CM1220
4 and 8-Channel ESD
Protection Arrays in CSP
Description
The CM1220 ESD protection arrays are available in four and eight
channel configurations. Each ESD channel features a nominal
capacitance of 14 pF making the devices ideal for protecting high
speed I/O ports and LCD and camera data lines without significantly
affecting signal integrity. The CM1220 integrates avalanche−type
ESD diodes on every channel, providing a very high level of
protection for sensitive electronic components that may be subjected
to electrostatic discharge (ESD). These diodes safely dissipate ESD
strikes of
±
15 kV, exceeding the maximum requirement of the
IEC61000−4−2 international standard. Using the MIL−STD−883
(Method 3015) specification for Human Body Model (HBM) ESD, the
CM1220 protect against contact discharges at greater than
±
30 kV.
These devices are particularly well−suited for portable electronics
(e.g. wireless handsets, PDAs, notebook computers) because of their
small package and easy−to−use pin assignments. In particular, the
CM1220 is ideal for protecting high speed I/O ports and data and
control lines for the LCD display and camera interface in mobile
handsets.
The CM1220 incorporates ON Semiconductor’s
OptiGuardt
coating for improved reliability at assembly in a space−saving,
low−profile Chip Scale Package.
Features
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WLCSP5
CP SUFFIX
CASE 567AY
WLCSP10
CP SUFFIX
CASE 567BL
BLOCK DIAGRAM
ESD_1
ESD_2
ESD_3
C1
ESD_5
ESD_4
C3
ESD_6
A1
B2
A3
GND
CM1220−04
ESD_1
ESD_2
ESD_3
ESD_4
ESD_7
C5
ESD_8
C7
A1
B1, B2
A3
A5
A7
C1
C3
•
Four and Eight Channels of ESD Protection
•
OptiGuardtCoated
for Improved Reliability
•
±15
kV ESD Protection on each Channel (IEC 61000−4−2 Level 4,
•
•
•
•
•
GND
CM1220−08
contact discharge)
±30
kV ESD Protection on each Channel (HBM)
Chip Scale Package (CSP) Features Extremely Low Lead Inductance
for Optimum ESD Protection
5 bump, 0.960 mm X 1.330 mm CSP Footprint for CM1220−04
10 bump, 1.960 mm X 1.330 mm CSP Footprint for CM1220−08
These Devices are Pb−Free and are RoHS Compliant
MARKING DIAGRAM
J
CM1220−04
5−Bump CSP Package
J
L208
L208
CM1220−08
10−Bump CSP Package
Applications
•
LCD and Camera Data Lines in Mobile Handsets
•
I/O Port Protection for Mobile Handsets, Notebook Computers,
•
•
•
•
PDAs, etc.
Keypads and Buttons
Wireless Handsets
Handheld PCs/PDAs
LCD and Camera Modules
= CM1220−04CP
= CM1220−08CP
ORDERING INFORMATION
Device
CM1220−04CP
CM1220−08CP
Package
CSP−5
(Pb−Free)
CSP−10
(Pb−Free)
Shipping
†
3500/Tape & Reel
3500/Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
©
Semiconductor Components Industries, LLC, 2011
February, 2011
−
Rev. 3
1
Publication Order Number:
CM1220/D
CM1220
PACKAGE / PINOUT DIAGRAMS
Top View
(Bumps Down View)
Orientation
Marking
A
B
C
1 2 3
Bottom View
(Bumps Up View)
+
J
Orientation
Marking
CM1220−04
5−bump CSP Package
with OptiGuard
C1
B2
A1
A1
C3
A3
Orientation
Marking
A
B
C
1 2 3
5 6 7
C1
C3
C5
B6
A3
A5
A7
C7
+
L208
Orientation
Marking
B2
A1
A1
CM1220−08
10−bump CSP Package
with OptiGuard
Table 1. PIN DESCRIPTIONS
CM1220−08
Pins
A1
A3
A5
A7
B2
Name
ESD1
ESD2
ESD3
ESD4
GND
CM1220−04
Pins
A1
A3
−
−
B2
Name
ESD1
ESD2
−
−
GND
Description
ESD Channel
ESD Channel
ESD Channel
ESD Channel
Device Ground
CM1220−08
Pins
C1
C3
C5
C7
B6
Name
ESD5
ESD6
ESD7
ESD8
GND
CM1220−04
Pins
C1
C3
−
−
−
Name
ESD3
ESD4
−
−
−
Description
ESD Channel
ESD Channel
ESD Channel
ESD Channel
Device Ground
SPECIFICATIONS
Table 2. ABSOLUTE MAXIMUM RATINGS
Parameter
Storage Temperature Range
Rating
−65
to +150
Units
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
Table 3. STANDARD OPERATING CONDITIONS
Parameter
Operating Temperature Range
Rating
−40
to +85
Units
°C
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2
CM1220
Table 4. ELECTRICAL OPERATING CHARACTERISTICS
(Note 1)
Symbol
C
DIODE
V
DIODE
I
LEAK
V
SIG
Parameter
Diode (Channel) Capacitance
Diode Standoff Voltage
Diode Leakage Current
Signal Clamp Voltage
Positive Clamp
Negative Clamp
In−system ESD Withstand Voltage
a) Human Body Model, MIL−STD−883, Method 3015
b) Contact Discharge per IEC 61000−4−2
Dynamic Resistance
Positive
Negative
Conditions
At 2.5 VDC Reverse Bias,
1 MHz, 30 mVAC
I
DIODE
= 10
mA
V
IN
= +3.3 V
(reverse bias voltage)
I
DIODE
= 10 mA
5.6
−1.5
±30
±15
2.3
0.9
Min
11
Typ
14
6.0
0.1
1
Max
17
Units
pF
V
mA
V
6.8
−0.8
9.0
−0.4
V
ESD
(Note 2)
kV
R
DYN
W
1. T
A
= 25
°
C unless otherwise specified.
2. ESD applied to input and output pins with respect to GND, one at a time. Unused pins are left open.
PERFORMANCE INFORMATION
Diode Characteristics (nominal conditions unless specified otherwise)
Capacitance (Normalized)
DC Voltage
Figure 1. Insertion Loss vs. Frequency (0 V Bias)
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CM1220
APPLICATION INFORMATION
Table 5. PRINTED CIRCUIT BOARD RECOMMENDATIONS
Parameter
Pad Size on PCB
Pad Shape
Pad Definition
Solder Mask Opening
Solder Stencil Thickness
Solder Stencil Aperture Opening (laser cut, 5% tapered walls)
Solder Flux Ratio
Solder Paste Type
Pad Protective Finish
Tolerance
−
Edge To Corner Ball
Solder Ball Side Coplanarity
Maximum Dwell Time Above Liquidous (183°C)
Maximum Soldering Temperature for Lead−free Devices using a Lead−free Solder Paste
Value
0.240 mm
Round
Non−Solder Mask defined pads
0.290 mm Round
0.125
−
0.150 mm
0.300 mm Round
50/50 by volume
No Clean
OSP (Entek Cu Plus 106A)
±50
mm
±20
mm
60 seconds
260°C
Non−Solder Mask Defined Pad
0.240 mm DIA.
Solder Stencil Opening
0.300 mm DIA.
Solder Mask Opening
0.290 mm DIA.
Figure 2. Recommended Non−Solder Mask Defined Pad Illustration
Figure 3. Lead−free (SnAgCu) Solder Ball Reflow Profile
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