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BM-41EG57MD

Description
hi-eff red chips and green chips, the hi-eff red chips are made from GaAsP on GaP substrate, the green chips are made from GaP on GaP substrate.
CategoryLED optoelectronic/LED    photoelectric   
File Size403KB,3 Pages
ManufacturerBRIGHT
Websitehttp://www.brightled.co.kr/
Environmental Compliance
Download Datasheet Parametric View All

BM-41EG57MD Overview

hi-eff red chips and green chips, the hi-eff red chips are made from GaAsP on GaP substrate, the green chips are made from GaP on GaP substrate.

BM-41EG57MD Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerBRIGHT
package instructionROHS COMPLIANT PACKAGE-18
Reach Compliance Codeunknow
Other featuresHIGH RELIABILITY
colorHIGH EFFICIENCY RED/GREEN
ConfigurationCOMMON CATHODE, 1 DIGIT
Display height104.6 mm
Maximum forward current0.03 A
Number of functions1
Maximum operating temperature80 °C
Minimum operating temperature-40 °C
Optoelectronic device typesSMART/NORMAL 5 X 7 DOT MATRIX LED DISPLAY
BRIGHT LED ELECTRONICS CORP.
SINCE 1981
BM-41EG57MD
1.
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5.
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9.
Features :
4.118 inch (104.6mm) matrix height.
Square size 12.0 × 12.0mm.
Low power requirement.
Excellent characters appearance.
Multiplex drive , column anode com.
and row cathode com.
Multi color available.
Categorized for luminous intensity.
Stackable vertically and horizontally.
Solid state reliability.
Package Dimensions :
74.80(2.945)
104.60(4.118)
76.20(3.000)
PIN 1.
12.0x12.0
(.472x.472)
1.
Description :
The BM-41EG57MD is a
104.6mm (4.118")matrix height
5×7 square matrix display.
This product use hi-eff red chips and
green chips, the hi-eff red chips are
made from GaAsP on GaP substrate,
the green chips are made from GaP
on GaP subtrate.
This product have a black face and
white squares.
This product doesn't contain restriction
substance, comply ROHS standard.
12.80(.504)
0.80(.031)
5.08x8=40.64(1.600)
3.00(.118) MIN.
2.
Notes:
1. All dimensions are in millimeters(inches).
2. Tolerance is ±0.25mm(.01")unless otherwise
specified.
3. Specifications are subject to change without
notice.
3.
4.
Internal Circuit Diagram :
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