Junction Temperature (Note 1) ........................................+150°C
Storage Temperature Range ............................ -55°C to +125°C
Lead temperature (soldering,10s) ...................................+260°C
Soldering Temperature (reflow) .......................................+260°C
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these
or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect
device reliability.
Package Information
PACKAGE TYPE: 10-PIN uSLIC
Package Code
Outline Number
Land Pattern Number
Junction to Ambient (θ
JA
)
M102A3+2
21-100094
90-100027
41.56 ºC/W
THERMAL RESISTANCE, FOUR-LAYER BOARD (Note 2)
For the latest package outline information and land patterns (footprints), go to
www.maximintegrated.com/packages.
Note that a “+”,
“#”, or “-” in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing
pertains to the package regardless of RoHS status.
Note 1:
Junction temperature greater than +125°C degrades operating lifetimes.
Note 2:
Package thermal resistance is measured on an evaluation board with natural convection.
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