EEWORLDEEWORLDEEWORLD

Part Number

Search

MPC8245LZU300B

Description
RISC Microprocessor, 32-Bit, 300MHz, CMOS, PBGA352, 35 X 35 MM, 1.65 MM HEIGHT, 1.27 MM PITCH, CAVITY-UP, TBGA-352
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size331KB,60 Pages
ManufacturerMotorola ( NXP )
Websitehttps://www.nxp.com
Download Datasheet Parametric Compare View All

MPC8245LZU300B Overview

RISC Microprocessor, 32-Bit, 300MHz, CMOS, PBGA352, 35 X 35 MM, 1.65 MM HEIGHT, 1.27 MM PITCH, CAVITY-UP, TBGA-352

MPC8245LZU300B Parametric

Parameter NameAttribute value
MakerMotorola ( NXP )
package instructionLBGA, BGA352,26X26,50
Reach Compliance Codeunknown
ECCN code3A001.A.3
Other featuresALSO OPERATES AT 2V SUPPLY
Address bus width32
bit size32
boundary scanYES
maximum clock frequency66 MHz
External data bus width32
FormatFLOATING POINT
Integrated cacheYES
JESD-30 codeS-PBGA-B352
length35 mm
low power modeYES
Number of terminals352
Package body materialPLASTIC/EPOXY
encapsulated codeLBGA
Encapsulate equivalent codeBGA352,26X26,50
Package shapeSQUARE
Package formGRID ARRAY, LOW PROFILE
power supply2,3.3 V
Certification statusNot Qualified
Maximum seat height1.65 mm
speed300 MHz
Maximum supply voltage1.9 V
Minimum supply voltage1.7 V
Nominal supply voltage1.8 V
surface mountYES
technologyCMOS
Terminal formBALL
Terminal pitch1.27 mm
Terminal locationBOTTOM
width35 mm
uPs/uCs/peripheral integrated circuit typeMICROPROCESSOR, RISC
Advance Information
MPC8245EC/D
Rev. 2, 10/2002
MPC8245
Integrated Processor
Hardware Specifications
The MPC8245 combines a MPC603e core microprocessor with a PCI bridge. The PCI support
on the MPC8245 will allow system designers to rapidly design systems using peripherals
already designed for PCI and the other standard interfaces. The MPC8245 also integrates a
high-performance memory controller which supports various types of ROM and SDRAM.
The MPC8245 is the second of a family of products that provides system-level support for
industry standard interfaces with a MPC603e processor core.
This document describes pertinent electrical and physical characteristics of the MPC8245. For
functional characteristics of the processor, refer to the
MPC8245 Integrated Processor User’s
Manual
(MPC8245UM/D).
This document contains the following topics:
Topic
Section 1.1, “Overview”
Section 1.2, “Features”
Section 1.3, “General Parameters”
Section 1.4, “Electrical and Thermal Characteristics”
Section 1.5, “Package Description”
Section 1.6, “PLL Configuration”
Section 1.7, “System Design Information”
Section 1.8, “Document Revision History”
Section 1.9, “Ordering Information”
Page
1
3
5
5
31
38
43
55
57
To locate any published errata or updates for this document, refer to the web site at
http://www.motorola.com/semiconductors
1.1
Overview
The MPC8245 integrated processor is comprised of a peripheral logic block and a 32-bit
superscalar MPC603e core, as shown in Figure 1.

