5962-01-083-7835 datasheet, PDF

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5962-01-083-7835: DescriptionIC,ANALOG SWITCH,QUAD,SPST,CMOS,DIP,16PIN,CERAMIC; CategoryAnalog mixed-signal IC The signal circuit; File Size447KB，8 Pages; ManufacturerRenesas Electronics Corporation; Websitehttps://www.renesas.com/

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5962-01-083-7835 Overview

IC,ANALOG SWITCH,QUAD,SPST,CMOS,DIP,16PIN,CERAMIC

5962-01-083-7835 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Renesas Electronics Corporation
package instruction	DIP, DIP16,.3
Reach Compliance Code	not_compliant
JESD-30 code	R-XDIP-T16
Nominal Negative Supply Voltage (Vsup)	-15 V
normal position	NC
Number of functions	4
Number of terminals	16
Maximum on-state resistance (Ron)	125 Ω
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
output	SEPARATE OUTPUT
Package body material	CERAMIC
encapsulated code	DIP
Encapsulate equivalent code	DIP16,.3
Package shape	RECTANGULAR
Package form	IN-LINE
power supply	+-15 V
Certification status	Not Qualified
Nominal supply voltage (Vsup)	15 V
surface mount	NO
Maximum connection time	1000 ns
switch	BREAK-BEFORE-MAKE
technology	CMOS
Temperature level	MILITARY
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL

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Description	IC,ANALOG SWITCH,QUAD,SPST,CMOS,DIP,16PIN,CERAMIC	IC,ANALOG SWITCH,DUAL,SPST,CMOS,DIP,14PIN,CERAMIC	IC,ANALOG SWITCH,DUAL,SPST,CMOS,DIP,14PIN,CERAMIC	IC,ANALOG SWITCH,QUAD,SPST,CMOS,DIP,16PIN,CERAMIC	IC,ANALOG SWITCH,DUAL,SPST,CMOS,DIP,14PIN,CERAMIC	IC,ANALOG SWITCH,QUAD,SPST,CMOS,DIP,16PIN,CERAMIC	IC,ANALOG SWITCH,DUAL,SPST,CMOS,DIP,14PIN,CERAMIC	IC,ANALOG SWITCH,QUAD,SPST,CMOS,DIP,16PIN,CERAMIC	IC,ANALOG SWITCH,DUAL,SPST,CMOS,CAN,10PIN,METAL
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Reach Compliance Code	not_compliant	_compli	_compli	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant
JESD-30 code	R-XDIP-T16	R-XDIP-T14	R-XDIP-T14	R-XDIP-T16	R-XDIP-T14	R-XDIP-T16	R-XDIP-T14	R-XDIP-T16	O-MBCY-W10
Nominal Negative Supply Voltage (Vsup)	-15 V	-15 V	-15 V	-15 V	-15 V	-15 V	-15 V	-15 V	-15 V
normal position	NC	NC	NC	NC	NC	NC	NC	NC	NC
Number of functions	4	2	2	4	2	4	2	4	2
Number of terminals	16	14	14	16	14	16	14	16	10
Maximum operating temperature	125 °C	125 °C	125 °C	125 °C	125 °C	70 °C	125 °C	125 °C	125 °C
Minimum operating temperature	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-	-55 °C	-55 °C	-55 °C
output	SEPARATE OUTPUT	SEPARATE OUTPUT	SEPARATE OUTPUT	SEPARATE OUTPUT	SEPARATE OUTPUT	SEPARATE OUTPUT	SEPARATE OUTPUT	SEPARATE OUTPUT	SEPARATE OUTPUT
Package body material	CERAMIC	CERAMIC	CERAMIC	CERAMIC	CERAMIC	CERAMIC	CERAMIC	CERAMIC	METAL
Encapsulate equivalent code	DIP16,.3	DIP14,.3	DIP14,.3	DIP16,.3	DIP14,.3	DIP16,.3	DIP14,.3	DIP16,.3	CAN10,.23
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	ROUND
Package form	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	CYLINDRICAL
power supply	+-15 V	+-15 V	+-15 V	+-15 V	+-15 V	+-15 V	+-15 V	+-15 V	+-15 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Nominal supply voltage (Vsup)	15 V	15 V	15 V	15 V	15 V	15 V	15 V	15 V	15 V
switch	BREAK-BEFORE-MAKE	BREAK-BEFORE-MAKE	BREAK-BEFORE-MAKE	BREAK-BEFORE-MAKE	BREAK-BEFORE-MAKE	BREAK-BEFORE-MAKE	BREAK-BEFORE-MAKE	BREAK-BEFORE-MAKE	BREAK-BEFORE-MAKE
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	COMMERCIAL	MILITARY	MILITARY	MILITARY
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	WIRE
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	BOTTOM
Maker	Renesas Electronics Corporation	-	-	Renesas Electronics Corporation	Renesas Electronics Corporation	Renesas Electronics Corporation	Renesas Electronics Corporation	Renesas Electronics Corporation	Renesas Electronics Corporation
package instruction	DIP, DIP16,.3	DIP, DIP14,.3	DIP, DIP14,.3	DIP, DIP16,.3	DIP, DIP14,.3	-	-	-	-
Maximum on-state resistance (Ron)	125 Ω	-	100 Ω	125 Ω	-	-	100 Ω	125 Ω	100 Ω
encapsulated code	DIP	DIP	DIP	DIP	DIP	DIP	DIP	DIP	-
surface mount	NO	NO	NO	NO	NO	NO	NO	NO	-
Maximum connection time	1000 ns	-	1000 ns	1000 ns	-	-	1000 ns	1000 ns	1000 ns
Terminal pitch	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	-

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