TMPZ84C00AM-6 datasheet, PDF - EEWORLD Datasheet

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TMPZ84C00AM-6: DescriptionTLCS-Z80 MPU : 8-BIT MICROPROCESSOR; CategoryThe embedded processor and controller Microcontrollers and processors; File Size3MB，58 Pages; ManufacturerToshiba Semiconductor; Websitehttp://toshiba-semicon-storage.com/

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TMPZ84C00AM-6 Overview

TLCS-Z80 MPU : 8-BIT MICROPROCESSOR

TMPZ84C00AM-6 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Toshiba Semiconductor
Parts packaging code	SSOP
package instruction	SSOP,
Contacts	40
Reach Compliance Code	unknow
Other features	BUILT-IN REFRESH CIRCUIT FOR DYNAMIC MEMORY
Address bus width	16
bit size	8
boundary scan	NO
maximum clock frequency	6 MHz
External data bus width	8
Format	FIXED POINT
Integrated cache	NO
JESD-30 code	R-PDSO-G40
JESD-609 code	e0
length	17.5 mm
low power mode	YES
Number of DMA channels
Number of external interrupt devices	2
Number of serial I/Os
Number of terminals	40
On-chip data RAM width
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Package body material	PLASTIC/EPOXY
encapsulated code	SSOP
Package shape	RECTANGULAR
Package form	SMALL OUTLINE, SHRINK PITCH
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
Certification status	Not Qualified
RAM (number of words)	0
Maximum seat height	2.8 mm
speed	6 MHz
Maximum slew rate	22 mA
Maximum supply voltage	5.5 V
Minimum supply voltage	4.5 V
Nominal supply voltage	5 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	GULL WING
Terminal pitch	0.8 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	8.8 mm
uPs/uCs/peripheral integrated circuit type	MICROPROCESSOR

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TMPZ84C00AM-6 Related Products

	TMPZ84C00AM-6	TMPZ84C00AT-8	TMPZ84C00AP-8	TMPZ84C00AP-6	TMPZ84C00AM-8	TMPZ84C00A
Description	TLCS-Z80 MPU : 8-BIT MICROPROCESSOR	TLCS-Z80 MPU : 8-BIT MICROPROCESSOR	TLCS-Z80 MPU : 8-BIT MICROPROCESSOR	TLCS-Z80 MPU : 8-BIT MICROPROCESSOR	TLCS-Z80 MPU : 8-BIT MICROPROCESSOR	TLCS-Z80 MPU : 8-BIT MICROPROCESSOR
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	-
Maker	Toshiba Semiconductor	Toshiba Semiconductor	Toshiba Semiconductor	Toshiba Semiconductor	Toshiba Semiconductor	-
Parts packaging code	SSOP	LCC	DIP	DIP	SSOP	-
package instruction	SSOP,	QCCJ,	DIP,	DIP,	SSOP,	-
Contacts	40	44	40	40	40	-
Reach Compliance Code	unknow	unknow	unknow	unknow	unknow	-
Other features	BUILT-IN REFRESH CIRCUIT FOR DYNAMIC MEMORY	BUILT-IN REFRESH CIRCUIT FOR DYNAMIC MEMORY	BUILT-IN REFRESH CIRCUIT FOR DYNAMIC MEMORY	BUILT-IN REFRESH CIRCUIT FOR DYNAMIC MEMORY	BUILT-IN REFRESH CIRCUIT FOR DYNAMIC MEMORY	-
Address bus width	16	16	16	16	16	-
bit size	8	8	8	8	8	-
boundary scan	NO	NO	NO	NO	NO	-
maximum clock frequency	6 MHz	8 MHz	8 MHz	6 MHz	8 MHz	-
External data bus width	8	8	8	8	8	-
Format	FIXED POINT	FIXED POINT	FIXED POINT	FIXED POINT	FIXED POINT	-
Integrated cache	NO	NO	NO	NO	NO	-
JESD-30 code	R-PDSO-G40	S-PQCC-J44	R-PDIP-T40	R-PDIP-T40	R-PDSO-G40	-
JESD-609 code	e0	e0	e0	e0	e0	-
length	17.5 mm	16.6 mm	50.7 mm	50.7 mm	17.5 mm	-
low power mode	YES	YES	YES	YES	YES	-
Number of external interrupt devices	2	2	2	2	2	-
Number of terminals	40	44	40	40	40	-
Maximum operating temperature	85 °C	85 °C	85 °C	85 °C	85 °C	-
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	-
encapsulated code	SSOP	QCCJ	DIP	DIP	SSOP	-
Package shape	RECTANGULAR	SQUARE	RECTANGULAR	RECTANGULAR	RECTANGULAR	-
Package form	SMALL OUTLINE, SHRINK PITCH	CHIP CARRIER	IN-LINE	IN-LINE	SMALL OUTLINE, SHRINK PITCH	-
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	-
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	-
Maximum seat height	2.8 mm	4.52 mm	4.8 mm	4.8 mm	2.8 mm	-
speed	6 MHz	8 MHz	8 MHz	6 MHz	8 MHz	-
Maximum slew rate	22 mA	25 mA	25 mA	22 mA	25 mA	-
Maximum supply voltage	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	-
Minimum supply voltage	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	-
Nominal supply voltage	5 V	5 V	5 V	5 V	5 V	-
surface mount	YES	YES	NO	NO	YES	-
technology	CMOS	CMOS	CMOS	CMOS	CMOS	-
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	-
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	-
Terminal form	GULL WING	J BEND	THROUGH-HOLE	THROUGH-HOLE	GULL WING	-
Terminal pitch	0.8 mm	1.27 mm	2.54 mm	2.54 mm	0.8 mm	-
Terminal location	DUAL	QUAD	DUAL	DUAL	DUAL	-
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	-
width	8.8 mm	16.6 mm	15.24 mm	15.24 mm	8.8 mm	-
uPs/uCs/peripheral integrated circuit type	MICROPROCESSOR	MICROPROCESSOR	MICROPROCESSOR	MICROPROCESSOR	MICROPROCESSOR	-

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