MPC8245LZU300B Related Products

MPC8245LZU300B MPC8245LZU350D MPC8245LZU333D MPC8245LZU350B
Description RISC Microprocessor, 32-Bit, 300MHz, CMOS, PBGA352, 35 X 35 MM, 1.65 MM HEIGHT, 1.27 MM PITCH, CAVITY-UP, TBGA-352 RISC Microprocessor, 32-Bit, 350MHz, CMOS, PBGA352, 35 X 35 MM, 1.27 MM PITCH, TBGA-352 RISC Microprocessor, 32-Bit, 333MHz, CMOS, PBGA352, 35 X 35 MM, 1.27 MM PITCH, TBGA-352 RISC Microprocessor, 32-Bit, 350MHz, CMOS, PBGA352, 35 X 35 MM, 1.65 MM HEIGHT, 1.27 MM PITCH, CAVITY-UP, TBGA-352
package instruction LBGA, BGA352,26X26,50 LBGA, BGA352,26X26,50 LBGA, BGA352,26X26,50 35 X 35 MM, 1.65 MM HEIGHT, 1.27 MM PITCH, CAVITY-UP, TBGA-352
Reach Compliance Code unknown unknown unknown unknow
ECCN code 3A001.A.3 3A001.A.3 3A001.A.3 3A001.A.3
Address bus width 32 32 32 32
bit size 32 32 32 32
boundary scan YES YES YES YES
maximum clock frequency 66 MHz 66 MHz 66 MHz 66 MHz
External data bus width 32 32 32 32
Format FLOATING POINT FLOATING POINT FLOATING POINT FLOATING POINT
Integrated cache YES YES YES YES
JESD-30 code S-PBGA-B352 S-PBGA-B352 S-PBGA-B352 S-PBGA-B352
length 35 mm 35 mm 35 mm 35 mm
low power mode YES NO NO YES
Number of terminals 352 352 352 352
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code LBGA LBGA LBGA LBGA
Package shape SQUARE SQUARE SQUARE SQUARE
Package form GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Certification status Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 1.65 mm 1.65 mm 1.65 mm 1.65 mm
speed 300 MHz 350 MHz 333 MHz 350 MHz
Maximum supply voltage 1.9 V 2.1 V 2.1 V 2.1 V
Minimum supply voltage 1.7 V 1.9 V 1.9 V 1.9 V
Nominal supply voltage 1.8 V 2 V 2 V 2 V
surface mount YES YES YES YES
technology CMOS CMOS CMOS CMOS
Terminal form BALL BALL BALL BALL
Terminal pitch 1.27 mm 1.27 mm 1.27 mm 1.27 mm
Terminal location BOTTOM BOTTOM BOTTOM BOTTOM
width 35 mm 35 mm 35 mm 35 mm
uPs/uCs/peripheral integrated circuit type MICROPROCESSOR, RISC MICROPROCESSOR, RISC MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Encapsulate equivalent code BGA352,26X26,50 BGA352,26X26,50 BGA352,26X26,50 -
power supply 2,3.3 V 2,3.3 V 2,3.3 V -
STM32F205xx Developer
I want to switch from a PIC microcontroller to this model, but I don't know which developer to use? Looking at the datasheet of this chip, it mentions debug modes: Serial wire debug (SWD), JTAG, and C...
bgcanada stm32/stm8
OnEraseBkgnd memory leak
I created a dialog program for PPT2003 using VS2005 and used the wizard to add a WM_ERASEBKGND mapping. After running, there is an 80-byte memory leak every time it is redrawn. Until the computer cras...
战国吴起 Embedded System
Microwave radar monitors the whole family's electrocardiogram
Panasonic and Kyoto University cooperate[img]http://image.itmedia.co.jp/mn/articles/1601/29/sp_160129panasonic_01.jpg[/img] Panasonic is responsible for the microwave part and Kyoto University is resp...
5525 Medical Electronics
After work, I will play with microcontroller embedded systems as a hobby
After graduating from university, I did not engage in hardware development, but cultivated MCU embedded system as a hobby. I wonder if there are any friends like me? :victory: I studied electronic inf...
ruijixiang Talking
I would like to ask an expert, since wince5.0 does not use EBOOT and NBOOT, how can I implement partitioning in the flash driver?
I use UBOOT to boot in advance, so if I want to implement nand flash partition, can I implement the partition in the flash driver? If so, how can I do it and which functions should I change? Please gi...
milanmaldini Embedded System
Motorola Electronic Design Competition Outstanding Works (VIII)
[i=s]This post was last edited by paulhyde on 2014-9-15 08:54[/i]...
clark Electronics Design Contest

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 2491  1162  512  1917  240  51  24  11  39  5 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号