IC,ANALOG SWITCH,DUAL,SPST,CMOS,DIP,14PIN,CERAMIC
| Parameter Name | Attribute value |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| package instruction | DIP, DIP14,.3 |
| Reach Compliance Code | _compli |
| JESD-30 code | R-XDIP-T14 |
| Nominal Negative Supply Voltage (Vsup) | -15 V |
| normal position | NC |
| Number of functions | 2 |
| Number of terminals | 14 |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| output | SEPARATE OUTPUT |
| Package body material | CERAMIC |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP14,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| power supply | +-15 V |
| Certification status | Not Qualified |
| Nominal supply voltage (Vsup) | 15 V |
| surface mount | NO |
| switch | BREAK-BEFORE-MAKE |
| technology | CMOS |
| Temperature level | MILITARY |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| Base Number Matches | 1 |
| 5962-01-265-0351 | 5962-01-220-6319 | 5962-01-345-8131 | 5962-01-134-7191 | HI1-0201-5-A | DG200AK/883B | DG201AK/883B | DG200AA/883B | 5962-01-083-7835 | |
|---|---|---|---|---|---|---|---|---|---|
| Description | IC,ANALOG SWITCH,DUAL,SPST,CMOS,DIP,14PIN,CERAMIC | IC,ANALOG SWITCH,DUAL,SPST,CMOS,DIP,14PIN,CERAMIC | IC,ANALOG SWITCH,QUAD,SPST,CMOS,DIP,16PIN,CERAMIC | IC,ANALOG SWITCH,DUAL,SPST,CMOS,DIP,14PIN,CERAMIC | IC,ANALOG SWITCH,QUAD,SPST,CMOS,DIP,16PIN,CERAMIC | IC,ANALOG SWITCH,DUAL,SPST,CMOS,DIP,14PIN,CERAMIC | IC,ANALOG SWITCH,QUAD,SPST,CMOS,DIP,16PIN,CERAMIC | IC,ANALOG SWITCH,DUAL,SPST,CMOS,CAN,10PIN,METAL | IC,ANALOG SWITCH,QUAD,SPST,CMOS,DIP,16PIN,CERAMIC |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| Reach Compliance Code | _compli | _compli | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant |
| JESD-30 code | R-XDIP-T14 | R-XDIP-T14 | R-XDIP-T16 | R-XDIP-T14 | R-XDIP-T16 | R-XDIP-T14 | R-XDIP-T16 | O-MBCY-W10 | R-XDIP-T16 |
| Nominal Negative Supply Voltage (Vsup) | -15 V | -15 V | -15 V | -15 V | -15 V | -15 V | -15 V | -15 V | -15 V |
| normal position | NC | NC | NC | NC | NC | NC | NC | NC | NC |
| Number of functions | 2 | 2 | 4 | 2 | 4 | 2 | 4 | 2 | 4 |
| Number of terminals | 14 | 14 | 16 | 14 | 16 | 14 | 16 | 10 | 16 |
| Maximum operating temperature | 125 °C | 125 °C | 125 °C | 125 °C | 70 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| Minimum operating temperature | -55 °C | -55 °C | -55 °C | -55 °C | - | -55 °C | -55 °C | -55 °C | -55 °C |
| output | SEPARATE OUTPUT | SEPARATE OUTPUT | SEPARATE OUTPUT | SEPARATE OUTPUT | SEPARATE OUTPUT | SEPARATE OUTPUT | SEPARATE OUTPUT | SEPARATE OUTPUT | SEPARATE OUTPUT |
| Package body material | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | METAL | CERAMIC |
| Encapsulate equivalent code | DIP14,.3 | DIP14,.3 | DIP16,.3 | DIP14,.3 | DIP16,.3 | DIP14,.3 | DIP16,.3 | CAN10,.23 | DIP16,.3 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | ROUND | RECTANGULAR |
| Package form | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | CYLINDRICAL | IN-LINE |
| power supply | +-15 V | +-15 V | +-15 V | +-15 V | +-15 V | +-15 V | +-15 V | +-15 V | +-15 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Nominal supply voltage (Vsup) | 15 V | 15 V | 15 V | 15 V | 15 V | 15 V | 15 V | 15 V | 15 V |
| switch | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | MILITARY | MILITARY | MILITARY | MILITARY | COMMERCIAL | MILITARY | MILITARY | MILITARY | MILITARY |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | WIRE | THROUGH-HOLE |
| Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | BOTTOM | DUAL |
| package instruction | DIP, DIP14,.3 | DIP, DIP14,.3 | DIP, DIP16,.3 | DIP, DIP14,.3 | - | - | - | - | DIP, DIP16,.3 |
| encapsulated code | DIP | DIP | DIP | DIP | DIP | DIP | DIP | - | DIP |
| surface mount | NO | NO | NO | NO | NO | NO | NO | - | NO |
| Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | - | 2.54 mm |
| Maximum on-state resistance (Ron) | - | 100 Ω | 125 Ω | - | - | 100 Ω | 125 Ω | 100 Ω | 125 Ω |
| Maximum connection time | - | 1000 ns | 1000 ns | - | - | 1000 ns | 1000 ns | 1000 ns | 1000 ns |
| Maker | - | - | Renesas Electronics Corporation | Renesas Electronics Corporation | Renesas Electronics Corporation | Renesas Electronics Corporation | Renesas Electronics Corporation | Renesas Electronics Corporation | Renesas Electronics Corporation |