Operating Temperature Range .........................-40°C to +125°C
Storage Temperature Range .............................-65°C to +150°C
Junction Temperature ......................................................+150°C
Lead Temperature (soldering, 10s) .................................+300°C
Note 1:
These power limits are defined by the thermal characteristics of the package, maximum function temperature (+150°C), and
the JEDEC51-7 defined setup. Maximum power dissipation could be lower, limited by the thermal-shutdown protection
included in this IC.
Note 2:
Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to
www.maxim-ic.com/thermal-tutorial.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
ELECTRICAL CHARACTERISTICS
(V
IN
= +1.7V to +5.5V, R
SETI
= 94.3kΩ, C
IN
= 1µF, and T
A
= T
J
= -40°C to +125°C, unless otherwise noted. Typical values are at V
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