Operating Temperature Range ........................ -40NC to +125NC
Junction Temperature ....................................................+150NC
Lead Temperature (soldering 10s) .................................+300NC
Soldering Temperature (reflow) ......................................+260NC
Note 1:
Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to
www.maxim-ic.com/thermal-tutorial.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
ELECTRICAL CHARACTERISTICS
(V
DD
= 3.3V, V
SS
= 0V, V
IN+
= V
IN-
= V
CM
= V
DD
/2, R
L
= 10kI to V
DD
/2,
SHDN
= V
DD
, T
A
= -40NC to +125NC. Typical values are
at T
A
= +25NC, unless otherwise noted.) (Note 2)
PARAMETER
DC CHARACTERISTICS
Input Voltage Range
Input Offset Voltage
Input Offset Voltage Drift
Input Bias Current (Note 3)
V
IN
+, V
IN
-
V
OS
TCV
OS
I
B
Guaranteed by CMRR
T
A
= +25NC
T
A
= -40NC to +125NC
(Note 3)
T
A
= +25NC
T
A
= -40NC to +85NC
T
A
= -40NC to +125NC
Common-Mode Rejection Ratio
CMRR
V
SS
< V
CM
<
(V
DD
- 1.4V)
T
A
= +25NC
T
A
= -40NC to +125NC
72
68
58
104
100
77
124
120
10
40
R
L
= 10kI
RL = 600I
RL = 10kI
RL = 600I
0.014
0.044
0.019
0.057
0.01
0.03
0.08
0.04
0.1
1
dB
mA
V
V
FA
86
dB
±0.1
V
SS
-
0.1
0.01
V
DD
+
0.1
2.2
3.5
7
±0.8
±50
±800
pA
V
mV
FV/NC
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
(V
SS
- 0.1V) < V
CM
< (V
DD
+ 0.1V)
Open-Loop Gain
Output Short-Circuit Current
Output Voltage Low
Output Voltage High
Output Leakage in Shutdown
(MAX9636, MAX9638 Only)
A
OL
I
SC
VOL
V
OUT
= 0.25V from rails
V
OUT
= 0.4V from rails, R
L
= 600I
Short to V
DD
Short to V
SS
V
OUT
V
DD
- V
OUT
V
OH
SHDN = V
SS
, V
OUT
= 0V to V
DD
2
3V/5V Low-Power, Low-Noise, CMOS,
Rail-to-Rail I/O Op Amps
ELECTRICAL CHARACTERISTICS (continued)
(V
DD
= 3.3V, V
SS
= 0V, V
IN+
= V
IN-
= V
CM
= V
DD
/2, R
L
= 10kI to V
DD
/2,
SHDN
= V
DD
, T
A
= -40NC to +125NC. Typical values are
at T
A
= +25NC, unless otherwise noted.) (Note 2)
PARAMETER
AC CHARACTERISTICS
Input Voltage Noise Density
Input Voltage Noise
Input Current Noise Density
Input Capacitance
Gain Bandwidth
Slew Rate
Capacitive Loading
Distortion
Settling Time
POWER-SUPPLY CHARACTERISTICS
Power-Supply Range
Power-Supply Rejection Ratio
Quiescent Current
Shutdown Supply Current
(MAX9636, MAX9638 Only)
Shutdown Input Low (MAX9636,
MAX9638 Only)
Shutdown Input High (MAX9636,
MAX9638 Only)
Shutdown Input Bias Current
(MAX9636, MAX9638 Only)
Turn-On Time (MAX9636,
MAX9638 Only)
Power-Up Time
V
DD
PSRR
I
DD
I
DD_SHDN
V
IL
V
IH
I
SHDN
t
ON
t
UP
Guaranteed by PSRR
V
IN
+ = V
IN
- = V
SS
,
V
DD
- V
SS
= 2.1V
to 5.5V
Per amplifier
V
SHDN
P
V
IL
Over the power-supply range
Over the power-supply range
(Note 3)
V
SHDN
= 0V to 3V
V
DD
= 0V to 3.3V
1.4
1
60
18
100
T
A
= +25NC
T
A
= -40NC to +125NC
T
A
= +25NC
T
A
= -40NC to +125NC
2.1
72
69
36
55
60
1
0.5
100
5.5
V
dB
I
N
C
IN
GBW
SR
C
LOAD
THD
No sustained oscillations
f = 10kHz, V
O
= 2V
P-P
, A
V
= 1V/V
f = 10kHz, V
O
= 2V
P-P
, A
V
= 1V/V,
V
DD
= 5.5V
To 0.1%, V
OUT
= 2V step, A
V
= 1V/V
e
N
f = 1kHz
0.1Hz ≤ f ≤ 10Hz
f = 1kHz
38
5
50
2
1.5
0.9
300
-68
-74
11.5
dB
Fs
nV/√Hz
FV
P-P
fA/√Hz
pF
MHz
V/Fs
pF
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
MAX9636/MAX9637/MAX9638
FA
FA
V
V
nA
Fs
Fs
Note 2:
All devices are 100% production tested at T
A
= +25NC. Temperature limits are guaranteed by design.
My earliest knowledge of the corresponding camera should be from the Freescale smart car (now it should be NXP smart car). At that time, there was a camera group. I did not participate in this group, ...
[i=s] This post was last edited by Feng Qingqing on 2021-3-30 17:08[/i]Sorry for asking such a basic question, thanks in advance.
Recently I saw a read timing diagram, as follows:
I understand the gen...
I have just designed various boards, using STM32F103 as the main control chip to control the ENC80J60 network module. The schematic diagram refers to the Wildfire development board. Now during debuggi...
Overview For more than 40 years, industrial process control system designers have worked closely with Analog Devices to define, develop, and implement complete signal chain solutions optimized for a v...
stm32/stm8
京公网安备 11010802033920号
EEWORLD
