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MPC8245LZU350B

Description
RISC Microprocessor, 32-Bit, 350MHz, CMOS, PBGA352, 35 X 35 MM, 1.65 MM HEIGHT, 1.27 MM PITCH, CAVITY-UP, TBGA-352
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size331KB,60 Pages
ManufacturerMotorola ( NXP )
Websitehttps://www.nxp.com
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MPC8245LZU350B Overview

RISC Microprocessor, 32-Bit, 350MHz, CMOS, PBGA352, 35 X 35 MM, 1.65 MM HEIGHT, 1.27 MM PITCH, CAVITY-UP, TBGA-352

MPC8245LZU350B Parametric

Parameter NameAttribute value
MakerMotorola ( NXP )
package instruction35 X 35 MM, 1.65 MM HEIGHT, 1.27 MM PITCH, CAVITY-UP, TBGA-352
Reach Compliance Codeunknow
ECCN code3A001.A.3
Address bus width32
bit size32
boundary scanYES
maximum clock frequency66 MHz
External data bus width32
FormatFLOATING POINT
Integrated cacheYES
JESD-30 codeS-PBGA-B352
length35 mm
low power modeYES
Number of terminals352
Package body materialPLASTIC/EPOXY
encapsulated codeLBGA
Package shapeSQUARE
Package formGRID ARRAY, LOW PROFILE
Certification statusNot Qualified
Maximum seat height1.65 mm
speed350 MHz
Maximum supply voltage2.1 V
Minimum supply voltage1.9 V
Nominal supply voltage2 V
surface mountYES
technologyCMOS
Terminal formBALL
Terminal pitch1.27 mm
Terminal locationBOTTOM
width35 mm
uPs/uCs/peripheral integrated circuit typeMICROPROCESSOR, RISC
Advance Information
MPC8245EC/D
Rev. 2, 10/2002
MPC8245
Integrated Processor
Hardware Specifications
The MPC8245 combines a MPC603e core microprocessor with a PCI bridge. The PCI support
on the MPC8245 will allow system designers to rapidly design systems using peripherals
already designed for PCI and the other standard interfaces. The MPC8245 also integrates a
high-performance memory controller which supports various types of ROM and SDRAM.
The MPC8245 is the second of a family of products that provides system-level support for
industry standard interfaces with a MPC603e processor core.
This document describes pertinent electrical and physical characteristics of the MPC8245. For
functional characteristics of the processor, refer to the
MPC8245 Integrated Processor User’s
Manual
(MPC8245UM/D).
This document contains the following topics:
Topic
Section 1.1, “Overview”
Section 1.2, “Features”
Section 1.3, “General Parameters”
Section 1.4, “Electrical and Thermal Characteristics”
Section 1.5, “Package Description”
Section 1.6, “PLL Configuration”
Section 1.7, “System Design Information”
Section 1.8, “Document Revision History”
Section 1.9, “Ordering Information”
Page
1
3
5
5
31
38
43
55
57
To locate any published errata or updates for this document, refer to the web site at
http://www.motorola.com/semiconductors
1.1
Overview
The MPC8245 integrated processor is comprised of a peripheral logic block and a 32-bit
superscalar MPC603e core, as shown in Figure 1.

MPC8245LZU350B Related Products

MPC8245LZU350B MPC8245LZU350D MPC8245LZU333D MPC8245LZU300B
Description RISC Microprocessor, 32-Bit, 350MHz, CMOS, PBGA352, 35 X 35 MM, 1.65 MM HEIGHT, 1.27 MM PITCH, CAVITY-UP, TBGA-352 RISC Microprocessor, 32-Bit, 350MHz, CMOS, PBGA352, 35 X 35 MM, 1.27 MM PITCH, TBGA-352 RISC Microprocessor, 32-Bit, 333MHz, CMOS, PBGA352, 35 X 35 MM, 1.27 MM PITCH, TBGA-352 RISC Microprocessor, 32-Bit, 300MHz, CMOS, PBGA352, 35 X 35 MM, 1.65 MM HEIGHT, 1.27 MM PITCH, CAVITY-UP, TBGA-352
package instruction 35 X 35 MM, 1.65 MM HEIGHT, 1.27 MM PITCH, CAVITY-UP, TBGA-352 LBGA, BGA352,26X26,50 LBGA, BGA352,26X26,50 LBGA, BGA352,26X26,50
Reach Compliance Code unknow unknown unknown unknown
ECCN code 3A001.A.3 3A001.A.3 3A001.A.3 3A001.A.3
Address bus width 32 32 32 32
bit size 32 32 32 32
boundary scan YES YES YES YES
maximum clock frequency 66 MHz 66 MHz 66 MHz 66 MHz
External data bus width 32 32 32 32
Format FLOATING POINT FLOATING POINT FLOATING POINT FLOATING POINT
Integrated cache YES YES YES YES
JESD-30 code S-PBGA-B352 S-PBGA-B352 S-PBGA-B352 S-PBGA-B352
length 35 mm 35 mm 35 mm 35 mm
low power mode YES NO NO YES
Number of terminals 352 352 352 352
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code LBGA LBGA LBGA LBGA
Package shape SQUARE SQUARE SQUARE SQUARE
Package form GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Certification status Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 1.65 mm 1.65 mm 1.65 mm 1.65 mm
speed 350 MHz 350 MHz 333 MHz 300 MHz
Maximum supply voltage 2.1 V 2.1 V 2.1 V 1.9 V
Minimum supply voltage 1.9 V 1.9 V 1.9 V 1.7 V
Nominal supply voltage 2 V 2 V 2 V 1.8 V
surface mount YES YES YES YES
technology CMOS CMOS CMOS CMOS
Terminal form BALL BALL BALL BALL
Terminal pitch 1.27 mm 1.27 mm 1.27 mm 1.27 mm
Terminal location BOTTOM BOTTOM BOTTOM BOTTOM
width 35 mm 35 mm 35 mm 35 mm
uPs/uCs/peripheral integrated circuit type MICROPROCESSOR, RISC MICROPROCESSOR, RISC MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Encapsulate equivalent code - BGA352,26X26,50 BGA352,26X26,50 BGA352,26X26,50
power supply - 2,3.3 V 2,3.3 V 2,3.3 V
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