Storage Temperature Range ...............................-55°C to +85°C
Lead Temperature (soldering, 10s) .................................+260°C
Soldering Temperature (reflow) .......................................+260°C
Note 1:
Package thermal resistances were obtained using a two-layer board. For detailed information on package thermal consider-
ations, refer to
www.maxim-ic.com/thermal-tutorial.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
The application for the Pingtou Ge project uses voice recognition, and we have been trying to do voice recognition, but it is still too difficult to try it in an embedded development board.
The ch2601...
[align=center][size=5][b]Programming Pearls[/b][/size][/align] [font=宋体][size=4][color=#111111] This thin book is worthy of the name "Pearls"[/color][/size][/font] [font=宋体][size=4] [color=#111111] Pe...
The first time I read the bitter and helpless post of Brother Anan, I felt Anan's kindness and reminded me of myself. This feeling is a feeling of sadness and regret for not being able to make up one'...
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