M5M27C102JK-15 datasheet, PDF - EEWORLD Datasheet

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M5M27C102JK-15: DescriptionUVPROM, 64KX16, 150ns, CMOS, CQCC44, GLASS SEALED, CERAMIC, LCC-44; Categorystorage storage; File Size263KB，8 Pages; ManufacturerMitsubishi; Websitehttp://www.mitsubishielectric.com/semiconductors/

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M5M27C102JK-15 Overview

UVPROM, 64KX16, 150ns, CMOS, CQCC44, GLASS SEALED, CERAMIC, LCC-44

M5M27C102JK-15 Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	Mitsubishi
Parts packaging code	LCC
package instruction	WQCCJ, LDCC44,.7SQ
Contacts	44
Reach Compliance Code	unknown
ECCN code	EAR99
Maximum access time	150 ns
Other features	PAGE WRITE
I/O type	COMMON
JESD-30 code	S-GQCC-J44
JESD-609 code	e0
length	16.5862 mm
memory density	1048576 bit
Memory IC Type	UVPROM
memory width	16
Number of functions	1
Number of terminals	44
word count	65536 words
character code	64000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	64KX16
Output characteristics	3-STATE
Package body material	CERAMIC, GLASS-SEALED
encapsulated code	WQCCJ
Encapsulate equivalent code	LDCC44,.7SQ
Package shape	SQUARE
Package form	CHIP CARRIER, WINDOW
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	5 V
Certification status	Not Qualified
Maximum seat height	4.8 mm
Maximum standby current	0.0001 A
Maximum slew rate	0.05 mA
Maximum supply voltage (Vsup)	5.25 V
Minimum supply voltage (Vsup)	4.75 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	J BEND
Terminal pitch	1.27 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	NOT SPECIFIED
width	16.5862 mm

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M5M27C102JK-15 Related Products

	M5M27C102JK-15	M5M27C102K-2	M5M27C102JK-2	M5M27C102JK-12
Description	UVPROM, 64KX16, 150ns, CMOS, CQCC44, GLASS SEALED, CERAMIC, LCC-44	UVPROM, 64KX16, 200ns, CMOS, CDIP40, 0.600 INCH, GLASS SEALED, CERDIP-40	UVPROM, 64KX16, 200ns, CMOS, CQCC44, GLASS SEALED, CERAMIC, LCC-44	UVPROM, 64KX16, 120ns, CMOS, CQCC44, GLASS SEALED, CERAMIC, LCC-44
Is it lead-free?	Contains lead	Contains lead	Contains lead	Contains lead
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible
Maker	Mitsubishi	Mitsubishi	Mitsubishi	Mitsubishi
Parts packaging code	LCC	DIP	LCC	LCC
package instruction	WQCCJ, LDCC44,.7SQ	WDIP, DIP40,.6	WQCCJ, LDCC44,.7SQ	WQCCJ, LDCC44,.7SQ
Contacts	44	40	44	44
Reach Compliance Code	unknown	unknown	unknown	unknown
ECCN code	EAR99	EAR99	EAR99	EAR99
Maximum access time	150 ns	200 ns	200 ns	120 ns
Other features	PAGE WRITE	PAGE WRITE	PAGE WRITE	PAGE WRITE
I/O type	COMMON	COMMON	COMMON	COMMON
JESD-30 code	S-GQCC-J44	R-GDIP-T40	S-GQCC-J44	S-GQCC-J44
JESD-609 code	e0	e0	e0	e0
length	16.5862 mm	52.07 mm	16.5862 mm	16.5862 mm
memory density	1048576 bit	1048576 bit	1048576 bit	1048576 bit
Memory IC Type	UVPROM	UVPROM	UVPROM	UVPROM
memory width	16	16	16	16
Number of functions	1	1	1	1
Number of terminals	44	40	44	44
word count	65536 words	65536 words	65536 words	65536 words
character code	64000	64000	64000	64000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C
organize	64KX16	64KX16	64KX16	64KX16
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED
encapsulated code	WQCCJ	WDIP	WQCCJ	WQCCJ
Encapsulate equivalent code	LDCC44,.7SQ	DIP40,.6	LDCC44,.7SQ	LDCC44,.7SQ
Package shape	SQUARE	RECTANGULAR	SQUARE	SQUARE
Package form	CHIP CARRIER, WINDOW	IN-LINE, WINDOW	CHIP CARRIER, WINDOW	CHIP CARRIER, WINDOW
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
power supply	5 V	5 V	5 V	5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	4.8 mm	5.1 mm	4.8 mm	4.8 mm
Maximum standby current	0.0001 A	0.0001 A	0.0001 A	0.0001 A
Maximum slew rate	0.05 mA	0.05 mA	0.05 mA	0.05 mA
Maximum supply voltage (Vsup)	5.25 V	5.25 V	5.25 V	5.25 V
Minimum supply voltage (Vsup)	4.75 V	4.75 V	4.75 V	4.75 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V
surface mount	YES	NO	YES	YES
technology	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	J BEND	THROUGH-HOLE	J BEND	J BEND
Terminal pitch	1.27 mm	2.54 mm	1.27 mm	1.27 mm
Terminal location	QUAD	DUAL	QUAD	QUAD
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	16.5862 mm	15.24 mm	16.5862 mm	16.5862 mm

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