Si9925DY
N-channel enhancement mode field-effect transistor
M3D315
Rev. 01 — 20 July 2001
Product data
1. Description
Dual N-channel enhancement mode field-effect transistor in a plastic package using
TrenchMOS™
1
technology.
Product availability:
Si9925DY in SOT96-1 (SO8).
2. Features
s
Low on-state resistance
s
Fast switching
s
TrenchMOS™ technology.
3. Applications
s
s
s
s
s
DC to DC convertors
DC motor control
Lithium-ion battery applications
Notebook PC
Portable equipment applications.
c
c
4. Pinning information
Table 1:
Pin
1
2
3
4
5,6
7,8
Pinning - SOT96-1, simplified outline and symbol
Description
source 1 (s
1
)
8
7
6
5
d1
d2
Simplified outline
Symbol
gate 1 (g
1
)
source 2 (s
2
)
gate 2 (g
2
)
drain 2 (d
2
)
drain 1 (d
1
)
pin 1 index
03ab52
1
2
3
4
03ab58
g1
s1
g2
s2
SOT96-1 (SO8)
1.
TrenchMOS is a trademark of Royal Philips Electronics.
Philips Semiconductors
Si9925DY
N-channel enhancement mode field-effect transistor
5. Quick reference data
Table 2:
V
DS
I
D
P
tot
T
j
R
DSon
Quick reference data
Conditions
T
j
= 25 to 150
°C
T
amb
= 25
°C;
pulsed; t
p
≤
10 s
T
amb
= 25
°C;
pulsed; t
p
≤
10 s
V
GS
= 7.2 V; I
D
= 5 A
V
GS
= 4.5 V; I
D
= 5 A
V
GS
= 3 V; I
D
= 3.9 A
V
GS
= 2.5 V; I
D
= 1 A
Typ
−
−
−
−
38
41
50
62
Max
20
5
2
150
45
50
60
80
Unit
V
A
W
°C
mΩ
mΩ
mΩ
mΩ
drain-source voltage (DC)
drain current (DC)
total power dissipation
junction temperature
drain-source on-state resistance
Symbol Parameter
6. Limiting values
Table 3: Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter
V
DS
V
GS
I
D
I
DM
P
tot
T
stg
T
j
I
S
drain-source voltage (DC)
gate-source voltage (DC)
drain current (DC)
peak drain current
total power dissipation
storage temperature
operating junction temperature
source (diode forward) current (DC) T
amb
= 25
°C
T
amb
= 25
°C;
pulsed; t
p
≤
10 s;
Figure 2
and
3
T
amb
= 70
°C;
pulsed; t
p
≤
10 s;
Figure 2
T
amb
= 25
°C;
pulsed; t
p
≤
10
µs;
Figure 3
T
amb
= 25
°C;
pulsed; t
p
≤
10 s;
Figure 1
T
amb
= 70
°C;
pulsed; t
p
≤
10 s;
Figure 1
Conditions
T
j
= 25 to 150
°C
Min
−
−
−
−
−
−
−
−55
−55
−
Max
20
±12
5
4
48
2
1.3
+150
+150
1.3
Unit
V
V
A
A
A
W
W
°C
°C
A
Source-drain diode
9397 750 08415
© Philips Electronics N.V. 2001. All rights reserved.
Product data
Rev. 01 — 20 July 2001
2 of 13
Philips Semiconductors
Si9925DY
N-channel enhancement mode field-effect transistor
03aa11
03aa19
120
Pder
(%)
100
120
Ider
(%)
100
80
80
60
60
40
40
20
20
0
0
25
50
75
100
125
150
175
o
Tamb ( C)
0
0
25
50
75
100
125
150
175
o
Tamb ( C)
P
tot
P
der
=
----------------------
×
100%
P
°
tot
(
25 C
)
I
D
I
der
=
------------------
×
100%
-
I
°
D
(
25 C
)
Fig 1. Normalized total power dissipation as a
function of mounting base temperature.
Fig 2. Normalized continuous drain current as a
function of mounting base temperature.
