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MPS5172

Description
100 mA, 25 V, NPN, Si, SMALL SIGNAL TRANSISTOR, TO-92
CategoryDiscrete semiconductor    The transistor   
File Size96KB,6 Pages
ManufacturerON Semiconductor
Websitehttp://www.onsemi.cn
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MPS5172 Overview

100 mA, 25 V, NPN, Si, SMALL SIGNAL TRANSISTOR, TO-92

MPS5172 Parametric

Parameter NameAttribute value
Brand NameON Semiconduc
Is it lead-free?Contains lead
MakerON Semiconductor
Parts packaging codeTO-92
package instructionCYLINDRICAL, O-PBCY-T3
Contacts3
Manufacturer packaging code29-11
Reach Compliance Code_compli
Maximum collector current (IC)0.1 A
Collector-emitter maximum voltage25 V
ConfigurationSINGLE
Minimum DC current gain (hFE)100
JEDEC-95 codeTO-92
JESD-30 codeO-PBCY-T3
JESD-609 codee0
Number of components1
Number of terminals3
Maximum operating temperature150 °C
Package body materialPLASTIC/EPOXY
Package shapeROUND
Package formCYLINDRICAL
Peak Reflow Temperature (Celsius)240
Polarity/channel typeNPN
Maximum power dissipation(Abs)0.625 W
Certification statusNot Qualified
surface mountNO
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal locationBOTTOM
Maximum time at peak reflow temperature30
Transistor component materialsSILICON
MPS5172
General Purpose Transistor
NPN Silicon
Features
Pb−Free Packages are Available*
http://onsemi.com
COLLECTOR
3
MAXIMUM RATINGS
Rating
Collector−Emitter Voltage
Collector−Base Voltage
Emitter−Base Voltage
Collector Current − Continuous
Total Device Dissipation @ T
A
= 25°C
Derate above 25°C
Total Power Dissipation @ T
A
= 60°C
Total Device Dissipation @ T
C
= 25°C
Derate above 25°C
Operating and Storage Junction
Temperature Range
Symbol
V
CEO
V
CBO
V
EBO
I
C
P
D
P
D
P
D
T
J
, T
stg
Value
25
25
5.0
100
625
5.0
450
1.5
12
−55 to +150
Unit
Vdc
Vdc
Vdc
mAdc
mW
mW/°C
mW
W
mW/°C
°C
TO−92 (TO−226)
CASE 29
STYLE 1
2
BASE
1
EMITTER
1
2
3
THERMAL CHARACTERISTICS
Characteristic
Thermal Resistance, Junction−to−Ambient
Thermal Resistance, Junction−to−Case
Symbol
R
qJA
R
qJC
Max
200
83.3
Unit
°C/W
°C/W
MPS
5172
AYWWG
G
MARKING DIAGRAM
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not normal
operating conditions) and are not valid simultaneously. If these limits are exceeded,
device functional operation is not implied, damage may occur and reliability may
be affected.
MPS5172 = Device Code
A
= Assembly Location
Y
= Year
WW
= Work Week
G
= Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Device
MPS5172
MPS5172G
MPS5172RLRM
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques Reference
Manual, SOLDERRM/D.
©
Semiconductor Components Industries, LLC, 2005
Package
TO−92
TO−92
(Pb−Free)
TO−92
TO−92
(Pb−Free)
Shipping
5000 / Bulk
5000 / Bulk
2000/Ammo Pack
2000/Ammo Pack
MPS5172RLRMG
1
December, 2005 − Rev. 2
Publication Order Number:
MPS5172/D

MPS5172 Related Products

MPS5172 MPS5172RLRM
Description 100 mA, 25 V, NPN, Si, SMALL SIGNAL TRANSISTOR, TO-92 100 mA, 25 V, NPN, Si, SMALL SIGNAL TRANSISTOR, TO-92
Maker ON Semiconductor ON Semiconductor
Parts packaging code TO-92 TO-92
package instruction CYLINDRICAL, O-PBCY-T3 CASE 29-11, TO-226, 3 PIN
Contacts 3 3
Manufacturer packaging code 29-11 CASE 29-11
Reach Compliance Code _compli _compli
Maximum collector current (IC) 0.1 A 0.1 A
Collector-emitter maximum voltage 25 V 25 V
Configuration SINGLE SINGLE
Minimum DC current gain (hFE) 100 100
JEDEC-95 code TO-92 TO-92
JESD-30 code O-PBCY-T3 O-PBCY-T3
JESD-609 code e0 e0
Number of components 1 1
Number of terminals 3 3
Package body material PLASTIC/EPOXY PLASTIC/EPOXY
Package shape ROUND ROUND
Package form CYLINDRICAL CYLINDRICAL
Peak Reflow Temperature (Celsius) 240 240
Polarity/channel type NPN NPN
Certification status Not Qualified Not Qualified
surface mount NO NO
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form THROUGH-HOLE THROUGH-HOLE
Terminal location BOTTOM BOTTOM
Maximum time at peak reflow temperature 30 30
Transistor component materials SILICON SILICON

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