UVPROM, 64KX16, 200ns, CMOS, CQCC44, GLASS SEALED, CERAMIC, LCC-44
| Parameter Name | Attribute value |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| Maker | Mitsubishi |
| Parts packaging code | LCC |
| package instruction | WQCCJ, LDCC44,.7SQ |
| Contacts | 44 |
| Reach Compliance Code | unknown |
| ECCN code | EAR99 |
| Maximum access time | 200 ns |
| Other features | PAGE WRITE |
| I/O type | COMMON |
| JESD-30 code | S-GQCC-J44 |
| JESD-609 code | e0 |
| length | 16.5862 mm |
| memory density | 1048576 bit |
| Memory IC Type | UVPROM |
| memory width | 16 |
| Number of functions | 1 |
| Number of terminals | 44 |
| word count | 65536 words |
| character code | 64000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 64KX16 |
| Output characteristics | 3-STATE |
| Package body material | CERAMIC, GLASS-SEALED |
| encapsulated code | WQCCJ |
| Encapsulate equivalent code | LDCC44,.7SQ |
| Package shape | SQUARE |
| Package form | CHIP CARRIER, WINDOW |
| Parallel/Serial | PARALLEL |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| power supply | 5 V |
| Certification status | Not Qualified |
| Maximum seat height | 4.8 mm |
| Maximum standby current | 0.0001 A |
| Maximum slew rate | 0.05 mA |
| Maximum supply voltage (Vsup) | 5.25 V |
| Minimum supply voltage (Vsup) | 4.75 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | J BEND |
| Terminal pitch | 1.27 mm |
| Terminal location | QUAD |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 16.5862 mm |
| M5M27C102JK-2 | M5M27C102K-2 | M5M27C102JK-15 | M5M27C102JK-12 | |
|---|---|---|---|---|
| Description | UVPROM, 64KX16, 200ns, CMOS, CQCC44, GLASS SEALED, CERAMIC, LCC-44 | UVPROM, 64KX16, 200ns, CMOS, CDIP40, 0.600 INCH, GLASS SEALED, CERDIP-40 | UVPROM, 64KX16, 150ns, CMOS, CQCC44, GLASS SEALED, CERAMIC, LCC-44 | UVPROM, 64KX16, 120ns, CMOS, CQCC44, GLASS SEALED, CERAMIC, LCC-44 |
| Is it lead-free? | Contains lead | Contains lead | Contains lead | Contains lead |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible |
| Maker | Mitsubishi | Mitsubishi | Mitsubishi | Mitsubishi |
| Parts packaging code | LCC | DIP | LCC | LCC |
| package instruction | WQCCJ, LDCC44,.7SQ | WDIP, DIP40,.6 | WQCCJ, LDCC44,.7SQ | WQCCJ, LDCC44,.7SQ |
| Contacts | 44 | 40 | 44 | 44 |
| Reach Compliance Code | unknown | unknown | unknown | unknown |
| ECCN code | EAR99 | EAR99 | EAR99 | EAR99 |
| Maximum access time | 200 ns | 200 ns | 150 ns | 120 ns |
| Other features | PAGE WRITE | PAGE WRITE | PAGE WRITE | PAGE WRITE |
| I/O type | COMMON | COMMON | COMMON | COMMON |
| JESD-30 code | S-GQCC-J44 | R-GDIP-T40 | S-GQCC-J44 | S-GQCC-J44 |
| JESD-609 code | e0 | e0 | e0 | e0 |
| length | 16.5862 mm | 52.07 mm | 16.5862 mm | 16.5862 mm |
| memory density | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit |
| Memory IC Type | UVPROM | UVPROM | UVPROM | UVPROM |
| memory width | 16 | 16 | 16 | 16 |
| Number of functions | 1 | 1 | 1 | 1 |
| Number of terminals | 44 | 40 | 44 | 44 |
| word count | 65536 words | 65536 words | 65536 words | 65536 words |
| character code | 64000 | 64000 | 64000 | 64000 |
| Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C |
| organize | 64KX16 | 64KX16 | 64KX16 | 64KX16 |
| Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| Package body material | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED |
| encapsulated code | WQCCJ | WDIP | WQCCJ | WQCCJ |
| Encapsulate equivalent code | LDCC44,.7SQ | DIP40,.6 | LDCC44,.7SQ | LDCC44,.7SQ |
| Package shape | SQUARE | RECTANGULAR | SQUARE | SQUARE |
| Package form | CHIP CARRIER, WINDOW | IN-LINE, WINDOW | CHIP CARRIER, WINDOW | CHIP CARRIER, WINDOW |
| Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| power supply | 5 V | 5 V | 5 V | 5 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | 4.8 mm | 5.1 mm | 4.8 mm | 4.8 mm |
| Maximum standby current | 0.0001 A | 0.0001 A | 0.0001 A | 0.0001 A |
| Maximum slew rate | 0.05 mA | 0.05 mA | 0.05 mA | 0.05 mA |
| Maximum supply voltage (Vsup) | 5.25 V | 5.25 V | 5.25 V | 5.25 V |
| Minimum supply voltage (Vsup) | 4.75 V | 4.75 V | 4.75 V | 4.75 V |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V |
| surface mount | YES | NO | YES | YES |
| technology | CMOS | CMOS | CMOS | CMOS |
| Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | J BEND | THROUGH-HOLE | J BEND | J BEND |
| Terminal pitch | 1.27 mm | 2.54 mm | 1.27 mm | 1.27 mm |
| Terminal location | QUAD | DUAL | QUAD | QUAD |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| width | 16.5862 mm | 15.24 mm | 16.5862 mm | 16.5862 mm |
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