EEWORLDEEWORLDEEWORLD

Part Number

Search

TMP47C25N

Description
CMOS 4-BIT MICROCONTROLLER
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size369KB,17 Pages
ManufacturerToshiba Semiconductor
Websitehttp://toshiba-semicon-storage.com/
Download Datasheet Parametric Compare View All

TMP47C25N Overview

CMOS 4-BIT MICROCONTROLLER

TMP47C25N Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerToshiba Semiconductor
Reach Compliance Codeunknow
Has ADCNO
Address bus width
bit size4
CPU seriesTLCS-47
DAC channelNO
DMA channelNO
External data bus width
JESD-30 codeR-PDIP-T42
JESD-609 codee0
Number of I/O lines35
Number of terminals42
Maximum operating temperature60 °C
Minimum operating temperature-30 °C
PWM channelNO
Package body materialPLASTIC/EPOXY
encapsulated codeSDIP
Encapsulate equivalent codeSDIP42,.6
Package shapeRECTANGULAR
Package formIN-LINE, SHRINK PITCH
power supply3/5 V
Certification statusNot Qualified
RAM (bytes)192
rom(word)2048
ROM programmabilityMROM
speed1.929 MHz
Maximum slew rate2.5 mA
Maximum supply voltage6 V
Minimum supply voltage2.5 V
surface mountNO
technologyCMOS
Temperature levelOTHER
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch1.78 mm
Terminal locationDUAL

TMP47C25N Related Products

TMP47C25N TMP47C25F
Description CMOS 4-BIT MICROCONTROLLER CMOS 4-BIT MICROCONTROLLER
Is it Rohs certified? incompatible incompatible
Maker Toshiba Semiconductor Toshiba Semiconductor
Reach Compliance Code unknow unknow
Has ADC NO NO
bit size 4 4
CPU series TLCS-47 TLCS-47
DAC channel NO NO
DMA channel NO NO
JESD-30 code R-PDIP-T42 S-PQFP-G44
JESD-609 code e0 e0
Number of I/O lines 35 37
Number of terminals 42 44
Maximum operating temperature 60 °C 60 °C
Minimum operating temperature -30 °C -30 °C
PWM channel NO NO
Package body material PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code SDIP LQFP
Encapsulate equivalent code SDIP42,.6 QFP44,.7SQ,32
Package shape RECTANGULAR SQUARE
Package form IN-LINE, SHRINK PITCH FLATPACK, LOW PROFILE
power supply 3/5 V 3/5 V
Certification status Not Qualified Not Qualified
RAM (bytes) 192 192
rom(word) 2048 2048
ROM programmability MROM MROM
speed 1.929 MHz 1.929 MHz
Maximum slew rate 2.5 mA 2.5 mA
Maximum supply voltage 6 V 6 V
Minimum supply voltage 2.5 V 2.5 V
surface mount NO YES
technology CMOS CMOS
Temperature level OTHER OTHER
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form THROUGH-HOLE GULLWING
Terminal pitch 1.78 mm 0.8 mm
Terminal location DUAL QUAD

Technical ResourceMore

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 647  2103  1482  2861  2023  14  43  30  58  41 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号