The 1623 ITU G.695 compliant O-Band DWDM forward path DFB laser
components are designed for both broadcast and narrowcast analog applications.
The highly linear, OC-48 pinout compatible components feature options for up to
14 dBm of minimum optical output power with superior distortion performance
over an enhanced temperature range of -40C to +85C.
Performance Highlights
Parameter
Min
1317.90
1321.10
1322.80
1323.97
1325.30
Wavelength
1326.90
1325.60
Typical
1318.10
1321.30
1323.00
1324.17
1325.50
1327.10
1325.80
1327.25
1329.20
1330.50
-
-
-
-
-
-
-
-
-
-
-
-
Max
1318.30
1321.50
1323.20
1324.37
1325.70
1327.30
1326.00
1327.45
1329.40
1330.70
7.9
8.9
9.9
11.9
12.9
13.9
-
+85
1002
-
-60
-66
Units
Applications
O-Band DWDM Forward Path
Broadcast and Narrowcast Networks
DWDM Cuts New Fiber Costs
High Optical Splits
nm
Features
OC-48 Pinout Compatible
Telcordia
Compliant
Technologies
TM
468
1327.05
1329.00
1330.30
6
8
9
Optical Output Power
10
12
13
14
Temperature Range
Frequency Range
Carrier to Noise Ratio
Composite Second Order (multiple versions)
Composite Triple Beat (multiple versions)
-40
5
51
-
-
Up to 110 Channel Count
Up to 14 dBm
Wide Temperature Range – Stable even
in Harsh Environments
RoHS Compliant
dBm
C
MHz
dB
dBc
dBc
| REV 2012.06
Information contained herein is deemed reliable and accurate as of the issue date. EMCORE reserves the right to change the design or specification at any time without notice.
1623A/B O-Band DWDM DFB Laser Module
DATASHEET | JUNE 2012
FIBER OPTICS
Absolute Maximum Ratings
Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. These are absolute
stress ratings only. Functional operation of the device is not implied at these or any other conditions in excess of those
given in the operational sections of the data sheet. Exposure to absolute maximum ratings for extended periods can
adversely affect device reliability.
Parameter
Operating Temperature Range
Storage Temperature Range
Laser Forward dc Current
Photodiode Reverse Voltage
Laser Reverse Voltage, dc
ESD
TEC Current
Symbol
T
c
T
STG
-
V
RPD
-
-
I
TEC
Condition
Continuous
-
-
-
-
HBM: R = 1500 OHM,
C = 100pF
Continuous
Min
-40
-40
-
-
-
-500
-1.9
Max
+85
85
150
10
1
500
1.9
Unit
°C
°C
mA
V
V
V
A
Electrical/Optical Characteristics
Laser Temperature (TL) = Laser temp set for center WL, IF=IOP, Beginning of Life (BOL)
Parameter
Symbol
Condition
1318.10 nm option
1321.30 nm option
1323.00 nm option
1324.17 nm option
1325.50 nm option
1327.10 nm option
1325.80 nm option
1327.25 nm option
1329.20 nm option
1330.50 nm option
-06 version (4mW)
-08 version (6mW)
-09 version (8mW)
-10 version (10 mW)
-12 version (16 mW)
-13 version (20 mW)
-14 version (25 mW)
-
-
-
I
F
= I
TH
+ 20 and I
TH
+ 60
Varies with power option
V
RM
=5V
T
OP
=25°C
Min
1317.90
1321.10
1322.80
1323.97
1325.30
1326.90
1325.60
1327.05
1329.00
1330.30
6
8
9
10
12
13
14
30
35
-
0.135
-
14
10
9.5
Typ
1318.10
1321.30
1323.00
1324.17
1325.50
1327.10
1325.80
1327.25
1329.20
1330.50
-
-
-
-
-
-
-
-
-
-
-
-
-
-
10
Max
1318.30
1321.50
1323.20
1324.37
1325.70
1327.30
1326.00
1327.45
1329.40
1330.70
7.9
8.9
9.9
11.9
12.9-
13.9
-
-
-
20
-
120
37
200
10.5
Unit
Wavelength
(1)
λ
OPT
nm
Optical Output Power
-
d
Optical Isolation
Side-Mode Suppression Ration
Threshold Current
Slope Efficiency
Operating Current
Laser Temp Range
Monitor PD Responsivity
Thermistor Resistance
ISO
SMSR
I
TH
I
OP
T
L
r
PD
R
TH
dB
dB
mA
mW/mA
mA
°C
μA/mW
KOhm
| REV 2012.06
Information contained herein is deemed reliable and accurate as of the issue date. EMCORE reserves the right to change the design or specification at any time without notice.
