EEWORLDEEWORLDEEWORLD

Part Number

Search

C333C103J5G5CA7301

Description
CAPACITOR, CERAMIC, 50V, C0G, 0.01uF, THROUGH HOLE MOUNT, RADIAL LEADED
CategoryPassive components    capacitor   
File Size208KB,11 Pages
ManufacturerKEMET
Websitehttp://www.kemet.com
Download Datasheet Parametric Compare View All

C333C103J5G5CA7301 Overview

CAPACITOR, CERAMIC, 50V, C0G, 0.01uF, THROUGH HOLE MOUNT, RADIAL LEADED

C333C103J5G5CA7301 Parametric

Parameter NameAttribute value
MakerKEMET
package instruction,
Reach Compliance Codeunknown
ECCN codeEAR99
capacitance0.01 µF
Capacitor typeCERAMIC CAPACITOR
dielectric materialsCERAMIC
JESD-609 codee3
Manufacturer's serial numberC333
Installation featuresTHROUGH HOLE MOUNT
multi-layerNo
negative tolerance5%
Number of terminals2
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
Package shapeRECTANGULAR PACKAGE
method of packingBULK
positive tolerance5%
Rated (DC) voltage (URdc)50 V
surface mountNO
Temperature characteristic codeC0G
Temperature Coefficient-/+30ppm/Cel ppm/°C
Terminal surfaceMATTE TIN
Terminal shapeWIRE
MULTILAYER CERAMIC CAPACITORS/AXIAL & RADIAL LEADED
Multilayer ceramic capacitors are available in a
variety of physical sizes and configurations, including
leaded devices and surface mounted chips. Leaded
styles include molded and conformally coated parts
with axial and radial leads. However, the basic
capacitor element is similar for all styles. It is called a
chip and consists of formulated dielectric materials
which have been cast into thin layers, interspersed
with metal electrodes alternately exposed on opposite
edges of the laminated structure. The entire structure is
fired at high temperature to produce a monolithic
block which provides high capacitance values in a
small physical volume. After firing, conductive
terminations are applied to opposite ends of the chip to
make contact with the exposed electrodes.
Termination materials and methods vary depending on
the intended use.
TEMPERATURE CHARACTERISTICS
Ceramic dielectric materials can be formulated with
Class III:
General purpose capacitors, suitable
a wide range of characteristics. The EIA standard for
for by-pass coupling or other applications in which
ceramic dielectric capacitors (RS-198) divides ceramic
dielectric losses, high insulation resistance and
dielectrics into the following classes:
stability of capacitance characteristics are of little or
no importance. Class III capacitors are similar to Class
II capacitors except for temperature characteristics,
Class I:
Temperature compensating capacitors,
which are greater than ± 15%. Class III capacitors
suitable for resonant circuit application or other appli-
have the highest volumetric efficiency and poorest
cations where high Q and stability of capacitance char-
stability of any type.
acteristics are required. Class I capacitors have
predictable temperature coefficients and are not
effected by voltage, frequency or time. They are made
KEMET leaded ceramic capacitors are offered in
from materials which are not ferro-electric, yielding
the three most popular temperature characteristics:
superior stability but low volumetric efficiency. Class I
C0G:
Class I, with a temperature coefficient of 0 ±
capacitors are the most stable type available, but have
30 ppm per degree C over an operating
the lowest volumetric efficiency.
temperature range of - 55°C to + 125°C (Also
known as “NP0”).
X7R:
Class II, with a maximum capacitance
Class II:
Stable capacitors, suitable for bypass
change of ± 15% over an operating temperature
or coupling applications or frequency discriminating
range of - 55°C to + 125°C.
circuits where Q and stability of capacitance char-
Z5U:
Class III, with a maximum capacitance
acteristics are not of major importance. Class II
change of + 22% - 56% over an operating tem-
capacitors have temperature characteristics of ± 15%
perature range of + 10°C to + 85°C.
or less. They are made from materials which are
ferro-electric, yielding higher volumetric efficiency but
Specified electrical limits for these three temperature
less stability. Class II capacitors are affected by
temperature, voltage, frequency and time.
characteristics are shown in Table 1.
SPECIFIED ELECTRICAL LIMITS
PARAMETER
Dissipation Factor: Measured at following conditions:
C0G — 1 kHz and 1 vrms if capacitance > 1000 pF
1 MHz and 1 vrms if capacitance
1000 pF
X7R — 1 kHz and 1 vrms* or if extended cap range 0.5 vrms
Z5U — 1 kHz and 0.5 vrms
Dielectric Strength: 2.5 times rated DC voltage.
Insulation Resistance (IR): At rated DC voltage,
whichever of the two is smaller
Temperature Characteristics: Range, °C
Capacitance Change without
DC voltage
* 1 MHz and 1 vrms if capacitance
100 pF on military product.
TEMPERATURE CHARACTERISTICS
C0G
X7R
Z5U
0.15%
2.5%
4.0%
Pass Subsequent IR Test
1,000 MΩ-µF
or 100 GΩ
-55 to +125
0 ± 30 ppm/°C
1,000 MΩ-µF
or 100 GΩ
-55 to +125
±15%
1,000 MΩ-µF
or 10 GΩ
+10 to +85
+22%, -56%
Table I
© KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300
3
Multlayer Ceramic
Capacitors

