AS7C251MNTD36A-200TQCN datasheet, PDF

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AS7C251MNTD36A-200TQCN: Description2.5V 1M x 32/36 Pipelined SRAM with NTD; Categorystorage storage; File Size418KB，18 Pages; ManufacturerALSC [Alliance Semiconductor Corporation]; Environmental Compliance

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AS7C251MNTD36A-200TQCN Overview

2.5V 1M x 32/36 Pipelined SRAM with NTD

AS7C251MNTD36A-200TQCN Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	ALSC [Alliance Semiconductor Corporation]
Parts packaging code	QFP
package instruction	LQFP, QFP100,.63X.87
Contacts	100
Reach Compliance Code	unknow
ECCN code	3A991.B.2.A
Maximum access time	3.2 ns
Other features	PIPELINED ARCHITECTURE
Maximum clock frequency (fCLK)	200 MHz
I/O type	COMMON
JESD-30 code	R-PQFP-G100
JESD-609 code	e3
length	20 mm
memory density	37748736 bi
Memory IC Type	ZBT SRAM
memory width	36
Number of functions	1
Number of terminals	100
word count	1048576 words
character code	1000000
Operating mode	SYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	1MX36
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	LQFP
Encapsulate equivalent code	QFP100,.63X.87
Package shape	RECTANGULAR
Package form	FLATPACK, LOW PROFILE
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	245
power supply	2.5 V
Certification status	Not Qualified
Maximum seat height	1.6 mm
Maximum standby current	0.06 A
Minimum standby current	2.38 V
Maximum slew rate	0.4 mA
Maximum supply voltage (Vsup)	2.625 V
Minimum supply voltage (Vsup)	2.375 V
Nominal supply voltage (Vsup)	2.5 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	MATTE TIN
Terminal form	GULL WING
Terminal pitch	0.65 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	30
width	14 mm

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January 2005

AS7C251MNTD32A

AS7C251MNTD36A

2.5V 1M × 32/36 Pipelined SRAM with NTD

Features

• Organization: 1,048,576 words × 32 or 36 bits

• NTD

™

architecture for efficient bus operation

• Fast clock speeds to 200 MHz

• Fast clock to data access: 3.2/3.5/3.8 ns

• Fast OE access time: 3.2/3.5/3.8 ns

• Fully synchronous operation

• pipelined mode

• Common data inputs and data outputs

• Asynchronous output enable control

Logic block diagram

A[19:0]

• Available in 100-pin TQFP packages

• Byte write enables

• Clock enable for operation hold

• Multiple chip enables for easy expansion

• 2.5V core power supply

• Self-timed write cycles

• Interleaved or linear burst modes

• Snooze mode for standby operation

Address

Burst logic

CLK

CE0

CE1

CE2

R/W

BWa

BWb

BWc

BWd

ADV / LD

LBO

Write delay

addr. registers

CLK

Control

logic

CLK

Write Buffer

CLK

1M x 32/36

SRAM

Array

DQ[a,b,c,d]

32/36

Data

Input

CLK

32/36

CLK

CEN

CLK

Output

32/36

DQ[a,b,c,d]

Selection guide

-200

Minimum cycle time

Maximum clock frequency

Maximum clock access time

Maximum operating current

Maximum standby current

Maximum CMOS standby current (DC)

1/17/05, V 1.2

-166

166

3.5

400

150

-133

7.5

133

3.8

350

140

Units

MHz

P. 1 of 18

200

3.2

450

170

Alliance Semiconductor

AS7C251MNTD36A-200TQCN Related Products

	AS7C251MNTD36A-200TQCN	AS7C251MNTD32A	AS7C251MNTD36A-166TQI	AS7C251MNTD36A-166TQIN
Description	2.5V 1M x 32/36 Pipelined SRAM with NTD	2.5V 1M x 32/36 Pipelined SRAM with NTD	2.5V 1M x 32/36 Pipelined SRAM with NTD	2.5V 1M x 32/36 Pipelined SRAM with NTD
Is it Rohs certified?	conform to	-	incompatible	conform to
Maker	ALSC [Alliance Semiconductor Corporation]	-	ALSC [Alliance Semiconductor Corporation]	ALSC [Alliance Semiconductor Corporation]
Parts packaging code	QFP	-	QFP	QFP
package instruction	LQFP, QFP100,.63X.87	-	LQFP,	LQFP,
Contacts	100	-	100	100
Reach Compliance Code	unknow	-	unknow	unknow
ECCN code	3A991.B.2.A	-	3A991.B.2.A	3A991.B.2.A
Maximum access time	3.2 ns	-	3.5 ns	3.5 ns
Other features	PIPELINED ARCHITECTURE	-	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE
JESD-30 code	R-PQFP-G100	-	R-PQFP-G100	R-PQFP-G100
JESD-609 code	e3	-	e0	e3
length	20 mm	-	20 mm	20 mm
memory density	37748736 bi	-	37748736 bi	37748736 bi
Memory IC Type	ZBT SRAM	-	ZBT SRAM	ZBT SRAM
memory width	36	-	36	36
Number of functions	1	-	1	1
Number of terminals	100	-	100	100
word count	1048576 words	-	1048576 words	1048576 words
character code	1000000	-	1000000	1000000
Operating mode	SYNCHRONOUS	-	SYNCHRONOUS	SYNCHRONOUS
Maximum operating temperature	70 °C	-	85 °C	85 °C
organize	1MX36	-	1MX36	1MX36
Package body material	PLASTIC/EPOXY	-	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	LQFP	-	LQFP	LQFP
Package shape	RECTANGULAR	-	RECTANGULAR	RECTANGULAR
Package form	FLATPACK, LOW PROFILE	-	FLATPACK, LOW PROFILE	FLATPACK, LOW PROFILE
Parallel/Serial	PARALLEL	-	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	245	-	NOT SPECIFIED	245
Certification status	Not Qualified	-	Not Qualified	Not Qualified
Maximum seat height	1.6 mm	-	1.6 mm	1.6 mm
Maximum supply voltage (Vsup)	2.625 V	-	2.625 V	2.625 V
Minimum supply voltage (Vsup)	2.375 V	-	2.375 V	2.375 V
Nominal supply voltage (Vsup)	2.5 V	-	2.5 V	2.5 V
surface mount	YES	-	YES	YES
technology	CMOS	-	CMOS	CMOS
Temperature level	COMMERCIAL	-	INDUSTRIAL	INDUSTRIAL
Terminal surface	MATTE TIN	-	TIN LEAD	MATTE TIN
Terminal form	GULL WING	-	GULL WING	GULL WING
Terminal pitch	0.65 mm	-	0.65 mm	0.65 mm
Terminal location	QUAD	-	QUAD	QUAD
Maximum time at peak reflow temperature	30	-	NOT SPECIFIED	30
width	14 mm	-	14 mm	14 mm

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