Typical circuit applications: HF/RF Power Amplifiers, Transmitters,
Antenna Tuning, Plasma Chambers and Medical (MRI coils).
ELECTRICAL AND MECHANICAL
SPECIFICATIONS
QUALITY FACTOR (Q):
Greater than 5,000 (3.3 pF to 1000 pF) @ 1 MHz.
Greater than 5,000 (1100 pF to 5100 pF) @ 1 KHz.
TEMPERATURE COEFFICIENT OF CAPACITANCE (TCC):
0 ±30 PPM/°C (-55°C to +125°C)
INSULATION RESISTANCE (IR):
10
5
Megohms min. @ +25°C at rated WVDC
10
4
Megohms min. @ +125°C at rated WVDC
Max. test voltage is 500 VDC.
WORKING VOLTAGE (WVDC):
See Capacitance Values Table, page 2
DIELECTRIC WITHSTANDING VOLTAGE (DWV):
120% of WVDC for 5 seconds..
ENVIRONMENTAL TESTS
ATC 800 E Series Capacitors are designed and manufactured to
meet and exceed the requirements of EIA-198, MIL-PRF-55681 and
MIL-PRF-123.
THERMAL SHOCK:
MIL-STD-202, Method 107, Condition A
MOISTURE RESISTANCE:
MIL-STD-202, Method 106
LOW VOLTAGE HUMIDITY:
MIL-STD-202, Method 103, Condition A, with 1.5 Volts DC applied
while subjected to an environment of 85°C with 85% relative
humidity for 240 hours min.
LIFE TEST:
RETRACE:
Less than ±(0.02% or 0.02 pF), whichever is greater
AGING EFFECTS:
None
PIEzOELECTRIC EFFECTS:
None
(No capacitance variation with voltage or pressure)
CAPACITANCE DRIFT:
±(0.02% or 0.02 pF), whichever is greater
OPERATING TEMPERATURE RANGE:
From -55°C to +125°C
TERMINATION STYLE:
See Mechanical Configurations, page 3
TERMINAL STRENGTH:
Terminations for chips withstand a pull of 10
lbs. min., 25 lbs. typical, for 5 seconds in direction perpendicular
to the termination surface of the capacitor. Test per MIL-STD-202,
method 211.
MIL-STD-202, Method 108, for 2000 hours, at 125°C.
Voltage applied.
120% of WVDC for capacitors rated at 1250 volts DC or less.
100% of WVDC for capacitors rated above 1250 volts DC
ISO 9001
REGISTERED
COMPANY
ATC # 001-1077 Rev. M, 6/13
ATC 800 E Capacitance Values
CAP.
CODE
3R3
3R6
3R9
4R3
4R7
5R1
5R6
6R2
6R8
7R5
8R2
9R1
100
110
120
130
150
160
180
200
220
240
270
300
330
CAP.
(pF)
3.3
3.6
3.9
4.3
4.7
5.1
5.6
6.2
6.8
7.5
8.2
9.1
10
11
12
13
15
16
18
20
22
24
27
30
33
TOL.
RATED WVDC
CAP.
CODE
360
390
430
470
510
560
620
680
750
820
910
101
111
121
131
151
161
181
201
221
241
271
301
331
361
CAP.
(pF)
36
39
43
47
51
56
62
68
75
82
91
100
110
120
130
150
160
180
200
220
240
270
300
330
360
TOL.
RATED WVDC
CAP.
CODE
391
431
471
511
561
621
681
751
821
911
102
112
122
132
152
162
182
202
222
242
272
302
332
392
472
512
CAP.
(pF)
390
430
470
510
560
620
680
750
820
910
1000
1100
1200
1300
1500
1600
1800
2000
2200
2400
2700
3000
3300
3900
4700
5100
TOL.
RATED WVDC
3600
B, C, D
7200
F, G, J, K
2500
7200
F, G, J, K
F, G, J, K
3600
G, J, K
2000
CAPACITANCE TOLERANCE
J
B
C
D
F
G
K
Code
±0.1 pF ±0.25 pF ±0.5 pF ±1% ±2% ±5% ±10%
Tol.
ATC PART NUMBER CODE
ATC800 E 22 0 J TN 7200 X
Series
Case Size
Capacitance Code:
First 2 significant digits for capacitance.
R=Decimal Point
Indicates number of zeros following digits
of capacitance in picofarads except for decimal values.
Capacitance Tolerance
Termination Code
Packaging
C - ATC Matrix Tray (Standard)
T - Tape and Reel, 250 pc. qty.
I - Special Packaging (Consult Factory)
Laser Marking
C
WVDC
The above part number refers to a 800 E Series (case size E) 22 pF capacitor, J tolerance (±5%), 7200 WVDC,
with TN termination (Tin Plated over Non-Magnetic Barrier Termination), laser marking and plastic Matrix Tray packaging.
ATC accepts orders for our parts using designations with or without the
“ATC” prefix. Both methods of defining the part number are equivalent, i.e.,
part numbers referenced with the “ATC” prefix are interchangeable to parts
referenced without the “ATC” prefix. Customers are free to use either in
specifying or procuring parts from American Technical Ceramics.