1623A/B O-Band DWDM DFB Laser Module
DATASHEET | JUNE 2012
FIBER OPTICS
Electrical/Optical Characteristics
Continued
Parameter
Thermistor Temp. Coefficient
TEC Current
Tracking Error
Fiber Length
Fiber Buffer
Fiber Core/Cladding
Symbol
TC
TH
I
TEC
-
-
-
-
Condition
T
OP
=25°C
-40<T
C
<+85C, I
F
= 100 mA
T
OP
=25
C
May include splice
-
-
Min
-
-1.5
-1
1.0
-
-
Typ
-4.4
-
-
1.5
900
9/125
Max
-
1.6
1
-
-
-
Unit
%/°C
A
dB
M
m
m
(1) Center Wavelength is temperature tuned to be within specs.
In order to prevent reflection-induced distortion, the laser must be connected to an optical cable having a return loff of at
least 55 dB for discrete reflections and 30 dB for distributed reflections.
Outline Drawing (dimensions are in inches & mm)
| REV 2012.06
Information contained herein is deemed reliable and accurate as of the issue date. EMCORE reserves the right to change the design or specification at any time without notice.
1623A/B O-Band DWDM DFB Laser Module
DATASHEET | JUNE 2012
FIBER OPTICS
Electrical Schematics
1
ISOLATOR
10K
ESD
12nH
NC
14
2
(+)
13
3
3.3V
RF CHOKE
22
12
0.01uF
100
LD
(-)
(+)
4
(-)
11
5
(+)
MPD
10
6
(+)
9
CASE
GND
7
(-)
TEC
8
Figure 1. 1623 O-Band DWDM Laser Schematic
Figure 2. 1623 O-Band DWDM Circuit Schematic
Pin Definitions
Pin
1
2
3
4
5
6
7
8
9
10
11
12
13
14
Description
Thermistor
Thermistor
Dc Laser Bias (-)
MPD Anode (-)
MPD Cathode (+)
Thermal Electric Cooler (+)
Thermal Electric Cooler (-)
Case Ground
Case Ground
NC
Laser Common (+)
Laser Modulation (-)
Laser Common (+)
NC
| REV 2012.06
Information contained herein is deemed reliable and accurate as of the issue date. EMCORE reserves the right to change the design or specification at any time without notice.
1623A/B O-Band DWDM DFB Laser Module
DATASHEET | JUNE 2012
FIBER OPTICS
Laser Safety
This product meets the appropriate standard in Title 21 of the Code of Federal Regulations (CFR). FDA/CDRH Class 1 laser
product. This device has been classified with the FDA/CDRH under accession number 0220191.
All Versions of this laser are Class 1 laser product, tested according to IEC 60825-1:2007/EN 60825-1:2007
Single-mode fiber pigtail with SC/APC connectors (standard).
Wavelength = 1.3
m.
Maximum power = 50 mW.
Because of size constraints, laser safety labeling (including an FDA class 1 label) is not affixed to the module, but attached
to the outside of the shipping carton.
Product is not shipped with power supply.
Caution: Use of controls, adjustments and procedures other than those specified herein may result in hazardous
laser radiation exposure.
