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CDMC80D50/AANP-100M

Description
Metal compound molding type construction
File Size217KB,4 Pages
ManufacturerSUMIDA
Websitehttp://www.sumida.com/
Download Datasheet View All

CDMC80D50/AANP-100M Overview

Metal compound molding type construction

SMD Power Inductor
CDMC80D50/AA
Description
• Metal compound molding type construction.
• Magnetically shielded.
• L W H: 8.9 8.4 5.4 mm Max.
• Product weight 1.9g(Ref.)
• Moisture Sensitivity Level: 1
• RoHS compliance.
• Qualification to AEC-Q200.
Environmental Data
• Operating temperature range: -40 ~+150
(excluding coil’s self temperature rise)
+85
• Storage temperature range: -40
• Solder reflow temperature: 260
peak.
Packaging
• Carrier tape and reel packaging
RoHS
Land pattern and Schematics - [mm]
8.3
4. 2 1
Applications
• Automotive and other high temperature, high
reliability application.
Page 1 of 4
Revised: 26-Jul-11
℃ ½℃
Dimension - [mm]
5.0±0.2
5.4
5.0±0.2
4.5.xaM
4.0±5.8
× ×
× ×
3
.
0
±
0
.
3
4
.
0
8
.
0
±
0
.
4

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Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
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