For additional information and catalogs contact your ATC
representative or call direct at (631) 622-4700.
Consult factory for additional performance data.
C E R A M I C S
ATC North America
631-622-4700
•
sales@atceramics.com
A M E R I C A N
ATC Europe
+46 8 6830410
•
sales@atceramics-europe.com
T E C H N I C A L
ATC Asia
86-755-2396-8759
•
sales@atceramics-asia.com
2
w w w . a t c e r a m i c s . c o m
ATC 800 E Capacitors: Mechanical Configurations
ATC
SERIES
& CASE
SIzE
ATC
CASE SIzE
TERM. & TYPECASE SIzE
CODE
& TYPE
OUTLINES
W/T IS A
TERMINATION SURFACE
Y
BODY DIMENSIONS
INCHES (mm)
LENGTH
(L)
.380
+.015 -.010
(9.65
+0.38 -0.25)
TL
LEAD AND TERMINATION
DIMENSIONS AND MATERIALS
OVERLAP
(Y)
.040 (1.02)
max.
MATERIALS
WIDTH
(W)
THICKNESS
(T)
800 E
T
E
Solderable Nickel
Barrier
E
W
L
T
Tin Plated over
Nickel Barrier Termination
RoHS Compliant
LL
WL
W
L
800 E
MS
Microstrip
E
T
LL
WL
W
L
TL
800 E
AR
Axial Ribbon
.380
+.015 -.010 .190 (4.83)
(9.65
max.
.380
+.035 -.010 +0.38 -0.25)
(9.65
+0.89
-0.25)
N/A.
T
LL = .750 (19.05) min.
WL = .350 ±.010
(8.89 ±0.25)
TL = .010 ±.005
(0.25 ±0.13)
Leads are Attached with
High Temperature Solder
High Purity
Silver Leads
Custom lead styles and lengths are available; consult factory. All leads are high purity silver attached with high temperature solder and are
RoHS
compliant.
ATC 800 E Non-Magnetic Capacitors: Mechanical Configurations
ATC
SERIES
& CASE
SIzE
ATC
TERM.
CODE
CASE SIzE
& TYPE
OUTLINES
W/T IS A
TERMINATION SURFACE
Y
BODY DIMENSIONS
INCHES (mm)
WIDTH
(W)
LEAD AND TERMINATION
DIMENSIONS AND MATERIALS
OVERLAP
(Y)
.040 (1.02)
max.
MATERIALS
LENGTH
(L)
.380
+.015 -.010
(9.65
+0.38
-0.25)
THICKNESS
(T)
800 E
TN
Non-Mag
Solderable Barrier
E
E
RoHS Compliant
Tin Plated over
Non-Magnetic
Barrier Termination
W
L
T
TL
LL
800 E
MN
Non-Mag
Microstrip
E
WL
L
W
T
LL
WL
W
L
TL
800 E
AN
Non-Mag
Axial Ribbon
.380
+.015 -.010 .190 (4.83)
(9.65
max.
.380
+.035 -.010 +0.38 -0.25)
(9.65
+0.89
-0.25)
N/A.
T
LL = .750 (19.05) min.
WL = .350 ±.010
(8.89 ±0.25)
TL = .010 ±.005
(0.25 ±0.13)
Leads are Attached with
High Temperature Solder.
High Purity
Silver Leads
Custom lead styles and lengths are available; consult factory. All leads are high purity silver attached with high temperature solder and are
RoHS
compliant.
ATC 800 E Capacitors: Suggested Mounting Pad Dimensions
L
L
2
T
W
W
2
0
T
220J
Horizontal
Electrode Orientation
B
J
Case E
Pad Size
A Min.
.205
.185
.405
.385
B Min.
.050
.030
.050
.030
C Min.
.325
.325
.325
.325
D Min.
.425
.385
.425
.385
Normal
High Density
Normal
High Density
Vertical
Electrode Orientation
B
Vertical Mount
Horizontal Mount
A
C
D
ATC North America
631-622-4700
•
sales@atceramics.com
A M E R I C A N
ATC Europe
+46 8 6830410
•
sales@atceramics-europe.com
T E C H N I C A L
ATC Asia
86-755-2396-8759
•
sales@atceramics-asia.com
C E R A M I C S
w w w . a t c e r a m i c s . c o m
3
ATC 800 E Performance Data
800 E ESR vs. Frequency
100
ESR (MilliOhms)
10
10 pF
12 pF
39 pF
47 pF
ESR (MilliOhms)
220 pF
330 pF
750 pF
5100 pF
(Typical)
1
1
10
100
1000
Frequency (MHz)
10000
800 E FSR vs. Capacitance
1000
Frequency (MHz)
100
(Typical)
10
1
10
100
1000
10000
Capacitance (pF)
ATC North America
631-622-4700
•
sales@atceramics.com
A M E R I C A N
ATC Europe
+46 8 6830410
•
sales@atceramics-europe.com
T E C H N I C A L
ATC Asia
86-755-2396-8759
•
sales@atceramics-asia.com
C E R A M I C S
4
w w w . a t c e r a m i c s . c o m
ATC 800 E Performance Data
100
800E Current Ratings vs. Capacitance
The current is based on a 65
o
C mounting surface and a
device thermal resistance of 12
o
C/W. A power dissipation
of 5 W will result in a case temperature of 125
o
C
10
RMS Current (Amps)
30 MHz
10 MHz
1
2 MHz
(Typical)
0
1
10
100
Dotted line = Power dissipation
limit
Solid line = Voltage limit
(Vrms/Xc
Solid line = Voltage limit
(Vrms/Xc)
)
1000
10000
Capacitance (pF)
1
0.8
0.6
0.4
TCC= 0 ±30 PPM/C
800E Capacitance Change vs. Temperature
% Change in Capacitance
0.2
0
-0.2
-0.4
-0.6
-0.8
-1
-55
-35
-15
5
25
45
65
85
105
125
Temperature (Degrees C)
Sales of ATC products are subject to the terms and conditions contained in American Technical Ceramics Corp. Terms and Conditions of Sale (ATC document
#001-992 Rev. B; 12/05). Copies of these terms and conditions will be provided upon request. They may also be viewed on ATC's website at www.atceramics.
