|
MBM27C256-45 |
MBM27C256-30 |
| Description |
32KX8 UVPROM, 450ns, CQCC32, METAL SEALED, CERAMIC, LCC-32 |
32KX8 UVPROM, 300ns, CQCC32, METAL SEALED, CERAMIC, LCC-32 |
| Maker |
FUJITSU |
FUJITSU |
| Parts packaging code |
QFJ |
QFJ |
| package instruction |
WQCCN, |
WQCCN, |
| Contacts |
32 |
32 |
| Reach Compliance Code |
unknown |
unknown |
| ECCN code |
EAR99 |
EAR99 |
| Maximum access time |
450 ns |
300 ns |
| JESD-30 code |
R-CQCC-N32 |
R-CQCC-N32 |
| length |
13.97 mm |
13.97 mm |
| memory density |
262144 bit |
262144 bit |
| Memory IC Type |
UVPROM |
UVPROM |
| memory width |
8 |
8 |
| Number of functions |
1 |
1 |
| Number of terminals |
32 |
32 |
| word count |
32768 words |
32768 words |
| character code |
32000 |
32000 |
| Operating mode |
ASYNCHRONOUS |
ASYNCHRONOUS |
| Maximum operating temperature |
70 °C |
70 °C |
| organize |
32KX8 |
32KX8 |
| Output characteristics |
3-STATE |
3-STATE |
| Package body material |
CERAMIC, METAL-SEALED COFIRED |
CERAMIC, METAL-SEALED COFIRED |
| encapsulated code |
WQCCN |
WQCCN |
| Package shape |
RECTANGULAR |
RECTANGULAR |
| Package form |
CHIP CARRIER, WINDOW |
CHIP CARRIER, WINDOW |
| Parallel/Serial |
PARALLEL |
PARALLEL |
| Certification status |
Not Qualified |
Not Qualified |
| Maximum seat height |
3.3 mm |
3.3 mm |
| Maximum supply voltage (Vsup) |
5.5 V |
5.5 V |
| Minimum supply voltage (Vsup) |
4.5 V |
4.5 V |
| Nominal supply voltage (Vsup) |
5 V |
5 V |
| surface mount |
YES |
YES |
| technology |
CMOS |
CMOS |
| Temperature level |
COMMERCIAL |
COMMERCIAL |
| Terminal form |
NO LEAD |
NO LEAD |
| Terminal pitch |
1.27 mm |
1.27 mm |
| Terminal location |
QUAD |
QUAD |
| width |
11.43 mm |
11.43 mm |