|
TMP82C51A |
TMP82C51AP-10 |
TMP82C51AP-2 |
TMP82C51AM-10 |
TMP82C51AM-2 |
| Description |
1 CHANNEL(S), 104K bps, SERIAL COMM CONTROLLER, PDIP28 |
1 CHANNEL(S), 104K bps, SERIAL COMM CONTROLLER, PDIP28 |
1 CHANNEL(S), 104K bps, SERIAL COMM CONTROLLER, PDIP28 |
1 CHANNEL(S), 104K bps, SERIAL COMM CONTROLLER, PDIP28 |
1 CHANNEL(S), 104K bps, SERIAL COMM CONTROLLER, PDIP28 |
| Number of terminals |
28 |
28 |
28 |
28 |
28 |
| Maximum operating temperature |
85 Cel |
85 °C |
85 °C |
85 °C |
85 °C |
| Minimum operating temperature |
-40 Cel |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
| External data bus width |
8 |
8 |
8 |
8 |
8 |
| Terminal form |
THROUGH-hole |
THROUGH-HOLE |
THROUGH-HOLE |
GULL WING |
GULL WING |
| Terminal location |
pair |
DUAL |
DUAL |
DUAL |
DUAL |
| Temperature level |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
| Address bus width |
1 |
1 |
1 |
1 |
1 |
| letter of agreement |
ASYNC, BIT; SYNC, BYTE |
ASYNC, BIT; SYNC, BYTE |
ASYNC, BIT; SYNC, BYTE |
ASYNC, BIT; SYNC, BYTE |
ASYNC, BIT; SYNC, BYTE |
| Is it Rohs certified? |
- |
incompatible |
incompatible |
incompatible |
incompatible |
| Maker |
- |
Toshiba Semiconductor |
Toshiba Semiconductor |
Toshiba Semiconductor |
Toshiba Semiconductor |
| Parts packaging code |
- |
DIP |
DIP |
SOIC |
SOIC |
| package instruction |
- |
DIP, |
DIP, |
SOP, |
SOP, |
| Contacts |
- |
28 |
28 |
28 |
28 |
| Reach Compliance Code |
- |
unknow |
unknow |
unknow |
unknow |
| Other features |
- |
MODEM CONTROL CAPABILITY |
MODEM CONTROL CAPABILITY |
MODEM CONTROL CAPABILITY |
MODEM CONTROL CAPABILITY |
| boundary scan |
- |
NO |
NO |
NO |
NO |
| maximum clock frequency |
- |
10 MHz |
5 MHz |
10 MHz |
5 MHz |
| Data encoding/decoding methods |
- |
NRZ |
NRZ |
NRZ |
NRZ |
| Maximum data transfer rate |
- |
0.03662109375 MBps |
0.0126953125 MBps |
0.03662109375 MBps |
0.0126953125 MBps |
| JESD-30 code |
- |
R-PDIP-T28 |
R-PDIP-T28 |
R-PDSO-G28 |
R-PDSO-G28 |
| JESD-609 code |
- |
e0 |
e0 |
e0 |
e0 |
| length |
- |
37 mm |
37 mm |
18.5 mm |
18.5 mm |
| low power mode |
- |
NO |
NO |
NO |
NO |
| Number of serial I/Os |
- |
1 |
1 |
1 |
1 |
| Package body material |
- |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
| encapsulated code |
- |
DIP |
DIP |
SOP |
SOP |
| Package shape |
- |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
| Package form |
- |
IN-LINE |
IN-LINE |
SMALL OUTLINE |
SMALL OUTLINE |
| Peak Reflow Temperature (Celsius) |
- |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
| Certification status |
- |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
| Maximum seat height |
- |
5.3 mm |
5.3 mm |
2.7 mm |
2.7 mm |
| Maximum slew rate |
- |
15 mA |
5 mA |
15 mA |
5 mA |
| Maximum supply voltage |
- |
5.5 V |
5.5 V |
5.5 V |
5.5 V |
| Minimum supply voltage |
- |
4.5 V |
4.5 V |
4.5 V |
4.5 V |
| Nominal supply voltage |
- |
5 V |
5 V |
5 V |
5 V |
| surface mount |
- |
NO |
NO |
YES |
YES |
| technology |
- |
CMOS |
CMOS |
CMOS |
CMOS |
| Terminal surface |
- |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
| Terminal pitch |
- |
2.54 mm |
2.54 mm |
1.27 mm |
1.27 mm |
| Maximum time at peak reflow temperature |
- |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
| width |
- |
15.24 mm |
15.24 mm |
8.8 mm |
8.8 mm |
| uPs/uCs/peripheral integrated circuit type |
- |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |