Freescale Semiconductor
Data Sheet: Technical Data
Document Number: MPC5125
Rev. 3, 11/2009
MPC5125
MPC5125 Microcontroller
Data Sheet
The MPC5125 integrates a high performance e300 CPU core
based on the Power Architecture™ Technology with a rich set
of peripheral functions focused on communications and
systems integration.
Major features of the MPC5125 are as follows:
•
e300 Power Architecture processor core (enhanced
version of the MPC603e core), operates as fast as
400 MHz
Low power design
Display interface unit (DIU)
DDR1, DDR2, low-power mobile DDR (LPDDR),
and 1.8 V/3.3 V SDR DRAM memory controllers
32 KB on-chip SRAM
USB 2.0 OTG controller with ULPI interface
DMA subsystem
Flexible multi-function external memory bus (EMB)
interface
NAND flash controller (NFC)
LocalPlus interface (LPC)
10/100Base Ethernet
MMC/SD/SDIO card host controller (SDHC)
Programmable serial controller (PSC)
Inter-integrated circuit (I
2
C) communication
interfaces
Controller area network (CAN)
J1850 byte data link controller (BDLC) interface
On-chip real-time clock (RTC)
On-chip temperature sensor
IC Identification module (IIM)
324 TEPBGA
23 mm x 23 mm
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This document contains information on a product under development. Freescale reserves the
right to change or discontinue this product without notice.
© Freescale Semiconductor, Inc., 2008–2009. All rights reserved.
Table of Contents
1
2
3
Ordering Information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3
MPC5125 Block Diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . .4
Pin Assignments . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5
3.1 324-ball TEPBGA Pin Assignments . . . . . . . . . . . . . . . .5
3.2 Pin Muxing and Reset States . . . . . . . . . . . . . . . . . . . . .6
3.2.1 Power and Ground Supply Summary . . . . . . . .35
Electrical and Thermal Characteristics . . . . . . . . . . . . . . . . . .36
4.1 DC Electrical Characteristics . . . . . . . . . . . . . . . . . . . .36
4.1.1 Absolute Maximum Ratings . . . . . . . . . . . . . . . .36
4.1.2 Recommended Operating Conditions . . . . . . . .36
4.1.3 DC Electrical Specifications. . . . . . . . . . . . . . . .37
4.1.4 Electrostatic Discharge . . . . . . . . . . . . . . . . . . .40
4.1.5 Power Dissipation . . . . . . . . . . . . . . . . . . . . . . .41
4.1.6 Thermal Characteristics. . . . . . . . . . . . . . . . . . .42
4.2 Oscillator and PLL Electrical Characteristics . . . . . . . .43
4.2.1 System Oscillator Electrical Characteristics . . .44
4.2.2 RTC Oscillator Electrical Characteristics . . . . . .44
4.2.3 System PLL Electrical Characteristics. . . . . . . .45
4.2.4 e300 Core PLL Electrical Characteristics . . . . .45
4.3 AC Electrical Characteristics. . . . . . . . . . . . . . . . . . . . .46
4.3.1 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .46
4.3.2 AC Operating Frequency Data. . . . . . . . . . . . . .46
4.3.3 Resets . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .47
4.3.4 External Interrupts . . . . . . . . . . . . . . . . . . . . . . .50
4.3.5 SDRAM (DDR) . . . . . . . . . . . . . . . . . . . . . . . . .50
4.3.6 LPC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .55
4.3.7 NFC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4.3.8 FEC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4.3.9 USB ULPI . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4.3.10 MMC/SD/SDIO Card Host Controller (SDHC) .
4.3.11 DIU . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4.3.12 CAN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4.3.13 I
2
C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4.3.14 J1850 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4.3.15 PSC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4.3.16 GPIOs and Timers . . . . . . . . . . . . . . . . . . . . . .
4.3.17 Fusebox . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4.3.18 IEEE 1149.1 (JTAG) . . . . . . . . . . . . . . . . . . . . .
System Design Information . . . . . . . . . . . . . . . . . . . . . . . . . .
5.1 Power Up/Down Sequencing . . . . . . . . . . . . . . . . . . . .
5.2 System and CPU Core AV
DD
Power Supply Filtering .
5.3 Connection Recommendations . . . . . . . . . . . . . . . . . .
5.4 Pullup/Pulldown Resistor Requirements . . . . . . . . . . .
5.4.1 Pulldown Resistor Requirements for TEST Pin
5.5 JTAG . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5.5.1 JTAG_TRST . . . . . . . . . . . . . . . . . . . . . . . . . . .
5.5.2 e300 COP / BDM Interface . . . . . . . . . . . . . . . .
Package Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
6.1 Package Parameters . . . . . . . . . . . . . . . . . . . . . . . . .
6.2 Mechanical Dimensions. . . . . . . . . . . . . . . . . . . . . . . .
Product Documentation. . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
61
63
66
67
68
71
71
72
72
79
79
80
82
82
82
82
83
83
83
83
83
87
87
88
91
91
4
5
6
7
8
MPC5125 Microcontroller Data Sheet, Rev. 3
2
Freescale Semiconductor
Ordering Information
1
Ordering Information
M PC 5125 Y VN 400 R
Qualification status
Core code
Device number
Temperature range
Package identifier
Operating frequency (MHz)
Tape and reel status
Temperature Range
Y = –40 °C to 125 °C,
junction
Package Identifier
VN = 324 TEPBGA Pb-free
Operating Frequency
400 = 400 MHz
Tape and Reel Status
R = Tape and reel
(blank) = Trays
Qualification Status
P = Pre qualification
M = Fully spec. qualified, general market flow
S = Fully spec. qualified, automotive flow
Note:
Not all options are available on all devices. Refer to
Table 1.
Figure 1. MPC5125 Orderable Part Number Description
Table 1
shows the orderable part numbers for the MPC5125.
Table 1. MPC5125 Orderable Part Numbers
Freescale Part Number
1
MPC5125YVN400
Speed (MHz)
Package Description
MPC5125 324TEPBGA package
Lead-free (PbFree)
Max
3
(f
MAX
)
400 MHz core
200 MHz bus
Operating Temperature
2
Min (T
L
)
–40 °C
Max (T
H
)
125 °C
NOTES:
1
All packaged devices are PPC5125, rather than MPC125, until product qualifications are complete.
2
The lowest ambient operating temperature (T
A
) is referenced by T
L
; the highest junction temperature is referenced by T
H
.
3
Maximum speed is the maximum frequency allowed including frequency modulation (FM).
MPC5125 Microcontroller Data Sheet, Rev. 3
Freescale Semiconductor
3
FPGA/CPLD
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