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TMPZ84C00AP-8

Description
TLCS-Z80 MPU : 8-BIT MICROPROCESSOR
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size3MB,58 Pages
ManufacturerToshiba Semiconductor
Websitehttp://toshiba-semicon-storage.com/
Download Datasheet Parametric Compare View All

TMPZ84C00AP-8 Overview

TLCS-Z80 MPU : 8-BIT MICROPROCESSOR

TMPZ84C00AP-8 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerToshiba Semiconductor
Parts packaging codeDIP
package instructionDIP,
Contacts40
Reach Compliance Codeunknow
Other featuresBUILT-IN REFRESH CIRCUIT FOR DYNAMIC MEMORY
Address bus width16
bit size8
boundary scanNO
maximum clock frequency8 MHz
External data bus width8
FormatFIXED POINT
Integrated cacheNO
JESD-30 codeR-PDIP-T40
JESD-609 codee0
length50.7 mm
low power modeYES
Number of DMA channels
Number of external interrupt devices2
Number of serial I/Os
Number of terminals40
On-chip data RAM width
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeDIP
Package shapeRECTANGULAR
Package formIN-LINE
Peak Reflow Temperature (Celsius)NOT SPECIFIED
Certification statusNot Qualified
RAM (number of words)0
Maximum seat height4.8 mm
speed8 MHz
Maximum slew rate25 mA
Maximum supply voltage5.5 V
Minimum supply voltage4.5 V
Nominal supply voltage5 V
surface mountNO
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
width15.24 mm
uPs/uCs/peripheral integrated circuit typeMICROPROCESSOR

TMPZ84C00AP-8 Related Products

TMPZ84C00AP-8 TMPZ84C00AT-8 TMPZ84C00AP-6 TMPZ84C00AM-6 TMPZ84C00AM-8 TMPZ84C00A
Description TLCS-Z80 MPU : 8-BIT MICROPROCESSOR TLCS-Z80 MPU : 8-BIT MICROPROCESSOR TLCS-Z80 MPU : 8-BIT MICROPROCESSOR TLCS-Z80 MPU : 8-BIT MICROPROCESSOR TLCS-Z80 MPU : 8-BIT MICROPROCESSOR TLCS-Z80 MPU : 8-BIT MICROPROCESSOR
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible -
Maker Toshiba Semiconductor Toshiba Semiconductor Toshiba Semiconductor Toshiba Semiconductor Toshiba Semiconductor -
Parts packaging code DIP LCC DIP SSOP SSOP -
package instruction DIP, QCCJ, DIP, SSOP, SSOP, -
Contacts 40 44 40 40 40 -
Reach Compliance Code unknow unknow unknow unknow unknow -
Other features BUILT-IN REFRESH CIRCUIT FOR DYNAMIC MEMORY BUILT-IN REFRESH CIRCUIT FOR DYNAMIC MEMORY BUILT-IN REFRESH CIRCUIT FOR DYNAMIC MEMORY BUILT-IN REFRESH CIRCUIT FOR DYNAMIC MEMORY BUILT-IN REFRESH CIRCUIT FOR DYNAMIC MEMORY -
Address bus width 16 16 16 16 16 -
bit size 8 8 8 8 8 -
boundary scan NO NO NO NO NO -
maximum clock frequency 8 MHz 8 MHz 6 MHz 6 MHz 8 MHz -
External data bus width 8 8 8 8 8 -
Format FIXED POINT FIXED POINT FIXED POINT FIXED POINT FIXED POINT -
Integrated cache NO NO NO NO NO -
JESD-30 code R-PDIP-T40 S-PQCC-J44 R-PDIP-T40 R-PDSO-G40 R-PDSO-G40 -
JESD-609 code e0 e0 e0 e0 e0 -
length 50.7 mm 16.6 mm 50.7 mm 17.5 mm 17.5 mm -
low power mode YES YES YES YES YES -
Number of external interrupt devices 2 2 2 2 2 -
Number of terminals 40 44 40 40 40 -
Maximum operating temperature 85 °C 85 °C 85 °C 85 °C 85 °C -
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C -40 °C -
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY -
encapsulated code DIP QCCJ DIP SSOP SSOP -
Package shape RECTANGULAR SQUARE RECTANGULAR RECTANGULAR RECTANGULAR -
Package form IN-LINE CHIP CARRIER IN-LINE SMALL OUTLINE, SHRINK PITCH SMALL OUTLINE, SHRINK PITCH -
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED -
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified -
Maximum seat height 4.8 mm 4.52 mm 4.8 mm 2.8 mm 2.8 mm -
speed 8 MHz 8 MHz 6 MHz 6 MHz 8 MHz -
Maximum slew rate 25 mA 25 mA 22 mA 22 mA 25 mA -
Maximum supply voltage 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V -
Minimum supply voltage 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V -
Nominal supply voltage 5 V 5 V 5 V 5 V 5 V -
surface mount NO YES NO YES YES -
technology CMOS CMOS CMOS CMOS CMOS -
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL -
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) -
Terminal form THROUGH-HOLE J BEND THROUGH-HOLE GULL WING GULL WING -
Terminal pitch 2.54 mm 1.27 mm 2.54 mm 0.8 mm 0.8 mm -
Terminal location DUAL QUAD DUAL DUAL DUAL -
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED -
width 15.24 mm 16.6 mm 15.24 mm 8.8 mm 8.8 mm -
uPs/uCs/peripheral integrated circuit type MICROPROCESSOR MICROPROCESSOR MICROPROCESSOR MICROPROCESSOR MICROPROCESSOR -
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