EEWORLDEEWORLDEEWORLD

Part Number

Search

ERJP06F1151V

Description
Fixed Resistor, Metal Glaze/thick Film, 0.5W, 1150ohm, 400V, 1% +/-Tol, 100ppm/Cel, Surface Mount, 0805, CHIP
CategoryPassive components    The resistor   
File Size132KB,5 Pages
ManufacturerPanasonic
Websitehttp://www.panasonic.co.jp/semicon/e-index.html
Environmental Compliance  
Download Datasheet Parametric View All

ERJP06F1151V Overview

Fixed Resistor, Metal Glaze/thick Film, 0.5W, 1150ohm, 400V, 1% +/-Tol, 100ppm/Cel, Surface Mount, 0805, CHIP

ERJP06F1151V Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerPanasonic
package instructionSMT, 0805
Reach Compliance Codecompliant
Samacsys DescriptionPANASONIC - ERJP06F1151V - SMD Chip Resistor, 0805 [2012 Metric], 1.15 kohm, ERJP06 Series, 400 V, Thick Film, 500 mW
Other featuresIEC60115-8
structureRectangular
JESD-609 codee3
Installation featuresSURFACE MOUNT
Number of terminals2
Maximum operating temperature155 °C
Minimum operating temperature-55 °C
Package height0.6 mm
Package length2 mm
Package shapeRECTANGULAR PACKAGE
Package formSMT
Package width1.25 mm
method of packingTR, PUNCHED, 7 INCH
Rated power dissipation(P)0.5 W
Rated temperature70 °C
GuidelineAEC-Q200
resistance1150 Ω
Resistor typeFIXED RESISTOR
size code0805
surface mountYES
technologyMETAL GLAZE/THICK FILM
Temperature Coefficient100 ppm/°C
Terminal surfaceMatte Tin (Sn) - with Nickel (Ni) barrier
Terminal shapeWRAPAROUND
Tolerance1%
Operating Voltage400 V
Anti-Surge Thick Film Chip Resistors
Anti-Surge Thick Film Chip Resistors
0603, 0805, 1206, 1210, 0805
Type:
ERJ P03, PA3, P06, P08, P14
ERJ P6W
Features
ESD surge characteristics superior to standard metal film resistors
High reliability
Metal glaze thick film resistive element and three layers of electrodes
Suitable for both reflow and flow soldering
High power… 0.2 W : 1608(0603) size(ERJP03)
0.25 W : 1608(0603) size(ERJPA3), 2012(0805) size(ERJP06)
0.33 W : 3216(1206) size(ERJP08)
0.5 W : 3225(1210) size(ERJP14), double-sided resistive elements structure 2012(0805) size(ERJP6W)
Reference Standards…IEC 60115-8, JIS C 5201-8, EIAJ RC-2134B
RoHS compliant
Packaging Methods, Land Pattern, Soldering Conditions and Safety Precautions
Please see Data Files
Explanation of Part Numbers
ERJP03, PA3, P06, P08, P14
1
2
3
4
5
6
7
8
9
10
11
12
Product Code
Thick Film
Chip Resistors
Size, Power Rating
Type: inch Power R.
P03 : 0603 0.2 W
PA3 : 0603 0.25 W
P06 : 0805 0.25 W
P08 : 1206 0.33 W
P14 : 1210 0.5 W
Resistance Tolerance
Code Tolerance
D
± 0.5 %
F
±1%
J
±5%
Resistance Value
The first two or three digits are significant figures
of resistance and the third or 4th one denotes
number of zeros following.
Three digit type (±5%),
four digit type (±1%, ±0.5%)
Example: 222 2.2 k , 1002 10 k
Code
V
Packaging Methods
Packaging
Punched Carrier Taping
4 mm pitch, 5,000 pcs.
Type
ERJP03
ERJPA3
ERJP06
ERJP08
U
Embossed Carrier Taping
ERJP14
4 mm pitch, 5,000 pcs.
ERJP6W(double-sided resistive elements structure)
1
2
3
4
5
6
7
8
9
10
11
12
Resistance Tolerance
Size, Power Rating
Product Code
Thick Film
Type: inch Power R. Code Tolerance
Chip Resistors P6W : 0805 0.5 W
F
±1%
J
±5%
Resistance Value
The first two or three digits are significant figures of resistance
and the third or 4th one denotes number of zeros following.
Three digit type (±5%), four digit type (±1%)
Example: 222 2.2 k , 1002 10 k
Packaging Methods
Code
V
Packaging
Punched Carrier Taping
4 mm pitch, 5,000 pcs.
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
04
Apr. 2013
19
Strain gauge conditioning circuit
This is a strain gauge conditioning circuit. The RV in the figure represents the strain gauge. Is there any expert who can help me with quantitative analysis?...
xzyxtt Analog electronics
Semiconductor Process
Semiconductor ProcessMEMS manufacturing technology, especially the largest silicon-based micromachining technology , originally originated from the process technology of semiconductor components, so t...
ruopu PCB Design
Application of high precision operational amplifier materials
[i=s] This post was last edited by paulhyde on 2014-9-15 03:46 [/i] It is mainly used to amplify weak signals, especially weak signals from sensors. AD620 and OP07 work together. AD620 can be used as ...
hzxbmw Electronics Design Contest
RFIC Design Challenges and Design Process Analysis
In recent years, the market demand for mobile communications has grown rapidly. Current mobile communication systems can already use mature signal processing technology to obtain higher information tr...
fish001 RF/Wirelessly
Offset Voltage Compensation for Precision Amplifiers
The article is good and worth reading...
dontium Analogue and Mixed Signal
Voltage Conversion: It Doesn't Get Easier Than This
[align=left][color=#000]Author: [color=rgb(205, 23, 31)][url=http://e2e.ti.com/members/28409/default.aspx]Chris Cockrill[/url][/color] Texas Instruments Today, modern design companies are not only str...
qwqwqw2088 Analogue and Mixed Signal

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 410  225  261  946  2766  9  5  6  20  56 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号