E13C7H2F-156.250M
Series
RoHS Compliant (Pb-free) 3.3V 6 Pad 5mm x 7mm
Ceramic SMD LVPECL Oscillator
Frequency Tolerance/Stability
±50ppm Maximum over -40°C to +85°C
Duty Cycle
50 ±5(%)
RoHS
Pb
E13C7 H 2 F -156.250M
Nominal Frequency
156.250MHz
Logic Control / Additional Output
Tri-State and Complementary Output
ELECTRICAL SPECIFICATIONS
Nominal Frequency
Frequency Tolerance/Stability
156.250MHz
±50ppm Maximum over -40°C to +85°C (Inclusive of all conditions: Calibration Tolerance (at 25°C),
Frequency Stability over the Operating Temperature Range, Supply Voltage Change, Output Load Change,
First Year Aging at 25°C, Shock, and Vibration)
+3.3Vdc ±5%
75mA Maximum
Vcc-1.025Vdc Minimum from 0°C to +85°C, Vcc-1.085Vdc Minimum from -40°C to +0°C
Vcc-1.620Vdc Maximum from 0°C to +85°C, Vcc-1.555Vdc Maximum from -40°C to +0°C
300pSec Typical, 700pSec Maximum (Measured at 20% to 80% of Waveform)
50 ±5(%) (Measured at 50% of Waveform)
50 Ohms into Vcc-2.0Vdc
LVPECL
-60dBc/Hz at 10Hz Offset, -95dBc/Hz at 100Hz Offset, -125dBc/Hz at 1kHz Offset, -143dBc/Hz at 10kHz
Offset, -145dBc/Hz at 100kHz Offset, -145dBc/Hz at 1MHz Offset, -146dBc/Hz at 10MHz Offset (All Values
are Typical, Fo=156.250MHz)
Tri-State and Complementary Output
Vih of 70% of Vcc Minimum or No Connect to Enable Output and Complementary Output, Vil of 30% of Vcc
Maximum to Disable High Impedance Output and Complementary Output
30µA Maximum (Without Load)
0.4pSec Typical, 1pSec Maximum (Fj=12kHz to 20MHz)
10mSec Maximum
-55°C to +125°C
Supply Voltage
Input Current
Output Voltage Logic High (Voh)
Output Voltage Logic Low (Vol)
Rise/Fall Time
Duty Cycle
Load Drive Capability
Output Logic Type
Phase Noise
Logic Control / Additional Output
Tri-State Input Voltage (Vih and Vil)
Standby Current
RMS Phase Jitter
Start Up Time
Storage Temperature Range
ENVIRONMENTAL & MECHANICAL SPECIFICATIONS
ESD Susceptibility
Fine Leak Test
Flammability
Gross Leak Test
Mechanical Shock
Moisture Resistance
Moisture Sensitivity
Resistance to Soldering Heat
Resistance to Solvents
Solderability
Temperature Cycling
Vibration
MIL-STD-883, Method 3015, Class 1, HBM: 1500V
MIL-STD-883, Method 1014, Condition A
UL94-V0
MIL-STD-883, Method 1014, Condition C
MIL-STD-883, Method 2002, Condition B
MIL-STD-883, Method 1004
J-STD-020, MSL 1
MIL-STD-202, Method 210, Condition K
MIL-STD-202, Method 215
MIL-STD-883, Method 2003
MIL-STD-883, Method 1010, Condition B
MIL-STD-883, Method 2007, Condition A
www.ecliptek.com | Specification Subject to Change Without Notice | Rev H 2/13/2010 | Page 1 of 5
E13C7H2F-156.250M
Recommended Solder Reflow Methods
T
P
Critical Zone
T
L
to T
P
Ramp-up
Ramp-down
Temperature (T)
T
L
T
S
Max
T
S
Min
t
S
Preheat
t 25°C to Peak
t
L
t
P
Time (t)
Low Temperature Infrared/Convection 240°C
T
S
MAX to T
L
(Ramp-up Rate)
Preheat
- Temperature Minimum (T
S
MIN)
- Temperature Typical (T
S
TYP)
- Temperature Maximum (T
S
MAX)
- Time (t
S
MIN)
Ramp-up Rate (T
L
to T
P
)
Time Maintained Above:
- Temperature (T
L
)
- Time (t
L
)
Peak Temperature (T
P
)
Target Peak Temperature (T
P
Target)
Time within 5°C of actual peak (t
p
)
Ramp-down Rate
Time 25°C to Peak Temperature (t)
Moisture Sensitivity Level
5°C/second Maximum
N/A
150°C
N/A
60 - 120 Seconds
5°C/second Maximum
150°C
200 Seconds Maximum
240°C Maximum
240°C Maximum 1 Time / 230°C Maximum 2 Times
10 seconds Maximum 2 Times / 80 seconds Maximum 1 Time
5°C/second Maximum
N/A
Level 1
Low Temperature Manual Soldering
185°C Maximum for 10 seconds Maximum, 2 times Maximum.
High Temperature Manual Soldering
260°C Maximum for 5 seconds Maximum, 2 times Maximum.
www.ecliptek.com | Specification Subject to Change Without Notice | Rev H 2/13/2010 | Page 5 of 5
Embedded System
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