C333C103J5G5CA7301 Related Products

C333C103J5G5CA7301 C325C101J2G5CA C325C103K1R5CA C323C101J1G5CA7301
Description CAPACITOR, CERAMIC, 50V, C0G, 0.01uF, THROUGH HOLE MOUNT, RADIAL LEADED Ceramic Capacitor, Multilayer, Ceramic, 200V, 5% +Tol, 5% -Tol, C0G, 30ppm/Cel TC, 0.0001uF, Through Hole Mount, 2012, RADIAL LEADED Ceramic Capacitor, Multilayer, Ceramic, 100V, 10% +Tol, 10% -Tol, X7R, 15% TC, 0.01uF, Through Hole Mount, 2012, RADIAL LEADED CAPACITOR, CERAMIC, 100V, C0G, 0.0001uF, THROUGH HOLE MOUNT, RADIAL LEADED
Maker KEMET KEMET KEMET KEMET
Reach Compliance Code unknown compliant compliant unknown
ECCN code EAR99 EAR99 EAR99 EAR99
capacitance 0.01 µF 0.0001 µF 0.01 µF 0.0001 µF
Capacitor type CERAMIC CAPACITOR CERAMIC CAPACITOR CERAMIC CAPACITOR CERAMIC CAPACITOR
dielectric materials CERAMIC CERAMIC CERAMIC CERAMIC
JESD-609 code e3 e3 e3 e3
Installation features THROUGH HOLE MOUNT THROUGH HOLE MOUNT THROUGH HOLE MOUNT THROUGH HOLE MOUNT
multi-layer No Yes Yes No
negative tolerance 5% 5% 10% 5%
Number of terminals 2 2 2 2
Maximum operating temperature 125 °C 125 °C 125 °C 125 °C
Minimum operating temperature -55 °C -55 °C -55 °C -55 °C
Package shape RECTANGULAR PACKAGE RECTANGULAR PACKAGE RECTANGULAR PACKAGE RECTANGULAR PACKAGE
method of packing BULK BULK BULK BULK
positive tolerance 5% 5% 10% 5%
Rated (DC) voltage (URdc) 50 V 200 V 100 V 100 V
surface mount NO NO NO NO
Temperature characteristic code C0G C0G X7R C0G
Temperature Coefficient -/+30ppm/Cel ppm/°C 30ppm/Cel ppm/°C 15% ppm/°C -/+30ppm/Cel ppm/°C
Terminal surface MATTE TIN Matte Tin (Sn) - with Nickel (Ni) barrier Matte Tin (Sn) - with Nickel (Ni) barrier MATTE TIN
Terminal shape WIRE WIRE WIRE WIRE
[Emergency Help] About the program power-on and power-off issues
Thank you in advance! Please help me analyze this problem: When debugging the 430 program, some programs can be downloaded and debugged, but they don't respond after powering off and then on? ? (Some ...
风的世界 Microcontroller MCU
Introduction to Car Audio Bus A2B
[i=s]This post was last edited by 5525 on 2016-5-4 09:54[/i] [align=center][color=#333333][font=Arial][size=4]A2B:Automotive Audio Bus A2B[/size][/font][/color][/align] Features: Lightweight! Digitall...
5525 Automotive Electronics
About using CCR1 timing
/******************************************* Function name: Init_TimerAFunction : Initialize timer AParameters: NoneReturn value: NoneCall module: main ********************************************/ vo...
5xue Microcontroller MCU
The principle of using MOSFET tube to achieve soft start! ! ! ! I don't quite understand
The following figure is a partial schematic diagram of the 12V power supply soft start. I am a novice and don’t understand how the principle is implemented. Please help me~ What is the function of D19...
hgy10086 Power technology
When is the AD sampling result register of F28027 cleared?
When is the AD sampling result register of F28027 cleared? For example, after I read the AD sampling result register, will the system automatically clear it to zero? If it is not cleared to zero, will...
aoxiaoche918 Microcontroller MCU
What exactly is modular programming?
How should the c file, h and h files be combined? I found that I can only write c or h, but not combine them together. Can anyone explain it clearly?...
数码小叶 Microcontroller MCU

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 2608  1612  1823  1701  1368  53  33  37  35  28 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号