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AS7C251MNTD36A-166TQI

Description
2.5V 1M x 32/36 Pipelined SRAM with NTD
Categorystorage    storage   
File Size418KB,18 Pages
ManufacturerALSC [Alliance Semiconductor Corporation]
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AS7C251MNTD36A-166TQI Overview

2.5V 1M x 32/36 Pipelined SRAM with NTD

AS7C251MNTD36A-166TQI Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerALSC [Alliance Semiconductor Corporation]
Parts packaging codeQFP
package instructionLQFP,
Contacts100
Reach Compliance Codeunknow
ECCN code3A991.B.2.A
Maximum access time3.5 ns
Other featuresPIPELINED ARCHITECTURE
JESD-30 codeR-PQFP-G100
JESD-609 codee0
length20 mm
memory density37748736 bi
Memory IC TypeZBT SRAM
memory width36
Number of functions1
Number of terminals100
word count1048576 words
character code1000000
Operating modeSYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize1MX36
Package body materialPLASTIC/EPOXY
encapsulated codeLQFP
Package shapeRECTANGULAR
Package formFLATPACK, LOW PROFILE
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
Certification statusNot Qualified
Maximum seat height1.6 mm
Maximum supply voltage (Vsup)2.625 V
Minimum supply voltage (Vsup)2.375 V
Nominal supply voltage (Vsup)2.5 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTIN LEAD
Terminal formGULL WING
Terminal pitch0.65 mm
Terminal locationQUAD
Maximum time at peak reflow temperatureNOT SPECIFIED
width14 mm
January 2005
®
AS7C251MNTD32A
AS7C251MNTD36A
2.5V 1M × 32/36 Pipelined SRAM with NTD
TM
Features
• Organization: 1,048,576 words × 32 or 36 bits
• NTD
architecture for efficient bus operation
• Fast clock speeds to 200 MHz
• Fast clock to data access: 3.2/3.5/3.8 ns
• Fast OE access time: 3.2/3.5/3.8 ns
• Fully synchronous operation
• pipelined mode
• Common data inputs and data outputs
• Asynchronous output enable control
Logic block diagram
A[19:0]
20
D
• Available in 100-pin TQFP packages
• Byte write enables
• Clock enable for operation hold
• Multiple chip enables for easy expansion
• 2.5V core power supply
• Self-timed write cycles
• Interleaved or linear burst modes
• Snooze mode for standby operation
Address
register
Burst logic
Q
20
CLK
CE0
CE1
CE2
R/W
BWa
BWb
BWc
BWd
ADV / LD
LBO
ZZ
D
Q
20
Write delay
addr. registers
CLK
Control
logic
CLK
Write Buffer
CLK
1M x 32/36
SRAM
Array
DQ[a,b,c,d]
32/36
D
Data
Q
Input
Register
CLK
32/36
32/36
32/36
32/36
CLK
CEN
CLK
OE
Output
Register
32/36
OE
DQ[a,b,c,d]
Selection guide
-200
Minimum cycle time
Maximum clock frequency
Maximum clock access time
Maximum operating current
Maximum standby current
Maximum CMOS standby current (DC)
1/17/05, V 1.2
-166
6
166
3.5
400
150
90
-133
7.5
133
3.8
350
140
90
Units
ns
MHz
ns
mA
mA
mA
P. 1 of 18
5
200
3.2
450
170
90
Alliance Semiconductor
Copyright © Alliance Semiconductor. All rights reserved.

AS7C251MNTD36A-166TQI Related Products

AS7C251MNTD36A-166TQI AS7C251MNTD32A AS7C251MNTD36A-166TQIN AS7C251MNTD36A-200TQCN
Description 2.5V 1M x 32/36 Pipelined SRAM with NTD 2.5V 1M x 32/36 Pipelined SRAM with NTD 2.5V 1M x 32/36 Pipelined SRAM with NTD 2.5V 1M x 32/36 Pipelined SRAM with NTD
Is it Rohs certified? incompatible - conform to conform to
Maker ALSC [Alliance Semiconductor Corporation] - ALSC [Alliance Semiconductor Corporation] ALSC [Alliance Semiconductor Corporation]
Parts packaging code QFP - QFP QFP
package instruction LQFP, - LQFP, LQFP, QFP100,.63X.87
Contacts 100 - 100 100
Reach Compliance Code unknow - unknow unknow
ECCN code 3A991.B.2.A - 3A991.B.2.A 3A991.B.2.A
Maximum access time 3.5 ns - 3.5 ns 3.2 ns
Other features PIPELINED ARCHITECTURE - PIPELINED ARCHITECTURE PIPELINED ARCHITECTURE
JESD-30 code R-PQFP-G100 - R-PQFP-G100 R-PQFP-G100
JESD-609 code e0 - e3 e3
length 20 mm - 20 mm 20 mm
memory density 37748736 bi - 37748736 bi 37748736 bi
Memory IC Type ZBT SRAM - ZBT SRAM ZBT SRAM
memory width 36 - 36 36
Number of functions 1 - 1 1
Number of terminals 100 - 100 100
word count 1048576 words - 1048576 words 1048576 words
character code 1000000 - 1000000 1000000
Operating mode SYNCHRONOUS - SYNCHRONOUS SYNCHRONOUS
Maximum operating temperature 85 °C - 85 °C 70 °C
organize 1MX36 - 1MX36 1MX36
Package body material PLASTIC/EPOXY - PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code LQFP - LQFP LQFP
Package shape RECTANGULAR - RECTANGULAR RECTANGULAR
Package form FLATPACK, LOW PROFILE - FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE
Parallel/Serial PARALLEL - PARALLEL PARALLEL
Peak Reflow Temperature (Celsius) NOT SPECIFIED - 245 245
Certification status Not Qualified - Not Qualified Not Qualified
Maximum seat height 1.6 mm - 1.6 mm 1.6 mm
Maximum supply voltage (Vsup) 2.625 V - 2.625 V 2.625 V
Minimum supply voltage (Vsup) 2.375 V - 2.375 V 2.375 V
Nominal supply voltage (Vsup) 2.5 V - 2.5 V 2.5 V
surface mount YES - YES YES
technology CMOS - CMOS CMOS
Temperature level INDUSTRIAL - INDUSTRIAL COMMERCIAL
Terminal surface TIN LEAD - MATTE TIN MATTE TIN
Terminal form GULL WING - GULL WING GULL WING
Terminal pitch 0.65 mm - 0.65 mm 0.65 mm
Terminal location QUAD - QUAD QUAD
Maximum time at peak reflow temperature NOT SPECIFIED - 30 30
width 14 mm - 14 mm 14 mm
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