Programmable Logic Device, 25ns, PAL-Type, CMOS, CQCC28,
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Atmel (Microchip) |
| package instruction | QCCN, LCC28,.45SQ |
| Reach Compliance Code | compliant |
| ECCN code | 3A001.A.2.C |
| Architecture | PAL-TYPE |
| maximum clock frequency | 30.3 MHz |
| JESD-30 code | S-XQCC-N28 |
| Number of entries | 22 |
| Output times | 10 |
| Number of product terms | 132 |
| Number of terminals | 28 |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| Output function | MACROCELL |
| Package body material | CERAMIC |
| encapsulated code | QCCN |
| Encapsulate equivalent code | LCC28,.45SQ |
| Package shape | SQUARE |
| Package form | CHIP CARRIER |
| power supply | 5 V |
| propagation delay | 25 ns |
| Certification status | Not Qualified |
| Filter level | 38535Q/M;38534H;883B |
| Nominal supply voltage | 5 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | MILITARY |
| Terminal form | NO LEAD |
| Terminal pitch | 1.27 mm |
| Terminal location | QUAD |
| Base Number Matches | 1 |
| 5962-01-307-5787 | 5962-01-419-2277 | 5962-01-418-5829 | 5962-01-303-6132 | 5962-01-426-0095 | |
|---|---|---|---|---|---|
| Description | Programmable Logic Device, 25ns, PAL-Type, CMOS, CQCC28, | Programmable Logic Device, 15ns, PAL-Type, CMOS, CDIP24, | Programmable Logic Device, 25ns, PAL-Type, CMOS, CDIP24, | Programmable Logic Device, 25ns, PAL-Type, CMOS, CDIP24, | Programmable Logic Device, 25ns, PAL-Type, CMOS, PDIP24, |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible |
| package instruction | QCCN, LCC28,.45SQ | DIP, DIP24,.3 | DIP, DIP24,.3 | DIP, DIP24,.3 | DIP, DIP24,.3 |
| Reach Compliance Code | compliant | compli | compliant | compli | compli |
| ECCN code | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C |
| Architecture | PAL-TYPE | PAL-TYPE | PAL-TYPE | PAL-TYPE | PAL-TYPE |
| maximum clock frequency | 30.3 MHz | 50 MHz | 30.3 MHz | 30.3 MHz | 33.3 MHz |
| JESD-30 code | S-XQCC-N28 | R-XDIP-T24 | R-XDIP-T24 | R-XDIP-T24 | R-PDIP-T24 |
| Number of entries | 22 | 22 | 22 | 22 | 22 |
| Output times | 10 | 10 | 10 | 10 | 10 |
| Number of product terms | 132 | 132 | 132 | 132 | 132 |
| Number of terminals | 28 | 24 | 24 | 24 | 24 |
| Maximum operating temperature | 125 °C | 125 °C | 125 °C | 125 °C | 70 °C |
| Minimum operating temperature | -55 °C | -55 °C | -55 °C | -55 °C | - |
| Output function | MACROCELL | MACROCELL | MACROCELL | MACROCELL | MACROCELL |
| Package body material | CERAMIC | CERAMIC | CERAMIC | CERAMIC | PLASTIC/EPOXY |
| encapsulated code | QCCN | DIP | DIP | DIP | DIP |
| Encapsulate equivalent code | LCC28,.45SQ | DIP24,.3 | DIP24,.3 | DIP24,.3 | DIP24,.3 |
| Package shape | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | CHIP CARRIER | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
| power supply | 5 V | 5 V | 5 V | 5 V | 5 V |
| propagation delay | 25 ns | 15 ns | 25 ns | 25 ns | 25 ns |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Nominal supply voltage | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | YES | NO | NO | NO | NO |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | MILITARY | MILITARY | MILITARY | MILITARY | COMMERCIAL |
| Terminal form | NO LEAD | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| Terminal pitch | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| Terminal location | QUAD | DUAL | DUAL | DUAL | DUAL |
| Maker | Atmel (Microchip) | - | Atmel (Microchip) | Atmel (Microchip) | Atmel (Microchip) |
| Filter level | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | - |
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