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TMS320C6415TGLZ7

Description
Digital Signal Processors & Controllers - DSP, DSC Fixed-Pt Dig Sig Proc
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size2MB,143 Pages
ManufacturerTexas Instruments
Websitehttp://www.ti.com.cn/
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TMS320C6415TGLZ7 Overview

Digital Signal Processors & Controllers - DSP, DSC Fixed-Pt Dig Sig Proc

TMS320C6415TGLZ7 Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
Parts packaging codeBGA
package instructionFBGA, BGA532,26X26,32
Contacts532
Reach Compliance Code_compli
ECCN code3A001.A.3
Other featuresALSO REQUIRES 3.3V SUPPLY
Address bus width23
barrel shifterNO
bit size32
boundary scanYES
maximum clock frequency75 MHz
External data bus width64
FormatFIXED POINT
Internal bus architectureMULTIPLE
JESD-30 codeS-PBGA-B532
length23 mm
low power modeYES
Number of terminals532
Maximum operating temperature90 °C
Minimum operating temperature
Package body materialPLASTIC/EPOXY
encapsulated codeFBGA
Encapsulate equivalent codeBGA532,26X26,32
Package shapeSQUARE
Package formGRID ARRAY, FINE PITCH
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply1.2,3.3 V
Certification statusNot Qualified
RAM (number of words)16384
Maximum seat height3.25 mm
Maximum supply voltage1.16 V
Minimum supply voltage1.05 V
Nominal supply voltage1.1 V
surface mountYES
technologyCMOS
Temperature levelOTHER
Terminal formBALL
Terminal pitch0.8 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperatureNOT SPECIFIED
width23 mm
uPs/uCs/peripheral integrated circuit typeDIGITAL SIGNAL PROCESSOR, OTHER
Base Number Matches1

TMS320C6415TGLZ7 Related Products

TMS320C6415TGLZ7 TMS320C6415TZLZ7 TMS320C6414TGLZ7
Description Digital Signal Processors & Controllers - DSP, DSC Fixed-Pt Dig Sig Proc Digital Signal Processors & Controllers - DSP, DSC LTB REQUIRED BY 9/2/07 Digital Signal Processors & Controllers - DSP, DSC LTB REQUIRED BY 9/2/07
Is it lead-free? Contains lead Lead free Contains lead
Is it Rohs certified? incompatible conform to incompatible
Parts packaging code BGA BGA BGA
package instruction FBGA, BGA532,26X26,32 FBGA, BGA532,26X26,32 FBGA, BGA532,26X26,32
Contacts 532 532 532
Reach Compliance Code _compli unknow _compli
ECCN code 3A001.A.3 3A001.A.3 3A001.A.3
Other features ALSO REQUIRES 3.3V SUPPLY ALSO REQUIRES 3.3V SUPPLY ALSO REQUIRES 3.3V SUPPLY
Address bus width 23 23 23
barrel shifter NO NO NO
bit size 32 32 32
boundary scan YES YES YES
maximum clock frequency 75 MHz 75 MHz 75 MHz
External data bus width 64 64 64
Format FIXED POINT FIXED POINT FIXED POINT
Internal bus architecture MULTIPLE MULTIPLE MULTIPLE
JESD-30 code S-PBGA-B532 S-PBGA-B532 S-PBGA-B532
length 23 mm 23 mm 23 mm
low power mode YES YES YES
Number of terminals 532 532 532
Maximum operating temperature 90 °C 90 °C 90 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code FBGA FBGA FBGA
Encapsulate equivalent code BGA532,26X26,32 BGA532,26X26,32 BGA532,26X26,32
Package shape SQUARE SQUARE SQUARE
Package form GRID ARRAY, FINE PITCH GRID ARRAY, FINE PITCH GRID ARRAY, FINE PITCH
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
power supply 1.2,3.3 V 1.2,3.3 V 1.2,3.3 V
Certification status Not Qualified Not Qualified Not Qualified
RAM (number of words) 16384 16384 16384
Maximum seat height 3.25 mm 3.25 mm 3.25 mm
Maximum supply voltage 1.16 V 1.24 V 1.24 V
Minimum supply voltage 1.05 V 1.16 V 1.16 V
Nominal supply voltage 1.1 V 1.2 V 1.2 V
surface mount YES YES YES
technology CMOS CMOS CMOS
Temperature level OTHER OTHER OTHER
Terminal form BALL BALL BALL
Terminal pitch 0.8 mm 0.8 mm 0.8 mm
Terminal location BOTTOM BOTTOM BOTTOM
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
width 23 mm 23 mm 23 mm
uPs/uCs/peripheral integrated circuit type DIGITAL SIGNAL PROCESSOR, OTHER DIGITAL SIGNAL PROCESSOR, OTHER DIGITAL SIGNAL PROCESSOR, OTHER
Base Number Matches 1 - 1
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