733XM datasheet, PDF - EEWORLD Datasheet

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733XM: DescriptionVideo Amplifier, 1 Channel(s), Bipolar, 0.041 X 0.041 INCH, DIE-10; CategoryAnalog mixed-signal IC Consumption circuit; File Size147KB，5 Pages; ManufacturerAMD; Websitehttp://www.amd.com

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733XM Overview

Video Amplifier, 1 Channel(s), Bipolar, 0.041 X 0.041 INCH, DIE-10

733XM Parametric

Parameter Name	Attribute value
Maker	AMD
Parts packaging code	DIE
package instruction	DIE, DIE OR CHIP
Contacts	10
Reach Compliance Code	unknown
ECCN code	EAR99
Nominal bandwidth	120000 kHz
Commercial integrated circuit types	VIDEO AMPLIFIER
Gain	52.04 dB
JESD-30 code	S-XUUC-N10
Number of channels	1
Number of terminals	10
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Package body material	UNSPECIFIED
encapsulated code	DIE
Encapsulate equivalent code	DIE OR CHIP
Package shape	SQUARE
Package form	UNCASED CHIP
power supply	+-6 V
Certification status	Not Qualified
Maximum slew rate	27 mA
Maximum supply voltage (Vsup)	6 V
Minimum supply voltage (Vsup)	6 V
surface mount	YES
technology	BIPOLAR
Temperature level	MILITARY
Terminal form	NO LEAD
Terminal location	UPPER

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733XM Related Products

	733XM	733FM	AM733DM	AM733FM	733DM	733DC	733HC	733HM	733XC
Description	Video Amplifier, 1 Channel(s), Bipolar, 0.041 X 0.041 INCH, DIE-10	Video Amplifier, 1 Channel(s), Bipolar, CDFP10, HERMETIC SEALED, FP-10	Video Amplifier, 1 Channel(s), 1 Func, CDIP14, HERMETIC SEALED, DIP-14	Video Amplifier, 1 Channel(s), 1 Func, CDFP10, HERMETIC SEALED, FP-10	Video Amplifier, 1 Channel(s), Bipolar, CDIP14, HERMETIC SEALED, DIP-14	Video Amplifier, 1 Channel(s), Bipolar, CDIP14, HERMETIC SEALED, DIP-14	Video Amplifier, 1 Channel(s), Bipolar, MBCY8, METAL CAN, TO-99, 10 PIN	Video Amplifier, 1 Channel(s), Bipolar, MBCY8, METAL CAN, TO-99, 10 PIN	Video Amplifier, 1 Channel(s), Bipolar, 0.041 X 0.041 INCH, DIE-10
Parts packaging code	DIE	DFP	DIP	DFP	DIP	DIP	TO-99	TO-99	DIE
package instruction	DIE, DIE OR CHIP	DFP, FL10,.3	HERMETIC SEALED, DIP-14	HERMETIC SEALED, FP-10	DIP, DIP14,.3	DIP, DIP14,.3	TO-99, CAN10,.23	TO-99, CAN10,.23	DIE, DIE OR CHIP
Contacts	10	10	14	10	14	14	8	8	10
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
Nominal bandwidth	120000 kHz	120000 kHz	120000 kHz	120000 kHz	120000 kHz	120000 kHz	120000 kHz	120000 kHz	120000 kHz
Commercial integrated circuit types	VIDEO AMPLIFIER	VIDEO AMPLIFIER	VIDEO AMPLIFIER	VIDEO AMPLIFIER	VIDEO AMPLIFIER	VIDEO AMPLIFIER	VIDEO AMPLIFIER	VIDEO AMPLIFIER	VIDEO AMPLIFIER
Gain	52.04 dB	52.04 dB	52.04 dB	52.04 dB	52.04 dB	52.04 dB	52.04 dB	52.04 dB	52.04 dB
JESD-30 code	S-XUUC-N10	R-CDFP-F10	R-CDIP-T14	R-CDFP-F10	R-CDIP-T14	R-CDIP-T14	O-MBCY-W8	O-MBCY-W8	S-XUUC-N10
Number of channels	1	1	1	1	1	1	1	1	1
Number of terminals	10	10	14	10	14	14	8	8	10
Maximum operating temperature	125 °C	125 °C	125 °C	125 °C	125 °C	70 °C	70 °C	125 °C	70 °C
Minimum operating temperature	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-	-	-55 °C	-
Package body material	UNSPECIFIED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	METAL	METAL	UNSPECIFIED
encapsulated code	DIE	DFP	DIP	DFP	DIP	DIP	TO-99	TO-99	DIE
Package shape	SQUARE	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	ROUND	ROUND	SQUARE
Package form	UNCASED CHIP	FLATPACK	IN-LINE	FLATPACK	IN-LINE	IN-LINE	CYLINDRICAL	CYLINDRICAL	UNCASED CHIP
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum supply voltage (Vsup)	6 V	6 V	6 V	6 V	6 V	6 V	6 V	6 V	6 V
Minimum supply voltage (Vsup)	6 V	6 V	6 V	6 V	6 V	6 V	6 V	6 V	6 V
surface mount	YES	YES	NO	YES	NO	NO	NO	NO	YES
Temperature level	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	COMMERCIAL	COMMERCIAL	MILITARY	COMMERCIAL
Terminal form	NO LEAD	FLAT	THROUGH-HOLE	FLAT	THROUGH-HOLE	THROUGH-HOLE	WIRE	WIRE	NO LEAD
Terminal location	UPPER	DUAL	DUAL	DUAL	DUAL	DUAL	BOTTOM	BOTTOM	UPPER
Maker	AMD	-	AMD	AMD	AMD	AMD	AMD	AMD	AMD
Encapsulate equivalent code	DIE OR CHIP	FL10,.3	-	-	DIP14,.3	DIP14,.3	CAN10,.23	CAN10,.23	DIE OR CHIP
power supply	+-6 V	+-6 V	-	-	+-6 V	+-6 V	+-6 V	+-6 V	+-6 V
Maximum slew rate	27 mA	27 mA	-	-	27 mA	27 mA	27 mA	27 mA	27 mA
technology	BIPOLAR	BIPOLAR	-	-	BIPOLAR	BIPOLAR	BIPOLAR	BIPOLAR	BIPOLAR
Is it Rohs certified?	-	incompatible	-	-	incompatible	incompatible	incompatible	incompatible	-
JESD-609 code	-	e0	-	-	e0	e0	e0	e0	-
length	-	6.477 mm	19.431 mm	6.477 mm	19.431 mm	19.431 mm	-	-	-
Peak Reflow Temperature (Celsius)	-	NOT SPECIFIED	-	-	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	-
Maximum seat height	-	2.032 mm	5.08 mm	2.032 mm	5.08 mm	5.08 mm	-	-	-
Terminal surface	-	Tin/Lead (Sn/Pb)	-	-	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	-
Terminal pitch	-	1.27 mm	2.54 mm	1.27 mm	2.54 mm	2.54 mm	-	-	-
Maximum time at peak reflow temperature	-	NOT SPECIFIED	-	-	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	-
width	-	6.35 mm	7.62 mm	6.35 mm	7.62 mm	7.62 mm	-	-	-

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