Figure 8. Thermal Response, Junction−to−Ambient (1 inch pad)
www.onsemi.com
3
MBRS410L, NRVBS410L
PACKAGE DIMENSIONS
SMC 2−LEAD
CASE 403AC
ISSUE B
H
E
E
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANME Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCHES.
3. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH. MOLD
FLASH SHALL NOT EXCEED 0.254mm PER SIDE.
4. DIMENSIONS D AND E TO BE DETERMINED AT DATUM H.
5. DIMENSION b SHALL BE MEASURED WITHIN THE AREA
DETERMINED BY DIMENSION L.
D
A1
TOP VIEW
DETAIL A
c J
DETAIL A
A2
L
SIDE VIEW
b
END VIEW
A
DIM
A
A1
A2
b
c
D
E
H
E
L
MILLIMETERS
MIN
MAX
1.95
2.61
0.05
0.20
1.90
2.41
2.90
3.20
0.15
0.41
5.55
6.25
6.60
7.15
7.75
8.15
0.75
1.60
INCHES
MIN
MAX
0.077
0.103
0.002
0.008
0.075
0.095
0.114
0.126
0.006
0.016
0.219
0.246
0.260
0.281
0.305
0.321
0.030
0.063
RECOMMENDED
SOLDERING FOOTPRINT*
8.750
0.344
J
2X
3.790
0.149
2X
2.250
0.089
mm
SCALE 4:1
inches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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