com/productfinder/default.asp. Click on the link for Terms and Conditions of Sale.
ATC has made every effort to have this information as accurate as possible. However, no responsibility is assumed by ATC for its use, nor for any infringements of
rights of third parties which may result from its use. ATC reserves the right to revise the content or modify its product without prior notice.
Event details: >>[url=https://www.eeworld.com.cn/huodong/201303_NXP_LPC800/][b][size=5][color=red]Get a free LPC800 mini board[/color][/size][/b][/url] First of all, I would like to apologize to all t...
Yesterday, Brother Yuan added me on MSN. After chatting for a while, I made an appointment to have dinner with him today. We talked about many ideas and feelings. Brother Yuan is a persistent and pers...
These days I have been busy setting up an ARM-Linux cross-compilation environment under Fedora 7. At first I referred to "Building Embedded Linux Systems", a classic book. It introduces a lot of knowl...
Why is the crowdfunding in China so unreliable? [img]http://img30.360buyimg.com/cf/jfs/t2815/272/739877064/93401/fec80eb7/5722d509N17fed6ae.jpg[/img] [img]http://img30.360buyimg.com/cf/jfs/t2824/325/6...
The paper focuses on analyzing the amplitude, phase and frequency characteristics of the signal synthesis and distribution through the passive device Magic T. On this basis, several practical structur...
Reflow soldering, a common soldering method in modern electronics manufacturing, primarily melts solder paste and pads to form solder joints. With technological advancements, soldering equipment ha...[Details]
As the main model among new energy vehicles, pure electric vehicles have received strong support and encouragement from the country in recent years, and their development is changing with each pass...[Details]
In recent years, the government has increasingly supported electric vehicles, and the number of electric vehicles has increased. Observant drivers will notice that there are many more green license...[Details]
Overview
As handheld voice communication devices become more and more popular, they are increasingly used in noisy environments, such as airports, busy roads, crowded bars, etc. In such noisy ...[Details]
Electric vehicles are now widespread, but they've brought with them a host of problems, the most prominent of which is charging. Small electric vehicles (EVs) are a new form of transportation in a ...[Details]
1. Multi-channel DAC technology bottleneck
Currently,
the development of multi-channel DAC technology focuses on two core challenges.
First, industrial applications urgently ...[Details]
On August 20, Geely announced its focus on "One Cockpit". Through a unified AI OS architecture, a unified AI Agent, and a unified user ID, it will achieve an All-in-One AI cockpit, create the first...[Details]
In the field of intelligent driving, regulations are becoming increasingly stringent, and the technical threshold continues to rise. Especially after the traffic accident in March 2025, the Ministr...[Details]
Intel®
Xeon®
6
-
core processors now support the new Amazon EC2 R8i and R8i-flex instances on Amazon Web Services (AWS).
These new instances offer superior performance and fast...[Details]
In daily life, when we purchase a transformer, we are faced with the installation and wiring procedures. Generally speaking, large transformers such as power transformers are equipped with speciali...[Details]
There are more and more electric vehicles. Recently, I have heard some news about electric vehicles performing poorly in winter. I would like to briefly introduce whether heat pump technology is mo...[Details]
With the gradual popularization of new energy vehicles in recent years, more and more people have been able to access and purchase electric vehicles. The structure of electric vehicles is composed ...[Details]
Nascent Micro is launching devices covering a wide range of power applications, including gallium nitride (GaN) drivers, dual-channel automotive drivers, and battery protection MOSFETs.
...[Details]
As the electric vehicle industry continues to surge in today's society, while people are concerned about the appearance and interior of new energy vehicles, they are also concerned about the classi...[Details]
In recent years, with the development of MOSFETs, they have gradually replaced transistors in the low-power, fast-switching industry. Major manufacturers in this field have also been reducing their...[Details]
NXP MCU
京公网安备 11010802033920号
EEWORLD
