5962-01-418-5829 datasheet, PDF

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5962-01-418-5829: DescriptionProgrammable Logic Device, 25ns, PAL-Type, CMOS, CDIP24,; CategoryProgrammable logic devices Programmable logic; File Size616KB，11 Pages; ManufacturerAtmel (Microchip)

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5962-01-418-5829 Overview

Programmable Logic Device, 25ns, PAL-Type, CMOS, CDIP24,

5962-01-418-5829 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Atmel (Microchip)
package instruction	DIP, DIP24,.3
Reach Compliance Code	compliant
ECCN code	3A001.A.2.C
Architecture	PAL-TYPE
maximum clock frequency	30.3 MHz
JESD-30 code	R-XDIP-T24
Number of entries	22
Output times	10
Number of product terms	132
Number of terminals	24
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Output function	MACROCELL
Package body material	CERAMIC
encapsulated code	DIP
Encapsulate equivalent code	DIP24,.3
Package shape	RECTANGULAR
Package form	IN-LINE
power supply	5 V
propagation delay	25 ns
Certification status	Not Qualified
Filter level	38535Q/M;38534H;883B
Nominal supply voltage	5 V
surface mount	NO
technology	CMOS
Temperature level	MILITARY
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL

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Description	Programmable Logic Device, 25ns, PAL-Type, CMOS, CDIP24,	Programmable Logic Device, 15ns, PAL-Type, CMOS, CDIP24,	Programmable Logic Device, 25ns, PAL-Type, CMOS, CQCC28,	Programmable Logic Device, 25ns, PAL-Type, CMOS, CDIP24,	Programmable Logic Device, 25ns, PAL-Type, CMOS, PDIP24,
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible
package instruction	DIP, DIP24,.3	DIP, DIP24,.3	QCCN, LCC28,.45SQ	DIP, DIP24,.3	DIP, DIP24,.3
Reach Compliance Code	compliant	compli	compliant	compli	compli
ECCN code	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C
Architecture	PAL-TYPE	PAL-TYPE	PAL-TYPE	PAL-TYPE	PAL-TYPE
maximum clock frequency	30.3 MHz	50 MHz	30.3 MHz	30.3 MHz	33.3 MHz
JESD-30 code	R-XDIP-T24	R-XDIP-T24	S-XQCC-N28	R-XDIP-T24	R-PDIP-T24
Number of entries	22	22	22	22	22
Output times	10	10	10	10	10
Number of product terms	132	132	132	132	132
Number of terminals	24	24	28	24	24
Maximum operating temperature	125 °C	125 °C	125 °C	125 °C	70 °C
Minimum operating temperature	-55 °C	-55 °C	-55 °C	-55 °C	-
Output function	MACROCELL	MACROCELL	MACROCELL	MACROCELL	MACROCELL
Package body material	CERAMIC	CERAMIC	CERAMIC	CERAMIC	PLASTIC/EPOXY
encapsulated code	DIP	DIP	QCCN	DIP	DIP
Encapsulate equivalent code	DIP24,.3	DIP24,.3	LCC28,.45SQ	DIP24,.3	DIP24,.3
Package shape	RECTANGULAR	RECTANGULAR	SQUARE	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	CHIP CARRIER	IN-LINE	IN-LINE
power supply	5 V	5 V	5 V	5 V	5 V
propagation delay	25 ns	15 ns	25 ns	25 ns	25 ns
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Nominal supply voltage	5 V	5 V	5 V	5 V	5 V
surface mount	NO	NO	YES	NO	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	MILITARY	MILITARY	MILITARY	MILITARY	COMMERCIAL
Terminal form	THROUGH-HOLE	THROUGH-HOLE	NO LEAD	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	2.54 mm	2.54 mm	1.27 mm	2.54 mm	2.54 mm
Terminal location	DUAL	DUAL	QUAD	DUAL	DUAL
Maker	Atmel (Microchip)	-	Atmel (Microchip)	Atmel (Microchip)	Atmel (Microchip)
Filter level	38535Q/M;38534H;883B	38535Q/M;38534H;883B	38535Q/M;38534H;883B	38535Q/M;38534H;883B	-

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