D../CRCW....-HR e3
Vishay
Lead (Pb)-free Thick Film, Rectangular,
High Value Chip Resistors
FEATURES
•
•
•
•
•
•
High resistance values (up to 470M)
Suitable for voltage dividers and hybrids
Metal glaze on high quality ceramic
Protective overglaze
Lead (Pb)-free solder contacts on Ni barrier layer
Pure tin plating provides compatibility with lead (Pb)-free
and lead containing soldering processes
•
Compatible with “Restriction of the use of Hazardous
Substances” (RoHS) directive 2002/95/EC (issue 2004)
STANDARD ELECTRICAL SPECIFICATIONS
SIZE
MODEL
INCH METRIC
D11/CRCW0603-HR 0603
D12/CRCW0805-HR 0805
D25/CRCW1206-HR 1206
1608
2012
3216
POWER RATING
P
70 °C
W
0.1
0.125
0.25
LIMITING
ELEMENT
VOLTAGE
MAX.
V≅
75
150
200
RESISTANCE
TEMPERATURE
TOLERANCE
RANGE
E-SERIES
COEFFICIENT
%
Ω
ppm/K
± 500
± 500
± 500
±5
±5
±5
11M - 470M
11M - 470M
11M - 470M
24
24
24
Notes
•
These resistors do not feature a limited lifetime when operated within the permissible limits. However, resistance value drift increasing over
operating time may result in exceeding a limit acceptable to the specific application, thereby establishing a functional lifetime.
•
Marking and packaging: See appropriate catalog or web pages
•
Power rating depends on the max. temperature at the solder point, the component placement density and the substrate material
TECHNICAL SPECIFICATIONS
PARAMETER
Rated Dissipation at 70 °C
(2)
Limiting Element Voltage
Voltage Coefficient
Insulation Voltage (1 min)
Thermal Resistance
(1)
Insulation Resistance
Category Temperature Range
Weight/1000 pieces
Notes
(1)
(2)
UNIT
W
V≅
%/V
V
dc/ac peak
K/W
Ω
°C
g
D11/CRCW0603-HR
0.1
75
D12/CRCW0805-HR
0.125
150
D25/CRCW1206-HR
0.25
200
< 100M: < 0.1/> 100M: < 0.3
> 100
≤
550
> 200
≤
440
> 10
9
- 55 to + 155
2
5.5
10
> 300
≤
220
Measuring conditions in acc. to EN 140401-802
The power dissipation on the resistor generates a temperature rise against the local ambient, depending on the heat flow support of the
printed-circuit board (thermal resistance). The rated dissipation applies only if the permitted film temperature of 155 °C is not exceeded.
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156
For technical questions, contact: filmresistors.thickfilmchip@vishay.com
Document Number: 20022
Revision: 13-Oct-08
D../CRCW....-HR e3
Lead (Pb)-free Thick Film, Rectangular,
High Value Chip Resistors
PART NUMBER AND PRODUCT DESCRIPTION
PART NUMBER: CRCW060316M0JPEAHR
(1)
Vishay
C
R
C
W
0
VALUE
M
= Million
6
0
3
1
6
M
0
J
TCR
P
E
A
H
R
SPECIAL
MODEL/SIZE
CRCW0603
CRCW0805
CRCW1206
TOLERANCE
J
=±5%
PACKAGING
(2)
EA
EB
EC
EI
EL
P
= ± 500 ppm/K
Up to 2 digits
HR
= High Value
Product Description: D11/CRCW0603-HR 500 16M 5 % ET1 e3
D11/CRCW0603-HR
MODEL
D11/CRCW0603-HR
D12/CRCW0805-HR
D25/CRCW1206-HR
500
TCR
± 500 ppm/K
16M
RESISTANCE VALUE
68M = 68 MΩ
227M = 227 MΩ
5%
TOLERANCE
±5%
ET1
PACKAGING
(2)
ET1
ET5
ET6
EG1
E20
e3
LEAD (Pb)-FREE
e3 = Pure tin
Termination finish
Notes
(1)
Preferred way for ordering products is by use of the PART NUMBER
(2)
Please refer to table PACKAGING, see next page
PACKAGING
REEL
MODEL
PACKAGING CODE
TAPE
WIDTH
DIAMETER
180 mm/7"
D11/CRCW0603-HR
8 mm
330 mm/13"
180 mm/7"
D12/CRCW0805-HR
8 mm
330 mm/13"
180 mm/7"
D25/CRCW1206-HR
8 mm
330 mm/13"
PITCH PIECES/
REEL
4 mm
4 mm
4 mm
4 mm
4 mm
4 mm
5000
10 000
20 000
5000
10 000
20 000
5 000
10 000
20 000
PART NUMBER
EA
EB
EC
EA
EB
EC
EA
EB
EC
EL
EL
EI
EL
EI
EI
PRODUCT DESC. PIECES
ET1
ET5
ET6
ET1
ET5
ET6
ET1
ET5
ET6
E20
E20
EG1
E20
EG1
10 000
EY
E27
EG1
25 000
EY
E27
PAPER BLISTER PAPER BLISTER
285 mm/11.25" 4 mm
BULK
PACKAGING CODE
PART
PRODUCT
NUMBER
DESC.
