IC,ANALOG MUX,SINGLE,8-CHANNEL,CMOS,DIP,28PIN,CERAMIC
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Renesas Electronics Corporation |
| Reach Compliance Code | not_compliant |
| Analog Integrated Circuits - Other Types | DIFFERENTIAL MULTIPLEXER |
| JESD-30 code | R-XDIP-T28 |
| Nominal Negative Supply Voltage (Vsup) | -15 V |
| Number of channels | 8 |
| Number of functions | 1 |
| Number of terminals | 28 |
| Maximum on-state resistance (Ron) | 1800 Ω |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| Package body material | CERAMIC |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP28,.6 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| power supply | +-15 V |
| Certification status | Not Qualified |
| Maximum signal current | 0.02 A |
| Maximum supply current (Isup) | 2 mA |
| Nominal supply voltage (Vsup) | 15 V |
| surface mount | NO |
| Maximum connection time | 500 ns |
| switch | BREAK-BEFORE-MAKE |
| technology | CMOS |
| Temperature level | MILITARY |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| HI1-507A-2 | HI4-508A-8 | HI4-506A-8 | HI4-509A-8 | HI4-507A-8 | HI1-507A-5 | |
|---|---|---|---|---|---|---|
| Description | IC,ANALOG MUX,SINGLE,8-CHANNEL,CMOS,DIP,28PIN,CERAMIC | IC,ANALOG MUX,SINGLE,8-CHANNEL,CMOS,LLCC,20PIN,CERAMIC | IC,ANALOG MUX,SINGLE,16-CHANNEL,CMOS,LLCC,28PIN,CERAMIC | IC,ANALOG MUX,SINGLE,4-CHANNEL,CMOS,LLCC,20PIN,CERAMIC | IC,ANALOG MUX,SINGLE,8-CHANNEL,CMOS,LLCC,28PIN,CERAMIC | 8-CHANNEL, DIFFERENTIAL MULTIPLEXER, CDIP28, CERAMIC, DIP-16 |
| Reach Compliance Code | not_compliant | unknown | unknown | unknown | unknown | not_compliant |
| JESD-30 code | R-XDIP-T28 | S-XQCC-N20 | S-XQCC-N28 | S-XQCC-N20 | S-XQCC-N28 | R-CDIP-T28 |
| Nominal Negative Supply Voltage (Vsup) | -15 V | -15 V | -15 V | -15 V | -15 V | -15 V |
| Number of channels | 8 | 8 | 16 | 4 | 8 | 8 |
| Number of functions | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 28 | 20 | 28 | 20 | 28 | 28 |
| Maximum on-state resistance (Ron) | 1800 Ω | 1800 Ω | 1800 Ω | 1800 Ω | 1800 Ω | 1800 Ω |
| Maximum operating temperature | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 75 °C |
| Minimum operating temperature | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | - |
| Package body material | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC, METAL-SEALED COFIRED |
| encapsulated code | DIP | QCCN | QCCN | QCCN | QCCN | DIP |
| Encapsulate equivalent code | DIP28,.6 | LCC20,.35SQ | LCC28,.45SQ | LCC20,.35SQ | LCC28,.45SQ | DIP28,.6 |
| Package shape | RECTANGULAR | SQUARE | SQUARE | SQUARE | SQUARE | RECTANGULAR |
| Package form | IN-LINE | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | IN-LINE |
| power supply | +-15 V | +-15 V | +-15 V | +-15 V | +-15 V | +-15 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum signal current | 0.02 A | 0.02 A | 0.02 A | 0.02 A | 0.02 A | 0.02 A |
| Maximum supply current (Isup) | 2 mA | 2 mA | 2 mA | 2 mA | 2 mA | 2 mA |
| Nominal supply voltage (Vsup) | 15 V | 15 V | 15 V | 15 V | 15 V | 15 V |
| surface mount | NO | YES | YES | YES | YES | NO |
| Maximum connection time | 500 ns | 500 ns | 500 ns | 500 ns | 500 ns | 1000 ns |
| switch | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | COMMERCIAL EXTENDED |
| Terminal form | THROUGH-HOLE | NO LEAD | NO LEAD | NO LEAD | NO LEAD | THROUGH-HOLE |
| Terminal pitch | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 2.54 mm |
| Terminal location | DUAL | QUAD | QUAD | QUAD | QUAD | DUAL |
| package instruction | - | QCCN, LCC20,.35SQ | QCCN, LCC28,.45SQ | QCCN, LCC20,.35SQ | QCCN, LCC28,.45SQ | CERAMIC, DIP-16 |
| Base Number Matches | - | 1 | 1 | 1 | 1 | - |
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