102
ID
(A)
10
tp = 10 µs
1 ms
1
10 ms
100 ms
P
03ag07
RDSon = VDS/ ID
δ
=
tp
T
D.C.
10
10 s
tp
T
t
10-2
10-1
1
10
VDS (V)
102
T
amb
= 25
°C;
I
DM
is single pulse.
Fig 3. Safe operating area; continuous and peak drain currents as a function of drain-source voltage.
9397 750 08415
© Philips Electronics N.V. 2001. All rights reserved.
Product data
Rev. 01 — 20 July 2001
3 of 13
Philips Semiconductors
Si9925DY
N-channel enhancement mode field-effect transistor
7. Thermal characteristics
Table 4:
R
th(j-a)
Thermal characteristics
Conditions
mounted on a printed circuit board;
minimum footprint;
Figure 4
Value Unit
62.5
K/W
thermal resistance from junction to ambient
Symbol Parameter
7.1 Transient thermal impedance
102
Zth(j-amb)
δ
= 0.5
(K/W)
0.2
0.1
10
0.05
0.02
03af75
1
P
δ
=
tp
T
single pulse
tp
T
t
10-1
10-4
10-3
10-2
10-1
1
tp (s)
10
T
amb
= 25
°C
Fig 4. Transient thermal impedance from junction to ambient as a function of pulse duration.
9397 750 08415
© Philips Electronics N.V. 2001. All rights reserved.
Product data
Rev. 01 — 20 July 2001
4 of 13
Philips Semiconductors
Si9925DY
N-channel enhancement mode field-effect transistor
8. Characteristics
Table 5: Characteristics
T
j
= 25
°
C unless otherwise specified
Symbol Parameter
Static characteristics
V
GS(th)
I
DSS
I
GSS
R
DSon
gate-source threshold voltage
drain-source leakage current
gate-source leakage current
drain-source on-state resistance
I
D
= 250
µA;
V
DS
= V
GS
;
Figure 9
V
DS
= 16 V; V
GS
= 0 V; T
j
= 25
°C
V
DS
= 10 V; V
GS
= 0 V; T
j
= 70
°C
V
GS
=
±12
V; V
DS
= 0 V
V
GS
= 10 V; I
D
= 10 A;
Figure 7
and
8
V
GS
= 4.5 V; I
D
= 5 A;
Figure 7
and
8
V
GS
= 3 V; I
D
= 3.9 A;
Figure 7
and
8
V
GS
= 2.5 V; I
D
= 1 A;
Figure 7
and
8
Dynamic characteristics
g
fs
Q
g(tot)
Q
gs
Q
gd
t
d(on)
t
r
t
d(off)
t
f
V
SD
t
rr
forward transconductance
total gate charge
gate-source charge
gate-drain (Miller) charge
turn-on delay time
turn-on rise time
turn-off delay time
turn-off fall time
source-drain (diode forward) voltage I
S
= 2.3A; V
GS
= 0 V;
Figure 12
reverse recovery time
I
S
= 5 A; dI
S
/dt =
−100
A/µs; V
GS
= 0 V
V
DD
= 6 V; R
D
= 6
Ω;
V
GS
= 10 V; R
G
= 6
Ω
V
DS
= 15 V; I
D
= 10 A
I
D
= 5 A; V
DS
= 6 V; V
GS
= 4.5 V;
Figure 13
−
−
−
−
−
−
−
−
−
−
14
9
2
2.6
14
13
35
9
0.81
60
−
20
−
−
40
30
60
30
1.2
150
S
nC
nC
nC
ns
ns
ns
ns
V
ns
0.8
−
−
−
25
−
−
−
−
−
−
−
38
41
50
62
−
1
5
100
45
50
60
80
V
µA
µA
nA
mΩ
mΩ
mΩ
mΩ
Conditions
Min
Typ
Max
Unit
Source-drain (reverse) diode
9397 750 08415
© Philips Electronics N.V. 2001. All rights reserved.
Product data
Rev. 01 — 20 July 2001
5 of 13
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