TMS320C80GGP50 datasheet, PDF - EEWORLD Datasheet

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TMS320C80GGP50: DescriptionDigital Signal Processors & Controllers - DSP, DSC TMS320C80 - 352pin BGA - 50 MHz, PG5.1; CategoryThe embedded processor and controller Microcontrollers and processors; File Size3MB，170 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/

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TMS320C80GGP50 Overview

Digital Signal Processors & Controllers - DSP, DSC TMS320C80 - 352pin BGA - 50 MHz, PG5.1

TMS320C80GGP50 Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Parts packaging code	BGA
package instruction	HLBGA, BGA352,26X26,50
Contacts	352
Reach Compliance Code	_compli
ECCN code	3A001.A.3
Factory Lead Time	1 week
Is Samacsys	N
Address bus width	32
barrel shifter	YES
bit size	32
boundary scan	YES
maximum clock frequency	100 MHz
External data bus width	64
Format	FLOATING POINT
Integrated cache	NO
Internal bus architecture	MULTIPLE
JESD-30 code	S-PBGA-B352
length	35 mm
low power mode	NO
Number of DMA channels
Number of external interrupt devices	4
Number of serial I/Os
Number of terminals	352
Number of timers	1
On-chip data RAM width	8
On-chip program ROM width
Maximum operating temperature	85 °C
Minimum operating temperature
Package body material	PLASTIC/EPOXY
encapsulated code	HLBGA
Encapsulate equivalent code	BGA352,26X26,50
Package shape	SQUARE
Package form	GRID ARRAY, HEAT SINK/SLUG, LOW PROFILE
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	3.3 V
Certification status	Not Qualified
RAM (number of words)	25600
Maximum seat height	1.7 mm
Maximum slew rate	2300 mA
Maximum supply voltage	3.465 V
Minimum supply voltage	3.135 V
Nominal supply voltage	3.3 V
surface mount	YES
technology	CMOS
Temperature level	OTHER
Terminal form	BALL
Terminal pitch	1.27 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED
width	35 mm
uPs/uCs/peripheral integrated circuit type	DIGITAL SIGNAL PROCESSOR, OTHER
Base Number Matches	1

TMS320C80GGP50 Related Products

	TMS320C80GGP50	TMS320C80GGP60	TMS320C80GF60	TMS320C80GF50
Description	Digital Signal Processors & Controllers - DSP, DSC TMS320C80 - 352pin BGA - 50 MHz, PG5.1	Digital Signal Processors & Controllers - DSP, DSC TMS320C80 - 352pin BGA - 60 MHz, PG5.1	Digital Signal Processors & Controllers - DSP, DSC Multimedia Video Processor 305-CPGA	Digital Signal Processors & Controllers - DSP, DSC Multimedia Video Proc
Is it lead-free?	Contains lead	Contains lead	Contains lead	Contains lead
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible
Parts packaging code	BGA	BGA	PGA	PGA
package instruction	HLBGA, BGA352,26X26,50	HLBGA,	HIPGA, HSPGA305,35X35MOD	HIPGA, HSPGA305,35X35MOD
Contacts	352	352	305	305
Reach Compliance Code	_compli	_compli	_compli	_compli
ECCN code	3A001.A.3	3A001.A.3	3A001.A.3	3A001.A.3
Address bus width	32	32	32	32
barrel shifter	YES	YES	YES	YES
boundary scan	YES	YES	YES	YES
maximum clock frequency	100 MHz	120 MHz	120 MHz	100 MHz
External data bus width	64	64	64	64
Format	FLOATING POINT	FLOATING POINT	FLOATING POINT	FLOATING POINT
Internal bus architecture	MULTIPLE	MULTIPLE	MULTIPLE	MULTIPLE
JESD-30 code	S-PBGA-B352	S-PBGA-B352	S-CPGA-P305	S-CPGA-P305
length	35 mm	35 mm	47.245 mm	47.245 mm
low power mode	NO	NO	NO	NO
Number of terminals	352	352	305	305
Maximum operating temperature	85 °C	85 °C	85 °C	85 °C
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED
encapsulated code	HLBGA	HLBGA	HIPGA	HIPGA
Package shape	SQUARE	SQUARE	SQUARE	SQUARE
Package form	GRID ARRAY, HEAT SINK/SLUG, LOW PROFILE	GRID ARRAY, HEAT SINK/SLUG, LOW PROFILE	GRID ARRAY, HEAT SINK/SLUG, INTERSTITIAL PITCH	GRID ARRAY, HEAT SINK/SLUG, INTERSTITIAL PITCH
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	220	NOT SPECIFIED	NOT SPECIFIED
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	1.7 mm	1.7 mm	5.59 mm	5.59 mm
Maximum supply voltage	3.465 V	3.465 V	3.465 V	3.465 V
Minimum supply voltage	3.135 V	3.135 V	3.135 V	3.135 V
Nominal supply voltage	3.3 V	3.3 V	3.3 V	3.3 V
surface mount	YES	YES	NO	NO
technology	CMOS	CMOS	CMOS	CMOS
Temperature level	OTHER	OTHER	OTHER	OTHER
Terminal form	BALL	BALL	PIN/PEG	PIN/PEG
Terminal pitch	1.27 mm	1.27 mm	2.54 mm	2.54 mm
Terminal location	BOTTOM	BOTTOM	PERPENDICULAR	PERPENDICULAR
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	35 mm	35 mm	47.245 mm	47.245 mm
uPs/uCs/peripheral integrated circuit type	DIGITAL SIGNAL PROCESSOR, OTHER	DIGITAL SIGNAL PROCESSOR, OTHER	DIGITAL SIGNAL PROCESSOR, OTHER	DIGITAL SIGNAL PROCESSOR, OTHER
Factory Lead Time	1 week	1 week	1 week	-
bit size	32	-	32	32
Encapsulate equivalent code	BGA352,26X26,50	-	HSPGA305,35X35MOD	HSPGA305,35X35MOD
power supply	3.3 V	-	3.3 V	3.3 V
RAM (number of words)	25600	-	51200	25600
Maximum slew rate	2300 mA	-	2500 mA	2300 mA

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