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PEF3460E

Description
Support Circuit, 1-Func, PBGA272, PLASTIC, BGA-272
CategoryWireless rf/communication    Telecom circuit   
File Size1MB,39 Pages
ManufacturerIntel
Websitehttp://www.intel.com/
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PEF3460E Overview

Support Circuit, 1-Func, PBGA272, PLASTIC, BGA-272

PEF3460E Parametric

Parameter NameAttribute value
MakerIntel
package instructionBGA,
Reach Compliance Codecompliant
JESD-30 codeS-PBGA-B272
length27 mm
Number of functions1
Number of terminals272
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeBGA
Package shapeSQUARE
Package formGRID ARRAY
Certification statusNot Qualified
Maximum seat height2.54 mm
Nominal supply voltage1.8 V
surface mountYES
Telecom integrated circuit typesATM/SONET/SDH SUPPORT CIRCUIT
Temperature levelINDUSTRIAL
Terminal formBALL
Terminal pitch1.27 mm
Terminal locationBOTTOM
width27 mm
P ro du ct O ve rvi ew , DS 2, D ec . 20 02
TE 3- F A L C
T3 /E 3 Fr a m er & L i n e In te r f ac e f o r
A T M , F r am e R el a y & P P P /I P
P EF 3 46 0 E , V e r s io n 1 .2
W ir ed
Co m mu n ic a ti o n s
N e v e r
s t o p
t h i n k i n g .

PEF3460E Related Products

PEF3460E
Description Support Circuit, 1-Func, PBGA272, PLASTIC, BGA-272
Maker Intel
package instruction BGA,
Reach Compliance Code compliant
JESD-30 code S-PBGA-B272
length 27 mm
Number of functions 1
Number of terminals 272
Maximum operating temperature 85 °C
Minimum operating temperature -40 °C
Package body material PLASTIC/EPOXY
encapsulated code BGA
Package shape SQUARE
Package form GRID ARRAY
Certification status Not Qualified
Maximum seat height 2.54 mm
Nominal supply voltage 1.8 V
surface mount YES
Telecom integrated circuit types ATM/SONET/SDH SUPPORT CIRCUIT
Temperature level INDUSTRIAL
Terminal form BALL
Terminal pitch 1.27 mm
Terminal location BOTTOM
width 27 mm

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