TVS Diode Arrays
(SPA
™
Family of Products)
General Purpose ESD Protection - SP1002 Series
SP1002 Series 5pF 8kV Bidirectional TVS Array
Description
RoHS
Pb
GREEN
Back-to-Back Zener diodes fabricated in a proprietary
silicon avalanche technology protect each I/O pin to provide
a high level of protection for electronic equipment that
may experience destructive electrostatic discharges (ESD).
These robust diodes can safely absorb repetitive ESD
strikes at the maximum level specified in the IEC 61000-4-
2 international standard (Level 4, ±8kV contact discharge)
without performance degradation. Their very low loading
capacitance also makes them ideal for protecting high-
speed signal pins.
Pinout
SP1002-01JTG
(SC70-3)
1
NC
2
Features
SP1002-02JTG
(SC70-5)
1
NC
3
(TYP) I/O to I/O
5
0.5μA (MAX) at 5V
board space
IEC61000-4-5, 2A (8/20μs)
contact discharge, ±15kV
air discharge, (Level 4,
IEC61000-4-2)
IEC61000-4-4, 40A
(5/50ns)
Applications
4
Functional Block Diagram
SP1002-01JTG
SP1002-02JTG
1
1
3
Application Example
2
5
4
MultiMedia
Device
Audio Out L
Audio Out R
MultiMedia
Device
Audio In L
Audio In R
2 x SP1002-01
SCART MultiMedia Application of SP1002-01
Life Support Note:
Not Intended for Use in Life Support or Life Saving Applications
The products shown herein are not designed for use in life sustaining or life saving
applications unless otherwise expressly indicated.
©2011 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to
www.littelfuse.com/SPA
for current information.
27
Revision: April 14, 2011
SP1002 Series
SP1002
TVS Diode Arrays
(SPA
™
Family of Products)
General Purpose ESD Protection - SP1002 Series
Absolute Maximum Ratings
Symbol
I
PP
T
OP
T
STOR
Parameter
Peak Current (t
p
=8/20μs)
Operating Temperature
Storage Temperature
Value
2
-40 to 85
-60 to 150
Units
A
°C
°C
Thermal Information
Parameter
Storage Temperature Range
Maximum Junction Temperature
Maximum Lead Temperature (Soldering 10s)
Rating
-65 to 150
150
260
Units
°C
°C
°C
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause
permanent damage to the device. This is a stress only rating and operation of the device
at these or any other conditions above those indicated in the operational sections of this
specification is not implied.
Electrical Characteristics (T
OP
= 25°C)
Parameter
Voltage Drop
Reverse Standoff Voltage
Leakage Current
Clamp Voltage
1
Dynamic Resistance
ESD Withstand Voltage
1,2
Symbol
V
D
V
RWM
I
LEAK
V
C
R
DYN
V
ESD
Test Conditions
I
R
=1mA
I
R
≤1μA with 1 I/O at GND
V
R
=5V with I/O at GND
I
PP
=1A, t
p
=8/20μs, Fwd
I
PP
=2A, t
p
=8/20μs, Fwd
(V
C2
- V
C1
) / (I
PP2
- I
PP1
)
IEC61000-4-2 (Contact)
IEC61000-4-2 (Air)
Reverse Bias=0V
Diode Capacitance
1
C
D
Reverse Bias=2.5V
Reverse Bias=5V
Notes:
1
2
Min
8.0
Typ
8.8
Max
9.5
6.0
0.5
Units
V
V
μA
V
V
Ω
kV
kV
9.2
11.2
2.0
±8
±15
6
5
5
13.0
16.0
pF
pF
pF
Parameter is guaranteed by device characterization
A minimum of 1,000 ESD pulses are applied at 1s intervals
Soldering Parameters
Reflow Condition
- Temperature Min (T
s(min)
)
Pre Heat
- Temperature Max (T
s(max)
)
- Time (min to max) (t
s
)
Average ramp up rate (Liquidus) Temp
(T
L
) to peak
T
S(max)
to T
L
- Ramp-up Rate
Reflow
- Temperature (T
L
) (Liquidus)
- Temperature (t
L
)
Pb – Free assembly
T
P
Temperature
t
P
Ramp-up
Critical Zone
T
L
to T
P
150°C
200°C
60 – 180 secs
3°C/second max
3°C/second max
217°C
60 – 150 seconds
250
+0/-5
°C
20 – 40 seconds
6°C/second max
8 minutes max.
260°C
T
L
T
S(max)
Preheat
t
L
Ramp-do
Ramp-down
T
S(min)
t
S
25
time to peak temperature
Time
Peak Temperature (T
P
)
Time within 5°C of actual peak
Temperature (t
p
)
Ramp-down Rate
Time 25°C to peak Temperature (T
P
)
Do not exceed
SP1002 Series
28
Revision: April 14, 2011
©2011 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to
www.littelfuse.com/SPA
for current information.