285 mm/11.25" 4 mm
285 mm/11.25" 4 mm
DIMENSIONS
SIZE
INCH METRIC
0603
0805
1206
1608
2012
3216
L
DIMENSIONS
[in millimeters]
W
H
0.45 ± 0.05
T1
0.3 ± 0.2
0.3
+ 0.20
- 0.10
SIZE
T2
INCH
0.3 ± 0.2
0.3 ± 0.2
0.4 ± 0.2
0603
0805
1206
METRIC
1608
2012
3216
SOLDER PAD DIMENSIONS
[in millimeters]
REFLOW SOLDERING WAVE SOLDERING
a
0.5
0.7
0.9
b
0.9
1.3
1.7
l
1.0
1.2
2.0
a
0.9
0.9
1.1
b
0.9
1.3
1.7
l
1.0
1.3
2.3
1.55
+ 0.10
0.85 ± 0.1
- 0.05
2.0
+ 0.20
- 0.10
1.25 ± 0.15 0.45 ± 0.05
1.6 ± 0.15
3.2
+ 0.10
- 0.20
0.55 ± 0.05 0.45 ± 0.2
Document Number: 20022
Revision: 13-Oct-08
For technical questions, contact: filmresistors.thickfilmchip@vishay.com
www.vishay.com
157
D../CRCW....-HR e3
Vishay
Lead (Pb)-free Thick Film, Rectangular,
High Value Chip Resistors
Rated Power in
%
120
100
Temperature Rise in °C
90
80
70
60
50
40
2512
30
1218
20
10
0
0
0.1
0.2
0.3
0.4
0.5
2010
0402 0603 0805
1206
1210
80
60
40
20
0
- 55
- 25
0
25
50
Temperature Rise
Power in W
Derating
75
70
100
125
155 175
Ambient Temperature in °C
TEST PROCEDURES AND REQUIREMENTS
EN 60115-1
TEST (clause)
CONDITIONS OF TEST
Stability for product types:
D../CRCW...-HR e3
Resistance (4.5)
Temperature coefficient (4.8.4.2)
Overload (4.13)
-
20/- 55/20 °C and
20/125/20 °C
U
= 2.5 × (P
70
×
R)
1/2
≤
2 ×
U
max.
;
Duration: according the style
Aging 4 h at 155 °C, dryheat
solder bath method; 235 °C; 2 s
visual examination
Solder bath method;
(260 ± 5) °C; (10 ± 1) s
30 min at LCT = - 55 °C;
30 min at UCT = 125 °C; 5 cycles
(40 ± 2) °C; 56 days;
(93 ± 3) % RH
16 h at UCT = 125 °C; 1 cycle at 55 °C;
2 h at LCT = - 55 °C;
1 h/1 kPa at 15 °C to 35 °C;
5 cycles at 55 °C
U
= (P
70
×
R)
1/2
U
=
U
max.
; whichever is less severe
U
= (P
70
×
R)
1/2
U
=
U
max.
; whichever is less severe
1.5 h ON; 0.5 h OFF;
70 °C; 1000 h
Duration extended to 8000 h
UCT = 125 °C; 1000 h
11 MΩ to 470 MΩ
±5%
± 500 ppm/K
±
(0.5
%
R
+ 0.05
Ω)
Good tinning (≥ 95 % covered)
no visible damage
±
(0.5
%
R
+ 0.05
Ω)
±
(0.5
%
R
+ 0.05
Ω)
±
(2
%
R
+ 0.1
Ω)
REQUIREMENTS
PERMISSIBLE CHANGE (ΔR/R)
STABILITY CLASS 2
OR BETTER
Solderability (4.17.5)
Resistance to soldering heat (4.18.2)
Rapid change of temperature (4.19)
Damp heat, steady state (4.24)
Climatic sequence (4.23)
±
(2
%
R
+ 0.1
Ω)
Endurance at 70 °C (4.25.1)
Extended endurance (4.25.1.8)
Endurance at upper category temperature
(4.25.3)
±
(2
%
R
+ 0.1
Ω)
± (4 %
R
+ 0.1
Ω)
± (2 %
R
+ 0.1
Ω)
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158
For technical questions, contact: filmresistors.thickfilmchip@vishay.com
Document Number: 20022
Revision: 13-Oct-08
D../CRCW....-HR e3
Lead (Pb)-free Thick Film, Rectangular,
High Value Chip Resistors
APPLICABLE SPECIFICATIONS
• EN 60115-1
• EN 140400
• EN 140401-802
• IEC 60068-2-X
• IEC 60286-3
Generic Specification
Sectional Specification
Detail Specification
Variety of environmental test procedures
Packaging of SMD components
Vishay
Document Number: 20022
Revision: 13-Oct-08
For technical questions, contact: filmresistors.thickfilmchip@vishay.com
www.vishay.com
159
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Vishay
Disclaimer
ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE
RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE.
Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively,
“Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other
disclosure relating to any product.
Vishay makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or
the continuing production of any product. To the maximum extent permitted by applicable law, Vishay disclaims (i) any and all
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Statements regarding the suitability of products for certain types of applications are based on Vishay’s knowledge of typical
requirements that are often placed on Vishay products in generic applications. Such statements are not binding statements
about the suitability of products for a particular application. It is the customer’s responsibility to validate that a particular
product with the properties described in the product specification is suitable for use in a particular application. Parameters
provided in datasheets and/or specifications may vary in different applications and performance may vary over time. All
operating parameters, including typical parameters, must be validated for each customer application by the customer’s
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including but not limited to the warranty expressed therein.
Except as expressly indicated in writing, Vishay products are not designed for use in medical, life-saving, or life-sustaining
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Document Number: 91000
Revision: 11-Mar-11
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