DANGER
INVISIBLE LASER
RADIATION
AVOID DIRECT EXPOSURE TO BEAM
Wavelength: 1.3
m
Max. Output: 50 mW,
Class 1 Laser Product
DANGER
INVISIBLE LASER RADIATION
IS EMITTED FROM THE END
OF FIBER OR CONNECTOR
Avoid direct exposure to beam
Do not view beam directly with
optical instruments
INVISIBLE LASER RADIATION EMITTED FROM END OF FIBER OR CONNECTOR
Avoid exposure to beam
Class 1 Laser Product IEC-60825-1:20007 Max. Output:50 mw
Wavelength: 1.3
m
| REV 2012.06
Information contained herein is deemed reliable and accurate as of the issue date. EMCORE reserves the right to change the design or specification at any time without notice.
I am going to lay out an 8-layer board recently. Could you please recommend a good book for reference, preferably with more practical examples and more details? Thank you~~...
[Abstract] This paper mainly introduces the design of a radio frequency identification reader/writer module based on Philips' MF RC522: first, the composition of the system and the characteristics of ...
M35SP-7NP, how to use this stepper motor? I tried it for a long time today but it didn't work, just moved a little. It's driven by a microcontroller!...
If a chip on a four-layer board needs to be cooled and there is a heat sink at the bottom, can the ground layer be placed at the bottom middle layer to carry the high current control signal line?...
"Among new energy vehicles, hybrid vehicles will show a large-scale development trend in the short term due to technical and other reasons, and will overshadow electric vehicles, but in the long run, ...
Dual-mode inverters can operate both in conjunction with the grid and independently. These inverters can inject excess energy from renewable energy and storage devices into the grid, and withdraw p...[Details]
The most significant feature of IPS panels is that both electrodes are located on the same surface, unlike other LCD panels, which have electrodes arranged on top and bottom surfaces in a three-dim...[Details]
Recently,
Xpeng Motors and Xinlian Integrated Circuit jointly announced the mass production of China's first hybrid silicon carbide product.
Designed and developed by Xpeng Motors and joint...[Details]
summary
There are multiple approaches to making industrial systems more intelligent, including applying artificial intelligence (AI) technology at the edge and in the cloud to sensor...[Details]
As AI accelerates across industries, the demand for data center infrastructure is also growing rapidly.
Keysight Technologies, in collaboration with Heavy Reading, released the "Beyo...[Details]
1. Multi-channel DAC technology bottleneck
Currently,
the development of multi-channel DAC technology focuses on two core challenges.
First, industrial applications urgently ...[Details]
Reflow soldering is one of the most commonly used methods in electronics manufacturing, allowing for the soldering of large numbers of components in a relatively short time. However, any experience...[Details]
The 2025 China International Automotive Testing Exhibition will be held at the Shanghai World Expo Exhibition and Convention Center from August 27 to 29, 2025.
Clacton Seafront, UK, ...[Details]
On August 22, the Wall Street Journal reported on the 21st local time that the new US government does not plan to acquire equity in semiconductor wafer foundry giant TSMC and Micron, one of the thr...[Details]
Speaking of the problem of vehicle spontaneous combustion, whether it is a pure electric vehicle or a fuel vehicle, there will be incidents of spontaneous combustion. For the same spontaneous combu...[Details]
Renesas Electronics' new ultra-low-power RA4C1 MCU features advanced security and a dedicated peripheral set, making it ideal for metering and other applications.
The new product mee...[Details]
"I want to ask why there are so many manufacturers making mobile phone CPUs, but only Intel and AMD make computer CPUs?"
The progress of domestic PC CPU production has disappointed many ...[Details]
With the prevalence of online conferencing, live streaming, and voice communication in gaming, high-quality audio input devices are becoming increasingly important. To this end, XMOS, an expert in ...[Details]
Since the beginning of the 21st century, with the rapid development of my country's urban and rural economies and the improvement of people's living standards, more and more people have begun to ow...[Details]
Nidec Precision Testing Technology Co., Ltd. will participate in "Testing Expo China—Automotive 2025" to be held at the Shanghai World Expo Exhibition and Convention Center from August 27 (Wednesda...[Details]