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TMS320DM643AGDK6

Description
Digital Signal Processors & Controllers - DSP, DSC Fixed-Point Dig Sig Proc
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size1MB,160 Pages
ManufacturerTexas Instruments
Websitehttp://www.ti.com.cn/
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TMS320DM643AGDK6 Overview

Digital Signal Processors & Controllers - DSP, DSC Fixed-Point Dig Sig Proc

TMS320DM643AGDK6 Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerTexas Instruments
Parts packaging codeBGA
package instructionFBGA, BGA179,14X14,32
Contacts548
Reach Compliance Code_compli
ECCN code3A001.A.3
Factory Lead Time1 week
Other featuresALSO REQUIRES 3.3V SUPPLY
Address bus width20
barrel shifterNO
bit size32
boundary scanYES
maximum clock frequency133 MHz
External data bus width64
FormatFIXED POINT
Internal bus architectureMULTIPLE
JESD-30 codeS-PBGA-B548
JESD-609 codee0
length23 mm
low power modeYES
Humidity sensitivity level4
Number of terminals548
Maximum operating temperature90 °C
Minimum operating temperature
Package body materialPLASTIC/EPOXY
encapsulated codeFBGA
Encapsulate equivalent codeBGA179,14X14,32
Package shapeSQUARE
Package formGRID ARRAY, FINE PITCH
Peak Reflow Temperature (Celsius)220
power supply1.4,3.3 V
Certification statusNot Qualified
RAM (number of words)16384
Maximum seat height2.8 mm
Maximum supply voltage1.44 V
Minimum supply voltage1.36 V
Nominal supply voltage1.4 V
surface mountYES
technologyCMOS
Temperature levelOTHER
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formBALL
Terminal pitch0.8 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperatureNOT SPECIFIED
width23 mm
uPs/uCs/peripheral integrated circuit typeDIGITAL SIGNAL PROCESSOR, OTHER

TMS320DM643AGDK6 Related Products

TMS320DM643AGDK6 TMS320DM643AGNZ6
Description Digital Signal Processors & Controllers - DSP, DSC Fixed-Point Dig Sig Proc Digital Signal Processors & Controllers - DSP, DSC Fixed-Point Dig Sig Proc
Is it lead-free? Contains lead Contains lead
Is it Rohs certified? incompatible incompatible
Maker Texas Instruments Texas Instruments
Parts packaging code BGA BGA
package instruction FBGA, BGA179,14X14,32 BGA, BGA548,26X26,40
Contacts 548 548
Reach Compliance Code _compli _compli
ECCN code 3A001.A.3 3A001.A.3
Factory Lead Time 1 week 1 week
Other features ALSO REQUIRES 3.3V SUPPLY ALSO REQUIRES 3.3V SUPPLY
Address bus width 20 20
barrel shifter NO NO
bit size 32 32
boundary scan YES YES
maximum clock frequency 133 MHz 133 MHz
External data bus width 64 64
Format FIXED POINT FIXED POINT
Internal bus architecture MULTIPLE MULTIPLE
JESD-30 code S-PBGA-B548 S-PBGA-B548
JESD-609 code e0 e0
length 23 mm 27 mm
low power mode YES YES
Humidity sensitivity level 4 4
Number of terminals 548 548
Maximum operating temperature 90 °C 90 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code FBGA BGA
Encapsulate equivalent code BGA179,14X14,32 BGA548,26X26,40
Package shape SQUARE SQUARE
Package form GRID ARRAY, FINE PITCH GRID ARRAY
Peak Reflow Temperature (Celsius) 220 220
power supply 1.4,3.3 V 1.4,3.3 V
Certification status Not Qualified Not Qualified
RAM (number of words) 16384 16384
Maximum seat height 2.8 mm 2.8 mm
Maximum supply voltage 1.44 V 1.44 V
Minimum supply voltage 1.36 V 1.36 V
Nominal supply voltage 1.4 V 1.4 V
surface mount YES YES
technology CMOS CMOS
Temperature level OTHER OTHER
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form BALL BALL
Terminal pitch 0.8 mm 1 mm
Terminal location BOTTOM BOTTOM
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED
width 23 mm 27 mm
uPs/uCs/peripheral integrated circuit type DIGITAL SIGNAL PROCESSOR, OTHER DIGITAL SIGNAL PROCESSOR, OTHER
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