TMP82C51AP-2 datasheet, PDF - EEWORLD Datasheet

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TMP82C51AP-2: Description1 CHANNEL(S), 104K bps, SERIAL COMM CONTROLLER, PDIP28; CategoryThe embedded processor and controller Microcontrollers and processors; File Size747KB，36 Pages; ManufacturerToshiba Semiconductor; Websitehttp://toshiba-semicon-storage.com/

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TMP82C51AP-2 Overview

1 CHANNEL(S), 104K bps, SERIAL COMM CONTROLLER, PDIP28

TMP82C51AP-2 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Toshiba Semiconductor
Parts packaging code	DIP
package instruction	DIP,
Contacts	28
Reach Compliance Code	unknow
Other features	MODEM CONTROL CAPABILITY
Address bus width	1
boundary scan	NO
maximum clock frequency	5 MHz
letter of agreement	ASYNC, BIT; SYNC, BYTE
Data encoding/decoding methods	NRZ
Maximum data transfer rate	0.0126953125 MBps
External data bus width	8
JESD-30 code	R-PDIP-T28
JESD-609 code	e0
length	37 mm
low power mode	NO
Number of DMA channels
Number of I/O lines
Number of serial I/Os	1
Number of terminals	28
On-chip data RAM width
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Package shape	RECTANGULAR
Package form	IN-LINE
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
Certification status	Not Qualified
RAM (number of words)	0
Maximum seat height	5.3 mm
Maximum slew rate	5 mA
Maximum supply voltage	5.5 V
Minimum supply voltage	4.5 V
Nominal supply voltage	5 V
surface mount	NO
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	15.24 mm
uPs/uCs/peripheral integrated circuit type	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

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TMP82C51AP-2 Related Products

	TMP82C51AP-2	TMP82C51AP-10	TMP82C51AM-10	TMP82C51AM-2	TMP82C51A
Description	1 CHANNEL(S), 104K bps, SERIAL COMM CONTROLLER, PDIP28	1 CHANNEL(S), 104K bps, SERIAL COMM CONTROLLER, PDIP28	1 CHANNEL(S), 104K bps, SERIAL COMM CONTROLLER, PDIP28	1 CHANNEL(S), 104K bps, SERIAL COMM CONTROLLER, PDIP28	1 CHANNEL(S), 104K bps, SERIAL COMM CONTROLLER, PDIP28
Address bus width	1	1	1	1	1
letter of agreement	ASYNC, BIT; SYNC, BYTE	ASYNC, BIT; SYNC, BYTE	ASYNC, BIT; SYNC, BYTE	ASYNC, BIT; SYNC, BYTE	ASYNC, BIT; SYNC, BYTE
External data bus width	8	8	8	8	8
Number of terminals	28	28	28	28	28
Maximum operating temperature	85 °C	85 °C	85 °C	85 °C	85 Cel
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C	-40 Cel
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal form	THROUGH-HOLE	THROUGH-HOLE	GULL WING	GULL WING	THROUGH-hole
Terminal location	DUAL	DUAL	DUAL	DUAL	pair
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	-
Maker	Toshiba Semiconductor	Toshiba Semiconductor	Toshiba Semiconductor	Toshiba Semiconductor	-
Parts packaging code	DIP	DIP	SOIC	SOIC	-
package instruction	DIP,	DIP,	SOP,	SOP,	-
Contacts	28	28	28	28	-
Reach Compliance Code	unknow	unknow	unknow	unknow	-
Other features	MODEM CONTROL CAPABILITY	MODEM CONTROL CAPABILITY	MODEM CONTROL CAPABILITY	MODEM CONTROL CAPABILITY	-
boundary scan	NO	NO	NO	NO	-
maximum clock frequency	5 MHz	10 MHz	10 MHz	5 MHz	-
Data encoding/decoding methods	NRZ	NRZ	NRZ	NRZ	-
Maximum data transfer rate	0.0126953125 MBps	0.03662109375 MBps	0.03662109375 MBps	0.0126953125 MBps	-
JESD-30 code	R-PDIP-T28	R-PDIP-T28	R-PDSO-G28	R-PDSO-G28	-
JESD-609 code	e0	e0	e0	e0	-
length	37 mm	37 mm	18.5 mm	18.5 mm	-
low power mode	NO	NO	NO	NO	-
Number of serial I/Os	1	1	1	1	-
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	-
encapsulated code	DIP	DIP	SOP	SOP	-
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	-
Package form	IN-LINE	IN-LINE	SMALL OUTLINE	SMALL OUTLINE	-
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	-
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	-
Maximum seat height	5.3 mm	5.3 mm	2.7 mm	2.7 mm	-
Maximum slew rate	5 mA	15 mA	15 mA	5 mA	-
Maximum supply voltage	5.5 V	5.5 V	5.5 V	5.5 V	-
Minimum supply voltage	4.5 V	4.5 V	4.5 V	4.5 V	-
Nominal supply voltage	5 V	5 V	5 V	5 V	-
surface mount	NO	NO	YES	YES	-
technology	CMOS	CMOS	CMOS	CMOS	-
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	-
Terminal pitch	2.54 mm	2.54 mm	1.27 mm	1.27 mm	-
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	-
width	15.24 mm	15.24 mm	8.8 mm	8.8 mm	-
uPs/uCs/peripheral integrated circuit type	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	-

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Basic three-level DC conversion diagram

Shortcut: 00 01 02 03 04 05 06 07 08 09 0A 0C 0F 0J 0L 0M 0R 0S 0T 0Z 10 11 12 13 14 15 16 17 18 19 1A 1B 1C 1D 1E 1F 1H 1K 1M 1N 1P 1S 1T 1V 1X 1Z 20 21 22 23 24 25 26 27 28 29 2A 2B 2C 2D 2E 2F 2G 2K 2M 2N 2P 2Q 2R 2S 2T 2W 2Z 30 31 32 33 34 35 36 37 38 39 3A 3B 3C 3D 3E 3F 3G 3H 3J 3K 3L 3M 3N 3P 3R 3S 3T 3V 40 41 42 43 44 45 46 47 48 49 4A 4B 4C 4D 4M 4N 4P 4S 4T 50 51 52 53 54 55 56 57 58 59 5A 5B 5C 5E 5G 5H 5K 5M 5N 5P 5S 5T 5V 60 61 62 63 64 65 66 67 68 69 6A 6C 6E 6F 6M 6N 6P 6R 6S 6T 70 71 72 73 74 75 76 77 78 79 7A 7B 7C 7M 7N 7P 7Q 7V 7W 7X 80 81 82 83 84 85 86 87 88 89 8A 8D 8E 8L 8N 8P 8S 8T 8W 8Y 8Z 90 91 92 93 94 95 96 97 98 99 9A 9B 9C 9D 9F 9G 9H 9L 9S 9T 9W

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