Programmable Logic Device, 60ns, PAL-Type, CMOS, CDIP40
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Altera (Intel) |
| package instruction | DIP, DIP40,.6 |
| Reach Compliance Code | compliant |
| ECCN code | 3A001.A.2.C |
| Architecture | PAL-TYPE |
| maximum clock frequency | 16.7 MHz |
| JESD-30 code | R-XDIP-T40 |
| Number of entries | 36 |
| Output times | 24 |
| Number of product terms | 240 |
| Number of terminals | 40 |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| Output function | MACROCELL |
| Package body material | CERAMIC |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP40,.6 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| power supply | 5 V |
| propagation delay | 60 ns |
| Certification status | Not Qualified |
| Nominal supply voltage | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | MILITARY |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| 5962-01-353-3055 | EP910ALC-10 | EP910ALC-12 | EP900DM883B | |
|---|---|---|---|---|
| Description | Programmable Logic Device, 60ns, PAL-Type, CMOS, CDIP40 | Programmable Logic Device, 10ns, PAL-Type, CMOS, PQCC44 | Programmable Logic Device, 12ns, PAL-Type, CMOS, PQCC44 | Programmable Logic Device, 60ns, PAL-Type, CMOS, CDIP40 |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible |
| package instruction | DIP, DIP40,.6 | QCCJ, LDCC44,.7SQ | QCCJ, LDCC44,.7SQ | DIP, DIP40,.6 |
| Reach Compliance Code | compliant | compliant | compliant | unknown |
| Architecture | PAL-TYPE | PAL-TYPE | PAL-TYPE | PAL-TYPE |
| JESD-30 code | R-XDIP-T40 | S-PQCC-J44 | S-PQCC-J44 | R-XDIP-T40 |
| Number of entries | 36 | 36 | 36 | 36 |
| Output times | 24 | 24 | 24 | 24 |
| Number of product terms | 240 | 240 | 240 | 240 |
| Number of terminals | 40 | 44 | 44 | 40 |
| Maximum operating temperature | 125 °C | 70 °C | 70 °C | 125 °C |
| Output function | MACROCELL | MACROCELL | MACROCELL | MACROCELL |
| Package body material | CERAMIC | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC |
| encapsulated code | DIP | QCCJ | QCCJ | DIP |
| Encapsulate equivalent code | DIP40,.6 | LDCC44,.7SQ | LDCC44,.7SQ | DIP40,.6 |
| Package shape | RECTANGULAR | SQUARE | SQUARE | RECTANGULAR |
| Package form | IN-LINE | CHIP CARRIER | CHIP CARRIER | IN-LINE |
| power supply | 5 V | 5 V | 5 V | 5 V |
| propagation delay | 60 ns | 10 ns | 12 ns | 60 ns |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Nominal supply voltage | 5 V | 5 V | 5 V | 5 V |
| surface mount | NO | YES | YES | NO |
| technology | CMOS | CMOS | CMOS | CMOS |
| Temperature level | MILITARY | COMMERCIAL | COMMERCIAL | MILITARY |
| Terminal form | THROUGH-HOLE | J BEND | J BEND | THROUGH-HOLE |
| Terminal pitch | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm |
| Terminal location | DUAL | QUAD | QUAD | DUAL |
| JESD-609 code | - | e0 | e0 | e0 |
| Terminal surface | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
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