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AS7C33256FT36A-10TQCN

Description
3.3V 256K x 32/36 Flow-through synchronous SRAM
Categorystorage    storage   
File Size508KB,19 Pages
ManufacturerALSC [Alliance Semiconductor Corporation]
Environmental Compliance
Download Datasheet Parametric View All

AS7C33256FT36A-10TQCN Overview

3.3V 256K x 32/36 Flow-through synchronous SRAM

AS7C33256FT36A-10TQCN Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerALSC [Alliance Semiconductor Corporation]
Parts packaging codeQFP
package instruction14 X 20 MM, LEAD FREE, TQFP-100
Contacts100
Reach Compliance Codeunknow
ECCN code3A991.B.2.A
Maximum access time10 ns
Other featuresFLOW-THROUGH ARCHITECTURE
Maximum clock frequency (fCLK)83 MHz
I/O typeCOMMON
JESD-30 codeR-PQFP-G100
JESD-609 codee3
length20 mm
memory density9437184 bi
Memory IC TypeSTANDARD SRAM
memory width36
Number of functions1
Number of terminals100
word count262144 words
character code256000
Operating modeSYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize256KX36
Output characteristics3-STATE
Package body materialPLASTIC/EPOXY
encapsulated codeLQFP
Encapsulate equivalent codeQFP100,.63X.87
Package shapeRECTANGULAR
Package formFLATPACK, LOW PROFILE
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)245
power supply2.5/3.3,3.3 V
Certification statusNot Qualified
Maximum seat height1.6 mm
Maximum standby current0.03 A
Minimum standby current3.14 V
Maximum slew rate0.3 mA
Maximum supply voltage (Vsup)3.465 V
Minimum supply voltage (Vsup)3.135 V
Nominal supply voltage (Vsup)3.3 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceMatte Tin (Sn)
Terminal formGULL WING
Terminal pitch0.65 mm
Terminal locationQUAD
Maximum time at peak reflow temperature30
width14 mm
November 2004
®
AS7C33256FT32A
AS7C33256FT36A
3.3V 256K
×
32/36 Flow-through synchronous SRAM
Features
Organization: 262,144 words × 32 or 36 bits
Fast clock to data access: 7.5/8.5/10 ns
Fast OE access time: 3.5/4.0/4.0 ns
Fully synchronous flow-through operation
Asynchronous output enable control
Available in 100-pin TQFP package
Individual byte write and global write
Multiple chip enables for easy expansion
3.3V core power supply
2.5V or 3.3V I/O operation with separate VDDQ
Linear or interleaved burst control
Snooze mode for reduced power-standby
Common data inputs and data outputs
Logic block diagram
LBO
CLK
ADV
ADSC
ADSP
A[17:0]
18
CLK
CE
CLR
Q0
Burst logic
Q1
2
2
D
Q
CE
Address
register
CLK
D
DQ
d
Q
Byte write
registers
CLK
D
DQ
Q
c
Byte write
registers
CLK
D
DQ
b
Q
Byte write
registers
CLK
DQ
a
Q
Byte write
registers
CLK
D
Enable
CE
register
CLK
Q
D
256K × 32/36
Memory
array
18
16
18
32/36
32/36
GWE
BWE
BW
d
BW
c
BW
b
BW
a
CE0
CE1
CE2
4
OE
Output
registers
CLK
Input
registers
CLK
ZZ
Power
down
D
Enable
Q
delay
register
CLK
32/36
DQ[a:d]
OE
Selection guide
Minimum cycle time
Maximum clock access time
Maximum operating current
Maximum standby current
Maximum CMOS standby current (DC)
-75
8.5
7.5
300
110
30
-85
10
8.5
275
100
30
-10
12
10
250
90
30
Units
ns
ns
mA
mA
mA
11/30/04, v 1.1
Alliance Semiconductor
1 of 19
Copyright © Alliance Semiconductor. All rights reserved.
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