MBM27C256-30 datasheet, PDF - EEWORLD Datasheet

MBM27C256-30: Description32KX8 UVPROM, 300ns, CQCC32, METAL SEALED, CERAMIC, LCC-32; Categorystorage storage; File Size76KB，2 Pages; ManufacturerFUJITSU; Websitehttp://edevice.fujitsu.com/fmd/en/index.html

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MBM27C256-30 Overview

32KX8 UVPROM, 300ns, CQCC32, METAL SEALED, CERAMIC, LCC-32

Parameter Name	Attribute value
Maker	FUJITSU
Parts packaging code	QFJ
package instruction	WQCCN,
Contacts	32
Reach Compliance Code	unknown
ECCN code	EAR99
Maximum access time	300 ns
JESD-30 code	R-CQCC-N32
length	13.97 mm
memory density	262144 bit
Memory IC Type	UVPROM
memory width	8
Number of functions	1
Number of terminals	32
word count	32768 words
character code	32000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	32KX8
Output characteristics	3-STATE
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	WQCCN
Package shape	RECTANGULAR
Package form	CHIP CARRIER, WINDOW
Parallel/Serial	PARALLEL
Certification status	Not Qualified
Maximum seat height	3.3 mm
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal form	NO LEAD
Terminal pitch	1.27 mm
Terminal location	QUAD
width	11.43 mm

	MBM27C256-30	MBM27C256-45
Description	32KX8 UVPROM, 300ns, CQCC32, METAL SEALED, CERAMIC, LCC-32	32KX8 UVPROM, 450ns, CQCC32, METAL SEALED, CERAMIC, LCC-32
Maker	FUJITSU	FUJITSU
Parts packaging code	QFJ	QFJ
package instruction	WQCCN,	WQCCN,
Contacts	32	32
Reach Compliance Code	unknown	unknown
ECCN code	EAR99	EAR99
Maximum access time	300 ns	450 ns
JESD-30 code	R-CQCC-N32	R-CQCC-N32
length	13.97 mm	13.97 mm
memory density	262144 bit	262144 bit
Memory IC Type	UVPROM	UVPROM
memory width	8	8
Number of functions	1	1
Number of terminals	32	32
word count	32768 words	32768 words
character code	32000	32000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	70 °C	70 °C
organize	32KX8	32KX8
Output characteristics	3-STATE	3-STATE
Package body material	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED
encapsulated code	WQCCN	WQCCN
Package shape	RECTANGULAR	RECTANGULAR
Package form	CHIP CARRIER, WINDOW	CHIP CARRIER, WINDOW
Parallel/Serial	PARALLEL	PARALLEL
Certification status	Not Qualified	Not Qualified
Maximum seat height	3.3 mm	3.3 mm
Maximum supply voltage (Vsup)	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V
surface mount	YES	YES
technology	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL
Terminal form	NO LEAD	NO LEAD
Terminal pitch	1.27 mm	1.27 mm
Terminal location	QUAD	QUAD
width	11.43 mm	11.43 mm

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