DISCRETE SEMICONDUCTORS
DATA SHEET
dbook, halfpage
MBD128
PUMF12
PNP general purpose transistor;
NPN resistor-equipped transistor
Product data sheet
2002 Nov 07
NXP Semiconductors
Product data sheet
PNP general purpose transistor; NPN
resistor-equipped transistor
FEATURES
•
General purpose transistor and resistor equipped
transistor in one package
•
100 mA collector current
•
50 V collector-emitter voltage
•
300 mW total power dissipation
•
SOT363 package; replaces two SOT323 (SC-70)
packaged devices on same PCB area
•
Reduced pick and place costs.
APPLICATIONS
•
Power management switch for portable equipment,
e.g. cellular phone and CD player
•
Switch for regulator.
DESCRIPTION
PNP general purpose transistor and an NPN
resistor-equipped transistor in a SOT363 (SC-88) plastic
package.
MARKING
TYPE NUMBER
PUMF12
Note
1.
∗
= p: Made in Hong Kong.
∗
= t: Made in Malaysia.
TR1
PUMF12
QUICK REFERENCE DATA
SYMBOL
TR1 (PNP)
V
CEO
I
C
I
CM
TR2 (NPN)
V
CEO
I
O
R1
R2
PINNING
PIN
1, 4
2, 5
6, 3
emitter
base
collector
DESCRIPTION
TR1; TR2
TR1; TR2
TR1; TR2
collector-emitter voltage
output current (DC)
bias resistor
bias resistor
50
100
22
47
V
mA
kΩ
kΩ
collector-emitter voltage
collector current (DC)
peak collector current
−50
−100
−200
V
mA
mA
PARAMETER
MAX.
UNIT
MARKING CODE
(1)
R2∗
handbook, halfpage
6
5
4
6
5
4
R1
R2
TR2
1
Top view
2
3
MCE153
1
2
3
Fig.1 Simplified outline (SOT363) and symbol.
2002 Nov 07
2
NXP Semiconductors
Product data sheet
PNP general purpose transistor; NPN
resistor-equipped transistor
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
SYMBOL
Per transistor
P
tot
T
stg
T
j
T
amb
TR1 (PNP)
V
CBO
V
CEO
V
EBO
I
C
I
CM
TR2 (NPN)
V
CBO
V
CEO
V
EBO
V
i
collector-base voltage
collector-emitter voltage
emitter-base voltage
input voltage
positive
negative
I
O
I
CM
Per device
P
tot
Note
1. Device mounted on an FR4 printed-circuit board.
THERMAL CHARACTERISTICS
SYMBOL
R
th j-a
Note
1. Device mounted on an FR4 printed-circuit board.
PARAMETER
thermal resistance from junction to ambient
note 1
CONDITIONS
VALUE
416
total power dissipation
T
amb
≤
25
°C;
note 1
−
output current (DC)
peak collector current
−
−
−
−
open emitter
open base
open collector
−
−
−
50
50
10
collector-base voltage
collector-emitter voltage
emitter-base voltage
collector current (DC)
peak collector current
open emitter
open base
open collector
−
−
−
−
−
total power dissipation
storage temperature range
junction temperature
operating ambient temperature
T
amb
≤
25
°C;
note 1
−
−65
−
−65
PARAMETER
CONDITIONS
MIN.
PUMF12
MAX.
UNIT
200
+150
150
+150
−50
−40
−5
−100
−200
mW
°C
°C
°C
V
V
V
mA
mA
V
V
V
V
V
mA
mA
+40
−10
100
100
300
mW
UNIT
K/W
2002 Nov 07
3
NXP Semiconductors
Product data sheet
PNP general purpose transistor; NPN
resistor-equipped transistor
CHARACTERISTICS
T
amb
= 25
°C
unless otherwise specified.
SYMBOL
TR1 (PNP)
I
CBO
I
EBO
V
CEsat
h
FE
C
c
f
T
TR2 (NPN)
I
CBO
I
CEO
I
EBO
h
FE
V
CEsat
V
i(off)
V
i(on)
R1
R2
------
-
R1
C
c
Note
1. Device mounted on an FR4 printed-circuit board.
APPLICATION INFORMATION
collector-base cut-off current
collector-emitter cut-off current
emitter-base cut-off current
DC current gain
saturation voltage
input off voltage
input on voltage
input resistor
resistor ratio
collector capacitance
V
CB
= 10 V; I
E
= i
e
= 0; f = 1 MHz
V
CB
= 50 V; I
E
= 0
V
CE
= 30 V; I
B
= 0
V
CE
= 30 V; I
B
= 0; T
j
= 150
°C
V
EB
= 5 V; I
C
= 0
V
CE
= 5 V; I
C
= 5 mA
I
C
= 10 mA; I
B
= 0.5 mA
V
CE
= 5 V; I
C
= 100
µA
V
CE
= 0.3 V; I
C
= 2 mA
−
−
−
−
80
−
−
2
15.4
1.7
−
−
−
−
−
−
−
0.9
1.1
22
2.1
−
collector cut-off current
emitter cut-off current
saturation voltage
DC current gain
collector capacitance
transition frequency
V
CB
=
−30
V; I
E
= 0
V
CB
=
−30
V; I
E
= 0; T
j
= 150
°C
V
EB
=
−4
V; I
C
= 0
I
C
=
−50
mA; I
B
=
−5
mA; note 1
V
CE
=
−6
V; I
C
=
−1
mA
V
CB
=
−12
V; I
E
= i
e
= 0; f = 1 MHz
−
−
−
−
120
−
−
−
−
−
−
−
−
PARAMETER
CONDITIONS
MIN.
TYP.
PUMF12
MAX. UNIT
−100
−10
−100
−200
−
2.2
−
pF
MHz
nA
µA
nA
mV
V
CE
=
−12
V; I
C
=
−2
mA; f = 100 MHz 100
100
1
50
120
−
150
0.5
−
28.6
2.6
2.5
nA
µA
µA
µA
mV
V
V
kΩ
pF
1
handbook, halfpage
6
2
RBE(ext)
RB(ext)
3
R1
5
R2
4
MHC322
Fig.2 Typical power management circuit.
2002 Nov 07
4
NXP Semiconductors
Product data sheet
PNP general purpose transistor; NPN
resistor-equipped transistor
PACKAGE OUTLINE
PUMF12
Plastic surface mounted package; 6 leads
SOT363
D
B
E
A
X
y
HE
v
M
A
6
5
4
Q
pin 1
index
A
A1
1
e1
e
2
bp
3
w
M
B
detail X
Lp
c
0
1
scale
2 mm
DIMENSIONS (mm are the original dimensions)
UNIT
mm
A
1.1
0.8
A1
max
0.1
bp
0.30
0.20
c
0.25
0.10
D
2.2
1.8
E
1.35
1.15
e
1.3
e
1
0.65
HE
2.2
2.0
Lp
0.45
0.15
Q
0.25
0.15
v
0.2
w
0.2
y
0.1
OUTLINE
VERSION
SOT363
REFERENCES
IEC
JEDEC
EIAJ
SC-88
EUROPEAN
PROJECTION
ISSUE DATE
97-02-28
2002 Nov 07
5
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