TVS Diode Arrays
(SPA
™
Family of Products)
General Purpose ESD Protection - SP1002 Series
Package Dimensions — SC70-3
B
3
Solder Pad Layout
1.30
[0.0512]
E HE
0.65
[0.0256]
0.70
[0.0276]
Package
Pins
JEDEC
SC70-3
3
MO-203 Issue A
Millimeters
Min
Max
1.10
0.10
1.00
0.30
0.25
2.25
1.35
0.66 BSC
2.00
0.26
2.40
0.46
Min
0.031
0.000
0.028
0.006
0.003
0.073
0.045
Inches
Max
0.043
0.004
0.039
0.012
0.010
0.089
0.053
1
e
e
2
A
A1
1.90
[0.0748]
0.80
0.00
0.70
0.15
0.08
1.85
1.15
D
A2 A
A2
B
c
D
A1
0.90
[0.0354]
E
e
HE
L
0.026 BSC
0.079
0.010
0.094
0.018
C
L
Package Dimensions — SC70-5
e
6
5
e
4
Package
Pins
Solder Pad Layout
E
HE
SC70-5
5
MO-203 Issue A
Millimeters
Min
Max
1.10
0.10
1.00
0.30
0.25
2.25
1.35
0.65 BSC
2.00
0.26
2.40
0.46
Min
0.031
0.000
0.028
0.006
0.003
0.073
0.045
0.079
0.010
Inches
Max
0.043
0.004
0.039
0.012
0.010
0.089
0.053
0.094
0.018
not used
JEDEC
1
B
2
3
A
A1
A2
B
A2 A
0.80
0.00
0.70
0.15
0.08
1.85
1.15
D
c
D
E
e
HE
L
L
A1
0.026 BSC
C
Product Characteristics
Lead Plating
Lead Material
Lead Coplanarity
Subsitute Material
Body Material
Flammability
Matte Tin
Copper Alloy
0.0004 inches (0.102mm)
Silicon
Molded Epoxy
UL94-V-0
©2011 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to
www.littelfuse.com/SPA
for current information.
29
Notes :
1. All dimensions are in millimeters
2. Dimensions include solder plating.
3. Dimensions are exclusive of mold flash & metal burr.
4. All specifications comply to JEDEC SPEC MO-203 Issue A
5. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form.
SP1002 Series
6. Package surface matte finish VDI 11-13.
Revision: April 14, 2011
SP1002
TVS Diode Arrays
(SPA
™
Family of Products)
General Purpose ESD Protection - SP1002 Series
Part Numbering System
Part Marking System
BXX
BXX
G= Green
T= Tape & Reel
Product Series
B = SP1002 Series
SP 1002
–
XX J T G
Silicon Protection
Array (SPA
TM
)
Family of
TVS Diode Arrays
Number of Channels
Assembly Site
(varies)
Series
Number of Channels
-01 = 1 Channel, SC70-3 Package
-02 = 2 Channel, SC70-5 Package
Package
J = SC70-3
SC70-5
Ordering Information
Part Number
SP1002-01JTG
SP1002-02JTG
Package
SC70-3
SC70-5
Marking
BX1
BX2
Min. Order Qty.
3000
3000
Embossed Carrier Tape & Reel Specification — SC70-3
PO
Millimetres
Inches
Min
Max
0.065
0.073
0.135
0.139
0.077
0.081
0.055
0.063
0.039
0.049
0.154
0.161
1.574 +/- 0.008
0.303
0.318
0.153
0.161
0.090
0.098
0.039 Ref
0.090
0.098
0.074
0.043
0.051
0.023 Ref
0.010
ØD
P2
t
E
F
P2
D
D1
P0
10P0
W
P
A0
A1
B0
B1
K0
K1
t
Min
Max
ØD1
AO
A1
P
K1
1.65
1.85
3.45
3.55
1.95
2.05
1.40
1.60
1.00
1.25
3.90
4.10
40.0 +/- 0.20
7
.70
8.10
3.90
4.10
2.30
2.50
1.00 Ref
2.30
2.50
1.90 Ref
1.10
1.30
0.60 Ref
0.27 max
E
F
KO
BO
B1
W
Embossed Carrier Tape & Reel Specification — SC70-5 and SC70-6
Millimetres
Min
E
F
P2
D
D1
P0
10P0
W
P
A0
B0
K0
t
SP1002 Series
Inches
Min
Max
0.065
0.073
0.135
0.139
0.077
0.081
0.055
0.063
0.039
0.049
0.154
0.161
1.574 +/- 0.008
0.303
0.318
0.153
0.161
0.084
0.092
0.088
0.096
0.044
0.052
0.010 max
Max
1.65
1.85
3.45
3.55
1.95
2.05
1.40
1.60
1.00
1.25
3.90
4.10
40.0 +/- 0.20
7
.70
8.10
3.90
4.10
2.14
2.34
2.24
2.44
1.12
1.32
0.27 max
30
Revision: April 14, 2011
©2011 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to
www.littelfuse.com/SPA
for current information.
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