤
2.0%.
Symbol
v
F
Value
1
0.96
1.2
1.13
5
250
35
25
mA
Unit
V
i
R
t
rr
ns
100
I
R
, REVERSE CURRENT (mA)
70
50
30
i , INSTANTANEOUS FORWARD CURRENT (AMPS)
F
20
100
10
1
0.1
0.01
0.001
150°C
T
J
= 175°C
100°C
25°C
10
7.0
5.0
3.0
175°C
2.0
150°C
1.0
0.7
0.5
0.3
0.2
T
J
= 25°C
0.0001
0
20
40
60 80 100 120 140 160 180 200
V
R
, REVERSE VOLTAGE (V)
Figure 2. Typical Leakage Current* (Per Leg)
* The curves shown are typical for the highest voltage device in the
voltage grouping. Typical reverse current for lower voltage selections
can be estimated from these curves if V
R
is sufficiently below rated
V
R
.
PF(AV) , AVERAGE POWER DISSIPATION (WATTS)
14
13
12
11
10
9.0
8.0
7.0
6.0
5.0
4.0
3.0
2.0
1.0
0
5.0
10
I
PK
/I
AV
= 20
SINE
WAVE
dc
100°C
SQUARE
WAVE
T
J
= 175°C
0.1
0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
v
F,
INSTANTANEOUS VOLTAGE (V)
0
1.0
2.0
3.0
4.0
5.0
6.0
7.0
8.0
9.0
10
Figure 1. Typical Forward Voltage (Per Leg)
I
F(AV)
, AVERAGE FORWARD CURRENT (A)
Figure 3. Average Power Dissipation (Per Leg)
http://onsemi.com
2
MURD620CT
IF(AV) , AVERAGE FORWARD CURRENT (AMPS)
RATED VOLTAGE APPLIED
R
qJC
= 9°C/W
T
J
= 175°C
5.0
dc
4.0
3.0
2.0
1.0
0
100
110
120
130
140
150
160
170
180
T
C
, CASE TEMPERATURE (°C)
SINE WAVE
OR
SQUARE WAVE
IF(AV) , AVERAGE FORWARD CURRENT (AMPS)
8.0
7.0
6.0
4.0
3.5
3.0
2.5
2.0
dc
1.5
1.0
0.5
0
0
20
40
60
80
100
120
140
160
180 200
T
A
, AMBIENT TEMPERATURE (°C)
SINE WAVE
OR
SQUARE WAVE
T
J
= 175°C
SURFACE MOUNTED ON
MIN. PAD SIZE RECOMMENDED
RATED VOLTAGE APPLIED
R
qJA
= 80°C/W
Figure 4. Current Derating, Case (Per Leg)
Figure 5. Current Derating, Ambient (Per Leg)
100
T
J
= 25°C
C, CAPACITANCE (pF)
10
1
0
10
20
30
40
50
60
70
80
90
100
V
R
, REVERSE VOLTAGE (V)
Figure 6. Typical Capacitance (Per Leg)
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3
MURD620CT
PACKAGE DIMENSIONS
DPAK (SINGLE GAUGE)
CASE 369C−01
ISSUE D
A
B
C
A
c2
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCHES.
3. THERMAL PAD CONTOUR OPTIONAL WITHIN DI-
MENSIONS b3, L3 and Z.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS, OR BURRS. MOLD
FLASH, PROTRUSIONS, OR GATE BURRS SHALL
NOT EXCEED 0.006 INCHES PER SIDE.
5. DIMENSIONS D AND E ARE DETERMINED AT THE
OUTERMOST EXTREMES OF THE PLASTIC BODY.
6. DATUMS A AND B ARE DETERMINED AT DATUM
PLANE H.
DIM
A
A1
b
b2
b3
c
c2
D
E
e
H
L
L1
L2
L3
L4
Z
INCHES
MIN
MAX
0.086 0.094
0.000 0.005
0.025 0.035
0.030 0.045
0.180 0.215
0.018 0.024
0.018 0.024
0.235 0.245
0.250 0.265
0.090 BSC
0.370 0.410
0.055 0.070
0.108 REF
0.020 BSC
0.035 0.050
−−−
0.040
0.155
−−−
MILLIMETERS
MIN
MAX
2.18
2.38
0.00
0.13
0.63
0.89
0.76
1.14
4.57
5.46
0.46
0.61
0.46
0.61
5.97
6.22
6.35
6.73
2.29 BSC
9.40 10.41
1.40
1.78
2.74 REF
0.51 BSC
0.89
1.27
−−−
1.01
3.93
−−−
E
b3
L3
1
4
D
2
3
Z
DETAIL A
H
L4
b2
e
b
0.005 (0.13)
M
c
C
L2
GAUGE
PLANE
H
C
L
L1
DETAIL A
SEATING
PLANE
A1
ROTATED 90 CW
5
SOLDERING FOOTPRINT*
6.20
0.244
3.00
0.118
2.58
0.102
5.80
0.228
1.60
0.063
6.17
0.243
SCALE 3:1
mm
inches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor
and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
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