Bit-Slice Processor, 4-Bit, TTL, PDFP48, FP-48
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | AMD |
| Parts packaging code | DFP |
| package instruction | DFP, FL48,.6 |
| Contacts | 48 |
| Reach Compliance Code | unknown |
| ECCN code | 3A001.A.2.C |
| External data bus width | 4 |
| JESD-30 code | R-PDFP-F48 |
| JESD-609 code | e0 |
| length | 30.7975 mm |
| Number of terminals | 48 |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | DFP |
| Encapsulate equivalent code | FL48,.6 |
| Package shape | RECTANGULAR |
| Package form | FLATPACK |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| Certification status | Not Qualified |
| Filter level | MIL-STD-883 Class B (Modified) |
| Maximum seat height | 2.794 mm |
| Maximum slew rate | 395 mA |
| Maximum supply voltage | 5.5 V |
| Minimum supply voltage | 4.5 V |
| Nominal supply voltage | 5 V |
| surface mount | YES |
| technology | TTL |
| Temperature level | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | FLAT |
| Terminal pitch | 1.27 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 16.3195 mm |
| uPs/uCs/peripheral integrated circuit type | BIT-SLICE MICROPROCESSOR |
| AM2903AFMB | AM2903ADMB | AM2903AXM | AM2903ADC | AM2903ADCB | AM2903ALC | AM2903ALMB | AM2903AXC | |
|---|---|---|---|---|---|---|---|---|
| Description | Bit-Slice Processor, 4-Bit, TTL, PDFP48, FP-48 | Bit-Slice Processor, 4-Bit, TTL, CDIP48, HERMETIC SEALED, CERDIP-48 | Bit-Slice Processor, 4-Bit, TTL, 0.163 X 0.197 INCH, DIE-50 | Bit-Slice Processor, 4-Bit, TTL, CDIP48, HERMETIC SEALED, CERDIP-48 | Bit-Slice Processor, 4-Bit, TTL, CDIP48, HERMETIC SEALED, CERDIP-48 | Bit-Slice Processor, 4-Bit, TTL, CQCC52, LCC-52 | Bit-Slice Processor, 4-Bit, TTL, CQCC52, LCC-52 | Bit-Slice Processor, 4-Bit, TTL, 0.163 X 0.197 INCH, DIE-50 |
| Maker | AMD | AMD | AMD | AMD | AMD | AMD | AMD | AMD |
| Parts packaging code | DFP | DIP | DIE | DIP | DIP | LCC | LCC | DIE |
| package instruction | DFP, FL48,.6 | DIP, | DIE, | DIP, DIP48,.6 | DIP, DIP48,.6 | QCCN, LCC52,.75SQ | QCCN, LCC52,.75SQ | DIE, |
| Contacts | 48 | 48 | 50 | 48 | 48 | 52 | 52 | 50 |
| Reach Compliance Code | unknown | unknow | unknown | unknown | unknown | unknown | unknown | unknown |
| External data bus width | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 |
| JESD-30 code | R-PDFP-F48 | R-CDIP-T48 | R-XUUC-N50 | R-CDIP-T48 | R-CDIP-T48 | S-CQCC-N52 | S-CQCC-N52 | R-XUUC-N50 |
| Number of terminals | 48 | 48 | 50 | 48 | 48 | 52 | 52 | 50 |
| Maximum operating temperature | 125 °C | 125 °C | 125 °C | 70 °C | 70 °C | 70 °C | 125 °C | 70 °C |
| Package body material | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED | UNSPECIFIED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | UNSPECIFIED |
| encapsulated code | DFP | DIP | DIE | DIP | DIP | QCCN | QCCN | DIE |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | SQUARE | RECTANGULAR |
| Package form | FLATPACK | IN-LINE | UNCASED CHIP | IN-LINE | IN-LINE | CHIP CARRIER | CHIP CARRIER | UNCASED CHIP |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum slew rate | 395 mA | 395 mA | 395 mA | 350 mA | 350 mA | 350 mA | 395 mA | 350 mA |
| Maximum supply voltage | 5.5 V | 5.5 V | 5.5 V | 5.25 V | 5.25 V | 5.25 V | 5.5 V | 5.25 V |
| Minimum supply voltage | 4.5 V | 4.5 V | 4.5 V | 4.75 V | 4.75 V | 4.75 V | 4.5 V | 4.75 V |
| Nominal supply voltage | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | YES | NO | YES | NO | NO | YES | YES | YES |
| technology | TTL | TTL | TTL | TTL | TTL | TTL | TTL | TTL |
| Temperature level | MILITARY | MILITARY | MILITARY | COMMERCIAL | COMMERCIAL | COMMERCIAL | MILITARY | COMMERCIAL |
| Terminal form | FLAT | THROUGH-HOLE | NO LEAD | THROUGH-HOLE | THROUGH-HOLE | NO LEAD | NO LEAD | NO LEAD |
| Terminal location | DUAL | DUAL | UPPER | DUAL | DUAL | QUAD | QUAD | UPPER |
| uPs/uCs/peripheral integrated circuit type | BIT-SLICE MICROPROCESSOR | BIT-SLICE MICROPROCESSOR | BIT-SLICE MICROPROCESSOR | BIT-SLICE MICROPROCESSOR | BIT-SLICE MICROPROCESSOR | BIT-SLICE MICROPROCESSOR | BIT-SLICE MICROPROCESSOR | BIT-SLICE MICROPROCESSOR |
| Is it Rohs certified? | incompatible | - | - | incompatible | incompatible | incompatible | incompatible | - |
| JESD-609 code | e0 | - | - | e0 | e0 | e0 | e0 | - |
| length | 30.7975 mm | 60.96 mm | - | 60.96 mm | 60.96 mm | 19.05 mm | 19.05 mm | - |
| Encapsulate equivalent code | FL48,.6 | - | - | DIP48,.6 | DIP48,.6 | LCC52,.75SQ | LCC52,.75SQ | - |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | - | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - |
| Maximum seat height | 2.794 mm | 5.08 mm | - | 5.08 mm | 5.08 mm | 3.048 mm | 3.048 mm | - |
| Terminal pitch | 1.27 mm | 2.54 mm | - | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm | - |
| Maximum time at peak reflow temperature | NOT SPECIFIED | - | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - |
| width | 16.3195 mm | 15.24 mm | - | 15.24 mm | 15.24 mm | 19.05 mm | 19.05 mm | - |