64KX18 CACHE SRAM, 8.5ns, PQCC52, PLASTIC, LCC-52
| Parameter Name | Attribute value |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| Maker | Motorola ( NXP ) |
| Parts packaging code | LCC |
| package instruction | QCCJ, LDCC52,.8SQ |
| Contacts | 52 |
| Reach Compliance Code | unknown |
| ECCN code | 3A991.B.2.A |
| Maximum access time | 8.5 ns |
| Other features | SELF-TIMED WRITE; BURST COUNTER; BYTE WRITE |
| I/O type | COMMON |
| JESD-30 code | S-PQCC-J52 |
| JESD-609 code | e0 |
| length | 19.1262 mm |
| memory density | 1179648 bit |
| Memory IC Type | CACHE SRAM |
| memory width | 18 |
| Number of functions | 1 |
| Number of ports | 1 |
| Number of terminals | 52 |
| word count | 65536 words |
| character code | 64000 |
| Operating mode | SYNCHRONOUS |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 64KX18 |
| Output characteristics | 3-STATE |
| Exportable | YES |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | QCCJ |
| Encapsulate equivalent code | LDCC52,.8SQ |
| Package shape | SQUARE |
| Package form | CHIP CARRIER |
| Parallel/Serial | PARALLEL |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| power supply | 5 V |
| Certification status | Not Qualified |
| Maximum seat height | 4.57 mm |
| Maximum standby current | 0.095 A |
| Minimum standby current | 4.75 V |
| Maximum slew rate | 0.29 mA |
| Maximum supply voltage (Vsup) | 5.25 V |
| Minimum supply voltage (Vsup) | 4.75 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | YES |
| technology | BICMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | J BEND |
| Terminal pitch | 1.27 mm |
| Terminal location | QUAD |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 19.1262 mm |
| MCM67B618AFN8.5 | MCM67B618AZP12 | MCM67B618AZP8.5 | MCM67B618AZP9 | |
|---|---|---|---|---|
| Description | 64KX18 CACHE SRAM, 8.5ns, PQCC52, PLASTIC, LCC-52 | 64KX18 CACHE SRAM, 12ns, PBGA119, 14 X 22 MM, 1.27 MM PITCH, PLASTIC, BGA-119 | 64KX18 CACHE SRAM, 8.5ns, PBGA119, 14 X 22 MM, 1.27 MM PITCH, PLASTIC, BGA-119 | 64KX18 CACHE SRAM, 9ns, PBGA119, 14 X 22 MM, 1.27 MM PITCH, PLASTIC, BGA-119 |
| Is it lead-free? | Contains lead | Contains lead | Contains lead | Contains lead |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible |
| Maker | Motorola ( NXP ) | Motorola ( NXP ) | Motorola ( NXP ) | Motorola ( NXP ) |
| Parts packaging code | LCC | BGA | BGA | BGA |
| package instruction | QCCJ, LDCC52,.8SQ | BGA, BGA119,7X17,50 | BGA, BGA119,7X17,50 | BGA, BGA119,7X17,50 |
| Contacts | 52 | 119 | 119 | 119 |
| Reach Compliance Code | unknown | unknown | unknown | unknown |
| ECCN code | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A |
| Maximum access time | 8.5 ns | 12 ns | 8.5 ns | 9 ns |
| Other features | SELF-TIMED WRITE; BURST COUNTER; BYTE WRITE | SELF-TIMED WRITE; BURST COUNTER; BYTE WRITE | SELF-TIMED WRITE; BURST COUNTER; BYTE WRITE | SELF-TIMED WRITE; BURST COUNTER; BYTE WRITE |
| I/O type | COMMON | COMMON | COMMON | COMMON |
| JESD-30 code | S-PQCC-J52 | R-PBGA-B119 | R-PBGA-B119 | R-PBGA-B119 |
| JESD-609 code | e0 | e0 | e0 | e0 |
| length | 19.1262 mm | 22 mm | 22 mm | 22 mm |
| memory density | 1179648 bit | 1179648 bit | 1179648 bit | 1179648 bit |
| Memory IC Type | CACHE SRAM | CACHE SRAM | CACHE SRAM | CACHE SRAM |
| memory width | 18 | 18 | 18 | 18 |
| Number of functions | 1 | 1 | 1 | 1 |
| Number of ports | 1 | 1 | 1 | 1 |
| Number of terminals | 52 | 119 | 119 | 119 |
| word count | 65536 words | 65536 words | 65536 words | 65536 words |
| character code | 64000 | 64000 | 64000 | 64000 |
| Operating mode | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C |
| organize | 64KX18 | 64KX18 | 64KX18 | 64KX18 |
| Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| Exportable | YES | YES | YES | YES |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | QCCJ | BGA | BGA | BGA |
| Encapsulate equivalent code | LDCC52,.8SQ | BGA119,7X17,50 | BGA119,7X17,50 | BGA119,7X17,50 |
| Package shape | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | CHIP CARRIER | GRID ARRAY | GRID ARRAY | GRID ARRAY |
| Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| power supply | 5 V | 5 V | 5 V | 5 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | 4.57 mm | 2.4 mm | 2.4 mm | 2.4 mm |
| Maximum standby current | 0.095 A | 0.095 A | 0.095 A | 0.095 A |
| Minimum standby current | 4.75 V | 4.75 V | 4.75 V | 4.75 V |
| Maximum slew rate | 0.29 mA | 0.25 mA | 0.29 mA | 0.275 mA |
| Maximum supply voltage (Vsup) | 5.25 V | 5.25 V | 5.25 V | 5.25 V |
| Minimum supply voltage (Vsup) | 4.75 V | 4.75 V | 4.75 V | 4.75 V |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V |
| surface mount | YES | YES | YES | YES |
| technology | BICMOS | BICMOS | BICMOS | BICMOS |
| Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | J BEND | BALL | BALL | BALL |
| Terminal pitch | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| Terminal location | QUAD | BOTTOM | BOTTOM | BOTTOM |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| width | 19.1262 mm | 14 mm | 14 mm | 14 mm |
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