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HYMD216646DP6J-J

Description
1184pin Unbuffered DDR SDRAM DIMMs
Categorystorage    storage   
File Size361KB,30 Pages
ManufacturerSK Hynix
Websitehttp://www.hynix.com/eng/
Environmental Compliance
Download Datasheet Parametric View All

HYMD216646DP6J-J Overview

1184pin Unbuffered DDR SDRAM DIMMs

HYMD216646DP6J-J Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerSK Hynix
Parts packaging codeDIMM
package instructionDIMM, DIMM184
Contacts184
Reach Compliance Codeunknow
ECCN codeEAR99
access modeSINGLE BANK PAGE BURST
Maximum access time0.7 ns
Other featuresAUTO/SELF REFRESH
Maximum clock frequency (fCLK)166 MHz
I/O typeCOMMON
JESD-30 codeR-XDMA-N184
memory density268435456 bi
Memory IC TypeDDR DRAM MODULE
memory width16
Number of functions1
Number of ports1
Number of terminals184
word count16777216 words
character code16000000
Operating modeSYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize16MX16
Output characteristics3-STATE
Package body materialUNSPECIFIED
encapsulated codeDIMM
Encapsulate equivalent codeDIMM184
Package shapeRECTANGULAR
Package formMICROELECTRONIC ASSEMBLY
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply2.5 V
Certification statusNot Qualified
refresh cycle8192
self refreshYES
Maximum supply voltage (Vsup)2.7 V
Minimum supply voltage (Vsup)2.3 V
Nominal supply voltage (Vsup)2.5 V
surface mountNO
technologyCMOS
Temperature levelCOMMERCIAL
Terminal formNO LEAD
Terminal pitch1.27 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
184pin Unbuffered DDR SDRAM DIMMs based on 256Mb D ver. (TSOP)
This Hynix unbuffered Dual In-Line Memory Module (DIMM) series consists of 256Mb D ver. DDR SDRAMs in 400 mil
TSOP II packages on a 184pin glass-epoxy substrate. This Hynix 256Mb D ver. based unbuffered DIMM series provide
a high performance 8 byte interface in 5.25" width form factor of industry standard. It is suitable for easy interchange
and addition.
FEATURES
JEDEC Standard 184-pin dual in-line memory module
(DIMM)
Two ranks 64M x 72, 64M x 64 and One rank 32M x
72, 32M x 64, 16M x 64 organization
2.6V
±
0.1V VDD and VDDQ Power supply for
DDR400, 2.5V
±
0.2V for DDR333 and below
All inputs and outputs are compatible with SSTL_2
interface
Fully differential clock operations (CK & /CK) with
133/166/200MHz
DLL aligns DQ and DQS transition with CK transition
Programmable CAS Latency: DDR266(2, 2.5 clock),
DDR333(2.5 clock), DDR400(3 clock)
Programmable Burst Length 2 / 4 / 8 with both
sequential and interleave mode
Edge-aligned DQS with data outs and Center-aligned
DQS with data inputs
Auto refresh and self refresh supported
8192 refresh cycles / 64ms
Serial Presence Detect (SPD) with EEPROM
Built with 256Mb DDR SDRAMs in 400 mil TSOP II
packages
Lead-free product listed for each configuration
(RoHS compliant)
ADDRESS TABLE
Organization
128MB
256MB
256MB
512MB
512MB
16M x 64
32M x 64
32M x 72
64M x 64
64M x 72
Ranks
1
1
1
2
2
SDRAMs
16Mb x 16
32Mb x 8
32Mb x 8
32Mb x 8
32Mb x 8
# of
DRAMs
4
8
9
16
18
# of row/bank/column Address
12(A0~A11)/2(BA0,BA1)/9(A0~A8)
13(A0~A12)/2(BA0,BA1)/10(A0~A9)
13(A0~A12)/2(BA0,BA1)/10(A0~A9)
13(A0~A12)/2(BA0,BA1)/10(A0~A9)
13(A0~A12)/2(BA0,BA1)/10(A0~A9)
Refresh
Method
8K / 64ms
8K / 64ms
8K / 64ms
8K / 64ms
8K / 64ms
PERFORMANCE RANGE
Part Number Suffix
Speed Bin
CL - tRCD- tRP
CL=3
Max Clock
Frequency
CL=2.5
CL=2
-D43
1
DDR400B
3-3-3
200
166
133
-J
DDR333
2.5-3-3
-
166
133
-K
DDR266A
2-3-3
-
133
133
-H
DDR266B
2.5-3-3
-
133
133
Unit
-
CK
MHz
MHz
MHz
Note:
1. 2.6V
±
0.1V VDD and VDDQ Power supply for DDR400 and 2.5V
±
0.2V for DDR333 and below
Rev. 1.2 / May. 2005
1
This document is a general product description and is subject to change without notice. Hynix Semiconductor does not assume any
responsibility for use of circuits described. No patent licenses are implied.
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